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MediaTek Helio X30 |
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Designer | MediaTek, ARM Holdings |
Manufacturer | TSMC |
Model Number | Helio X30 |
Part Number | MT6799 |
Market | Mobile, Embedded |
Introduction | September 26, 2016 (announced) February 27, 2017 (launched) |
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Family | Helio |
Series | Helio X |
Frequency | 2,500 MHz, 2,200 MHz, 1,900 MHz |
Bus type | AMBA 4 AXI |
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ISA | ARMv8 (ARM) |
Microarchitecture | Cortex-A53, Cortex-A73, Cortex-A35 |
Core Name | Cortex-A35, Cortex-A53, Cortex-A73 |
Process | 10 nm |
Technology | CMOS |
Word Size | 64 bit |
Cores | 10 |
Threads | 10 |
Max Memory | 8 GiB |
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Max SMP | 1-Way (Uniprocessor) |
Helio X30 (MT6799) is a 64-bit deca-core ARM LTE system on a chip designed by MediaTek and launched in early 2017. This SoC incorporates 3 independent clusters of cores (called "Tri-Cluster" by MediaTek) operating at varying degrees of performance designed for certain workloads (operating at 1.9 GHz, 2.2 GHz, and 2.5 GHz) and supports up to 8 GiB of quad-channel LPDDR4X-3732 memory. This SoC also incorporates a PowerVR GT7400 Plus IGP operating at 800 MHz. The chip has a modem supporting LTE User Equipment (UE) category 10.
Architecture[edit]
The Helio X30 is designed is composed of 3 individual clusters of CPU cores depending on the level of performance required by the active applications.
The three clusters are designed as a modified big.LITTLE configuration.
- Main articles: Cortex-A53 § Cache and Cortex-A73 § Cache
Memory controller[edit]
[Edit/Modify Memory Info]
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Integrated Memory Controller
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Max Type | LPDDR4X-3732 |
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Supports ECC | No |
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Max Mem | 8 GiB |
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Controllers | 1 |
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Channels | 4 |
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Width | 16 bit |
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Max Bandwidth | 27.81 GiB/s 28,477.44 MiB/s 29.861 GB/s 29,860.76 MB/s 0.0272 TiB/s 0.0299 TB/s
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Bandwidth |
Single 6.95 GiB/s Double 13.9 GiB/s Quad 27.81 GiB/s
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Expansions[edit]
Graphics[edit]
[Edit/Modify IGP Info]
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Integrated Graphics Information
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GPU | PowerVR GT7400 Plus |
Designer | Imagination Technologies |
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Frequency | 800 MHz 0.8 GHz 800,000 KHz
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Output | DSI |
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| Max Resolution | |
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| Standards | Direct3D | 11.2 |
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OpenGL | 3.3 | OpenCL | 2.0 | OpenGL ES | 3.2 | Vulkan | 1.0 |
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Wireless[edit]
Wireless Communications |
Wi-Fi |
WiFi | |
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Cellular |
2G | CSD | | Yes | GSM | | Yes | GPRS | | Yes | EDGE | | Yes |
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3G | UMTS | TD-SCDMA | Yes | DC-HSDPA | Yes | HSUPA | Yes | |
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CDMA2000 | |
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4G | |
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- Integrated image signal processor supports 28 MP
- Supports image stabilization
- Supports video stabilization
- Supports noise reduction
- Supports lens shading correction
- Supports AE/AWB/AF
- Supports edge enhancement
- Supports face detection and visual tracking
- Hardware JPEG encoder
- Video encoding 4K2K @ 30fps with H.265 and HDR
- Video decoding 4K2K @ 30fps, h.264, h.265 / HEVC, MPEG-1/2/4, VC-1, VP-8, VP-9
- Audio content sampling rates 8kHz to 192kHz
- Audio content sampling format 8-bit/16-bit/24-bit Mono/Stereo
- I2S, PCM
- Encode: AMR-NB, AMR-WB, AAC, OGG, ADPCM
- Decode: WAV, MP3, MP2, AAC, AMR-NB, AMR-WB, MIDI, Vorbis, APE, AAC-plus v1, AAC-plus v2, FLAC, WMA, ADPCM
- 7.1 channel MHL output
Utilizing devices[edit]
- Meizu Pro 7
- Meizu Pro 7 Plus
This list is incomplete; you can help by expanding it.
Bibliography[edit]
- Mair, Hugh, et al. "3.4 A 10nm FinFET 2.8 GHz tri-gear deca-core CPU complex with optimized power-delivery network for mobile SoC performance." Solid-State Circuits Conference (ISSCC), 2017 IEEE International. IEEE, 2017.