-
WikiChip
WikiChip
-
Architectures
Popular x86
-
Intel
- Client
- Server
- Big Cores
- Small Cores
-
AMD
Popular ARM
-
ARM
- Server
- Big
- Little
-
Cavium
-
Samsung
-
-
Chips
Popular Families
-
Ampere
-
Apple
-
Cavium
-
HiSilicon
-
MediaTek
-
NXP
-
Qualcomm
-
Renesas
-
Samsung
-
From WikiChip
Editing amd/packages/socket sp3
Warning: You are editing an out-of-date revision of this page. If you save it, any changes made since this revision will be lost.
Warning: You are not logged in. Your IP address will be publicly visible if you make any edits. If you log in or create an account, your edits will be attributed to your username, along with other benefits.
This page supports semantic in-text annotations (e.g. "[[Is specified as::World Heritage Site]]") to build structured and queryable content provided by Semantic MediaWiki. For a comprehensive description on how to use annotations or the #ask parser function, please have a look at the getting started, in-text annotation, or inline queries help pages.
Retrieved from "https://en.wikichip.org/wiki/amd/packages/socket_sp3"
Facts about "Socket SP3 - Packages - AMD"
designer | AMD + |
first announced | May 16, 2017 + |
first launched | June 20, 2017 + |
instance of | package + |
market segment | Server + |
microarchitecture | Zen +, Zen 2 + and Zen 3 + |
name | Socket SP3 + |
package | SP3 + and FCLGA-4094 + |
package contacts | 4,094 + |
package height | 6.26 mm (0.246 in) + |
package length | 75.4 mm (7.54 cm, 2.969 in) + |
package pitch | 0.87 mm (0.0343 in) + and 1 mm (0.0394 in) + |
package type | FC-OLGA + |
package width | 58.5 mm (5.85 cm, 2.303 in) + |
socket | SP3 + and LGA-4094 + |
tdp | 120 W (120,000 mW, 0.161 hp, 0.12 kW) +, 155 W (155,000 mW, 0.208 hp, 0.155 kW) + and 180 W (180,000 mW, 0.241 hp, 0.18 kW) + |