Editing ibm/power/02cy230

{{ibm title|POWER9 02CY230}}
{{chip}}
'''POWER9 02CY230''' is a [[22-core]] [[POWER]] server and workstation microprocessor designed by [[IBM]] and introduced in late [[2017]]. This chip is based on the {{ibm|POWER9|l=arch}} microarchitecture and is fabricated on GlobalFoundries [[14 nm process|14nm SOI Process]]. The 02CY230 has a base frequency of 2.90 GHz with a bost frequency of 3.80 GHz and a TDP of 190 W.
Has subobject "Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki.	POWER9 02CY230 - IBM#pcie +
base frequency	2,900 MHz (2.9 GHz, 2,900,000 kHz) +
core count	16 +
core name	Sforza +
designer	IBM +
die area	693.37 mm² (1.075 in², 6.934 cm², 693,370,000 µm²) +
die length	25.228 mm (2.523 cm, 0.993 in, 25,228 µm) +
die width	27.484 mm (2.748 cm, 1.082 in, 27,484.16 µm) +
family	POWER +
first announced	November 2017 +
first launched	November 2017 +
full page name	ibm/power/02cy230 +
has ecc memory support	false +
instance of	microprocessor +
isa	Power ISA v3.0B +
isa family	Power ISA +
l1$ size	1,024 KiB (1,048,576 B, 1 MiB) +
l1d$ description	8-way set associative +
l1d$ size	512 KiB (524,288 B, 0.5 MiB) +
l1i$ description	8-way set associative +
l1i$ size	512 KiB (524,288 B, 0.5 MiB) +
l2$ description	8-way set associative +
l2$ size	4 MiB (4,096 KiB, 4,194,304 B, 0.00391 GiB) +
l3$ description	20-way set associative +
l3$ size	80 MiB (81,920 KiB, 83,886,080 B, 0.0781 GiB) +
ldate	November 2017 +
manufacturer	GlobalFoundries +
market segment	Server + and Workstation +
max cpu count	2 +
max junction temperature	358.15 K (85 °C, 185 °F, 644.67 °R) +
max memory	2,097,152 MiB (2,147,483,648 KiB, 2,199,023,255,552 B, 2,048 GiB, 2 TiB) +
max memory bandwidth	158.95 GiB/s (162,764.8 MiB/s, 170.671 GB/s, 170,671.263 MB/s, 0.155 TiB/s, 0.171 TB/s) +
max memory channels	8 +
microarchitecture	POWER9 +
min junction temperature	273.15 K (0 °C, 32 °F, 491.67 °R) +
model number	02CY230 +
name	02CY230 +
package	FCLGA-2601 +
part number	02CY230 +
process	14 nm (0.014 μm, 1.4e-5 mm) +
series	POWER9 +
smp max ways	2 +
supported memory type	DDR4-2666 +
tdp	190 W (190,000 mW, 0.255 hp, 0.19 kW) +
technology	CMOS +
thread count	64 +
transistor count	8,000,000,000 +
turbo frequency	3,800 MHz (3.8 GHz, 3,800,000 kHz) +
word size	64 bit (8 octets, 16 nibbles) +