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Display titleXeon E3-1501M v6 - Intel
Default sort keyXeon E3-1501M v6, Intel
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Page ID18591
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Page creatorAt32Hz (talk | contribs)
Date of page creation17:47, 17 June 2017
Latest editorDavid (talk | contribs)
Date of latest edit12:42, 8 April 2018
Total number of edits14
Total number of distinct authors6
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Retrieved from "https://en.wikichip.org/wiki/intel/xeon_e3/e3-1501m_v6"
Facts about "Xeon E3-1501M v6 - Intel"
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Xeon E3-1501M v6 - Intel#package + and Xeon E3-1501M v6 - Intel#io +
base frequency2,900 MHz (2.9 GHz, 2,900,000 kHz) +
bus rate8,000 MT/s (8 GT/s, 8,000,000 kT/s) +
bus typeDMI 3.0 +
chipsetSunrise Point +
clock multiplier29 +
core count4 +
core family6 +
core model158 +
core nameKaby Lake H +
core steppingB0 +
core voltage (max)1.52 V (15.2 dV, 152 cV, 1,520 mV) +
core voltage (min)0.55 V (5.5 dV, 55 cV, 550 mV) +
designerIntel +
device id0x591D +
familyXeon E3 +
first announcedJune 12, 2017 +
first launchedJune 12, 2017 +
full page nameintel/xeon e3/e3-1501m v6 +
has advanced vector extensionstrue +
has advanced vector extensions 2true +
has ecc memory supporttrue +
has extended page tables supporttrue +
has featureAdvanced Vector Extensions +, Advanced Vector Extensions 2 +, Advanced Encryption Standard Instruction Set Extension +, Turbo Boost Technology 2.0 +, Enhanced SpeedStep Technology +, Speed Shift Technology +, Trusted Execution Technology +, Intel vPro Technology +, Intel VT-x +, Intel VT-d +, Extended Page Tables +, Transactional Synchronization Extensions +, Memory Protection Extensions +, Software Guard Extensions +, Secure Key Technology +, OS Guard +, Flex Memory Access +, Smart Response Technology +, My WiFi Technology + and Identity Protection Technology +
has intel enhanced speedstep technologytrue +
has intel flex memory access supporttrue +
has intel identity protection technology supporttrue +
has intel my wifi technology supporttrue +
has intel secure key technologytrue +
has intel smart response technology supporttrue +
has intel speed shift technologytrue +
has intel supervisor mode execution protectiontrue +
has intel trusted execution technologytrue +
has intel turbo boost technology 2 0true +
has intel vpro technologytrue +
has intel vt-d technologytrue +
has intel vt-x technologytrue +
has locked clock multipliertrue +
has second level address translation supporttrue +
has transactional synchronization extensionstrue +
has x86 advanced encryption standard instruction set extensiontrue +
instance ofmicroprocessor +
integrated gpuHD Graphics P630 +
integrated gpu base frequency350 MHz (0.35 GHz, 350,000 KHz) +
integrated gpu designerIntel +
integrated gpu execution units24 +
integrated gpu max frequency1,000 MHz (1 GHz, 1,000,000 KHz) +
integrated gpu max memory1,740.8 MiB (1,782,579.2 KiB, 1,825,361,100.8 B, 1.7 GiB) +
isax86-64 +
isa familyx86 +
l1$ size256 KiB (262,144 B, 0.25 MiB) +
l1d$ description8-way set associative +
l1d$ size128 KiB (131,072 B, 0.125 MiB) +
l1i$ description8-way set associative +
l1i$ size128 KiB (131,072 B, 0.125 MiB) +
l2$ description4-way set associative +
l2$ size1 MiB (1,024 KiB, 1,048,576 B, 9.765625e-4 GiB) +
l3$ description12-way set associative +
l3$ size6 MiB (6,144 KiB, 6,291,456 B, 0.00586 GiB) +
ldateJune 12, 2017 +
main imageFile:kaby lake h (front).png +
main image captionpackage, front +
manufacturerIntel +
market segmentWorkstation + and Mobile +
max cpu count1 +
max junction temperature373.15 K (100 °C, 212 °F, 671.67 °R) +
max memory65,536 MiB (67,108,864 KiB, 68,719,476,736 B, 64 GiB, 0.0625 TiB) +
max memory bandwidth35.76 GiB/s (36,618.24 MiB/s, 38.397 GB/s, 38,397.008 MB/s, 0.0349 TiB/s, 0.0384 TB/s) +
max memory channels2 +
max pcie lanes16 +
max storage temperature398.15 K (125 °C, 257 °F, 716.67 °R) +
microarchitectureKaby Lake +
min junction temperature273.15 K (0 °C, 32 °F, 491.67 °R) +
min storage temperature248.15 K (-25 °C, -13 °F, 446.67 °R) +
model numberE3-1501M v6 +
nameXeon E3-1501M v6 +
packageFCBGA-1440 +
platformKaby Lake +
process14 nm (0.014 μm, 1.4e-5 mm) +
s-specSR3FO +
seriesE3-1500 +
smp max ways1 +
supported memory typeDDR4-2400 +
tdp45 W (45,000 mW, 0.0603 hp, 0.045 kW) +
tdp down35 W (35,000 mW, 0.0469 hp, 0.035 kW) +
technologyCMOS +
thread count4 +
turbo frequency (1 core)3,600 MHz (3.6 GHz, 3,600,000 kHz) +
turbo frequency (2 cores)3,500 MHz (3.5 GHz, 3,500,000 kHz) +
turbo frequency (3 cores)3,400 MHz (3.4 GHz, 3,400,000 kHz) +
turbo frequency (4 cores)3,300 MHz (3.3 GHz, 3,300,000 kHz) +
word size64 bit (8 octets, 16 nibbles) +
x86/has memory protection extensionstrue +
x86/has software guard extensionstrue +