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Difference between revisions of "amd/ryzen 3/pro 2300u"
< amd‎ | ryzen 3

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|thread count=4
 
|thread count=4
 
|max cpus=1
 
|max cpus=1
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|max memory=32 GiB
 
|tdp=15 W
 
|tdp=15 W
 
|ctdp down=12 W
 
|ctdp down=12 W
 
|ctdp up=25 W
 
|ctdp up=25 W
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|package module 1={{packages/amd/socket fp5}}
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'''Ryzen 3 PRO 2300U''' is a {{arch|64}} [[quad-core]] mid-range performance [[x86]] mobile microprocessor introduced by [[AMD]] in early [[2018]]. This processor is based on AMD's {{amd|Zen|Zen microarchitecture|l=arch}} and is fabricated on a [[14 nm process]]. The PRO 2300U operates at a base frequency of 2 GHz with a [[TDP]] of 15 W and a {{amd|Precision Boost|Boost}} frequency of 3.4 GHz. This MPU supports up to ? GiB of dual-channel DDR4-2400 memory and incorporates {{amd|Radeon Vega 6}} Graphics operating at up to 1.1 GHz.
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'''Ryzen 3 PRO 2300U''' is a {{arch|64}} [[quad-core]] mid-range performance [[x86]] workstation mobile microprocessor introduced by [[AMD]] in early [[2018]]. This processor is based on AMD's {{amd|Zen|Zen microarchitecture|l=arch}} and is fabricated on a [[14 nm process]]. The PRO 2300U operates at a base frequency of 2 GHz with a [[TDP]] of 15 W and a {{amd|Precision Boost|Boost}} frequency of 3.4 GHz. This MPU supports up to 32 GiB of dual-channel DDR4-2400 memory and incorporates {{amd|Radeon Vega 6}} Graphics operating at up to 1.1 GHz.
  
 
This model supports a configurable TDP-down of 12 W and TDP-up of 25 W.
 
This model supports a configurable TDP-down of 12 W and TDP-up of 25 W.
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{{memory controller
 
{{memory controller
 
|type=DDR4-2400
 
|type=DDR4-2400
−
|max mem=? GiB
+
|ecc=Yes
 +
|max mem=32 GiB
 
|controllers=2
 
|controllers=2
 
|channels=2
 
|channels=2
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== Expansions ==
 
== Expansions ==
 +
This processor has 12 PCIe lanes, 1x8 typically designated for a [[GPU]] and 4 additional lanes for storage (e.g., NVMe).
 
{{expansions main
 
{{expansions main
 
|
 
|
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|type=PCIe
 
|type=PCIe
 
|pcie revision=3.0
 
|pcie revision=3.0
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|pcie lanes=?
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|pcie lanes=12
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|pcie config=x?
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|pcie config=1x8+1x4
 +
|pcie config 2=2x4+1x4
 
}}
 
}}
 
}}
 
}}
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|amdv=Yes
 
|amdv=Yes
 
|amdsme=No
 
|amdsme=No
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|amdtsme=No
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|amdtsme=Yes
 
|amdsev=No
 
|amdsev=No
 
|rvi=No
 
|rvi=No

Latest revision as of 12:06, 18 March 2023

Edit Values
Ryzen 3 PRO 2300U
General Info
DesignerAMD
ManufacturerGlobalFoundries
Model NumberPRO 2300U
MarketMobile
IntroductionJanuary 8, 2018 (announced)
January 8, 2018 (launched)
ShopAmazon
General Specs
FamilyRyzen 3
Series2000U
LockedYes
Frequency2,000 MHz
Turbo Frequency3,400 MHz (1 core)
Clock multiplier20
Microarchitecture
ISAx86-64 (x86)
MicroarchitectureZen
ChipsetPromontory
Core NameRaven Ridge
Core Family23
Core Model1
Process14 nm
Transistors4,950,000,000
TechnologyCMOS
Die209.78 mm²
Word Size64 bit
Cores4
Threads4
Max Memory32 GiB
Multiprocessing
Max SMP1-Way (Uniprocessor)
Electrical
TDP15 W
cTDP down12 W
cTDP up25 W
Packaging
PackageFP5
Package TypeOrganic Micro Ball Grid Array
Dimension35 mm × 25 mm
Pitch0.7 mm
Contacts1140

Ryzen 3 PRO 2300U is a 64-bit quad-core mid-range performance x86 workstation mobile microprocessor introduced by AMD in early 2018. This processor is based on AMD's Zen microarchitecture and is fabricated on a 14 nm process. The PRO 2300U operates at a base frequency of 2 GHz with a TDP of 15 W and a Boost frequency of 3.4 GHz. This MPU supports up to 32 GiB of dual-channel DDR4-2400 memory and incorporates Radeon Vega 6 Graphics operating at up to 1.1 GHz.

This model supports a configurable TDP-down of 12 W and TDP-up of 25 W.

Cache[edit]

Main article: Zen § Cache

[Edit/Modify Cache Info]

hierarchy icon.svg
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.
L1$384 KiB
393,216 B
0.375 MiB
L1I$256 KiB
262,144 B
0.25 MiB
4x64 KiB4-way set associative 
L1D$128 KiB
131,072 B
0.125 MiB
4x32 KiB8-way set associativewrite-back
L2$2 MiB
2,048 KiB
2,097,152 B
0.00195 GiB
  4x512 KiB8-way set associativewrite-back
L3$4 MiB
4,096 KiB
4,194,304 B
0.00391 GiB
  1x4 MiB  

Memory controller[edit]

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeDDR4-2400
Supports ECCYes
Max Mem32 GiB
Controllers2
Channels2
Max Bandwidth35.76 GiB/s
36,618.24 MiB/s
38.397 GB/s
38,397.008 MB/s
0.0349 TiB/s
0.0384 TB/s
Bandwidth
Single 17.88 GiB/s
Double 35.76 GiB/s

Expansions[edit]

This processor has 12 PCIe lanes, 1x8 typically designated for a GPU and 4 additional lanes for storage (e.g., NVMe).

[Edit/Modify Expansions Info]

ide icon.svg
Expansion Options
PCIeRevision: 3.0
Max Lanes: 12
Configuration: 1x8+1x4, 2x4+1x4


Graphics[edit]

[Edit/Modify IGP Info]

screen icon.svg
Integrated Graphics Information
GPURadeon Vega 6
DesignerAMD
Execution Units6
Unified Shaders384
Burst Frequency1,100 MHz
1.1 GHz
1,100,000 KHz
OutputDP, HDMI
Standards
DirectX12
OpenGL4.6
OpenCL2.2

Features[edit]

[Edit/Modify Supported Features]

Cog-icon-grey.svg
Supported x86 Extensions & Processor Features
MMXMMX Extension
EMMXExtended MMX Extension
SSEStreaming SIMD Extensions
SSE2Streaming SIMD Extensions 2
SSE3Streaming SIMD Extensions 3
SSSE3Supplemental SSE3
SSE4.1Streaming SIMD Extensions 4.1
SSE4.2Streaming SIMD Extensions 4.2
SSE4aStreaming SIMD Extensions 4a
AVXAdvanced Vector Extensions
AVX2Advanced Vector Extensions 2
ABMAdvanced Bit Manipulation
BMI1Bit Manipulation Instruction Set 1
BMI2Bit Manipulation Instruction Set 2
FMA33-Operand Fused-Multiply-Add
AESAES Encryption Instructions
RdRandHardware RNG
SHASHA Extensions
ADXMulti-Precision Add-Carry
CLMULCarry-less Multiplication Extension
F16C16-bit Floating Point Conversion
x86-1616-bit x86
x86-3232-bit x86
x86-6464-bit x86
RealReal Mode
ProtectedProtected Mode
SMMSystem Management Mode
FPUIntegrated x87 FPU
NXNo-eXecute
AMD-ViAMD-Vi (I/O MMU virtualization)
AMD-VAMD Virtualization
TSMETransparent SME
SenseMISenseMI Technology
mXFRMobile XFR
Boost 2Precision Boost 2

Die Shot[edit]

Further information: Zen § Die Shot


raven ridge die.png


raven ridge die (annotated).png
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Facts about "Ryzen 3 PRO 2300U - AMD"
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Has subobject
"Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki.
Ryzen 3 PRO 2300U - AMD#pcie +
base frequency2,000 MHz (2 GHz, 2,000,000 kHz) +
chipsetPromontory +
clock multiplier20 +
core count4 +
core family23 +
core model1 +
core nameRaven Ridge +
designerAMD +
die area209.78 mm² (0.325 in², 2.098 cm², 209,780,000 µm²) +
familyRyzen 3 +
first announcedJanuary 8, 2018 +
first launchedJanuary 8, 2018 +
full page nameamd/ryzen 3/pro 2300u +
has advanced vector extensionstrue +
has advanced vector extensions 2true +
has amd amd-v technologytrue +
has amd amd-vi technologytrue +
has amd mobile extended frequency rangetrue +
has amd precision boost 2true +
has amd sensemi technologytrue +
has amd transparent secure memory encryption technologytrue +
has ecc memory supportfalse +
has featureAdvanced Vector Extensions +, Advanced Vector Extensions 2 +, Advanced Encryption Standard Instruction Set Extension +, SenseMI Technology +, Mobile Extended Frequency Range + and Precision Boost 2 +
has locked clock multipliertrue +
has x86 advanced encryption standard instruction set extensiontrue +
instance ofmicroprocessor +
integrated gpuRadeon Vega 6 +
integrated gpu designerAMD +
integrated gpu execution units6 +
integrated gpu max frequency1,100 MHz (1.1 GHz, 1,100,000 KHz) +
isax86-64 +
isa familyx86 +
l1$ size384 KiB (393,216 B, 0.375 MiB) +
l1d$ description8-way set associative +
l1d$ size128 KiB (131,072 B, 0.125 MiB) +
l1i$ description4-way set associative +
l1i$ size256 KiB (262,144 B, 0.25 MiB) +
l2$ description8-way set associative +
l2$ size2 MiB (2,048 KiB, 2,097,152 B, 0.00195 GiB) +
l3$ size4 MiB (4,096 KiB, 4,194,304 B, 0.00391 GiB) +
ldateJanuary 8, 2018 +
manufacturerGlobalFoundries +
market segmentMobile +
max cpu count1 +
max memory bandwidth35.76 GiB/s (36,618.24 MiB/s, 38.397 GB/s, 38,397.008 MB/s, 0.0349 TiB/s, 0.0384 TB/s) +
max memory channels2 +
microarchitectureZen +
model numberPRO 2300U +
nameRyzen 3 PRO 2300U +
process14 nm (0.014 μm, 1.4e-5 mm) +
series2000U +
smp max ways1 +
supported memory typeDDR4-2400 +
tdp15 W (15,000 mW, 0.0201 hp, 0.015 kW) +
tdp down12 W (12,000 mW, 0.0161 hp, 0.012 kW) +
tdp up25 W (25,000 mW, 0.0335 hp, 0.025 kW) +
technologyCMOS +
thread count4 +
transistor count4,950,000,000 +
turbo frequency (1 core)3,400 MHz (3.4 GHz, 3,400,000 kHz) +
word size64 bit (8 octets, 16 nibbles) +