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MediaTek Helio X20 |
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Designer | MediaTek, ARM Holdings |
Manufacturer | TSMC |
Model Number | Helio X20 |
Part Number | MT6797, MTK6797 |
Market | Mobile, Embedded |
Introduction | May 12, 2015 (announced) March 16, 2016 (launched) |
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Family | Helio |
Series | Helio X |
Frequency | 2,100 MHz, 1,850 MHz, 1,400 MHz |
Bus type | AMBA 4 AXI |
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ISA | ARMv8 (ARM) |
Microarchitecture | Cortex-A53, Cortex-A72 |
Core Name | Cortex-A53, Cortex-A72 |
Process | 20 nm |
Technology | CMOS |
Die | 100 mm² |
Word Size | 64 bit |
Cores | 10 |
Threads | 10 |
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Max SMP | 1-Way (Uniprocessor) |
Helio X20 (MT6797) is a 64-bit deca-core ARM LTE system on a chip designed by MediaTek and introduced in early 2016. This SoC incorporates 3 independent clusters of cores (called "Tri-Cluster" by MediaTek) operating at varying degrees of performance designed for certain workloads (operating at 1.4 GHz, 1.85 GHz, and 2.1 GHz) and supports up to 6 GiB of dual-channel LPDDR3-1866 memory. This SoC also incorporates a Mali-T800 MP4 IGP operating at 780 MHz. The chip has a modem supporting LTE User Equipment (UE) category 6.
The Helio X20 is identical to Helio X25 except for the lower clocked A72 cores and the lower clocked GPU.
Architecture[edit]
The Helio X20 is designed is composed of 3 individual clusters of CPU cores depending on the level of performance required by the active applications.
The three clusters are designed as a modified big.LITTLE configuration.
Architecture slide (note speeds changed since)
- Main articles: Cortex-A53 § Cache and Cortex-A72 § Cache
Memory controller[edit]
[Edit/Modify Memory Info]
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Integrated Memory Controller
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Max Type | LPDDR3-1600 |
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Supports ECC | No |
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Max Mem | 6 GiB |
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Controllers | 1 |
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Channels | 2 |
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Width | 32 bit |
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Max Bandwidth | 12.8 GB/s (11.92 GiB/s) "GB/s(11.92GiB/s)" is not declared as a valid unit of measurement for this property. |
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Bandwidth |
Single 6.4 GB/s (5.96 GiB/s) Double 12.8 GB/s (11.92 GiB/s)
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Expansions[edit]
Graphics[edit]
[Edit/Modify IGP Info]
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Integrated Graphics Information
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GPU | Mali-T880 |
Designer | ARM Holdings |
Execution Units | 4 |
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Frequency | 780 MHz 0.78 GHz 780,000 KHz
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Output | DSI |
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| Max Resolution | |
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| Standards | Direct3D | 11.2 |
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OpenGL | 3.2 | OpenCL | 1.2 | OpenGL ES | 3.2 | OpenVG | 1.1 | Vulkan | 1.0 |
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Wireless[edit]
Wireless Communications |
Wi-Fi |
WiFi | |
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Cellular |
2G | CSD | | Yes | GSM | | Yes | GPRS | | Yes | EDGE | | Yes |
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3G | UMTS | TD-SCDMA | Yes | DC-HSDPA | Yes | HSUPA | Yes | |
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CDMA2000 | |
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4G | |
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- Integrated image signal processor supports 32 MP
- Supports image stabilization
- Supports video stabilization
- Supports noise reduction
- Supports lens shading correction
- Supports AE/AWB/AF
- Supports edge enhancement
- Supports face detection and visual tracking
- Hardware JPEG encoder
- Video encoding 4K2K @ 30fps with H.265 and HDR
- Video decoding 4K2K @ 30fps, h.264, h.265 / HEVC, MPEG-1/2/4, VC-1, VP-8, VP-9
- Audio content sampling rates 8kHz to 192kHz
- Audio content sampling format 8-bit/16-bit/24-bit Mono/Stereo
- I2S, PCM
- Encode: AMR-NB, AMR-WB, AAC, OGG, ADPCM
- Decode: WAV, MP3, MP2, AAC, AMR-NB, AMR-WB, MIDI, Vorbis, APE, AAC-plus v1, AAC-plus v2, FLAC, WMA, ADPCM
- 7.1 channel MHL output
Utilizing devices[edit]
- Alcatel Flash (2017)
- Doogee F7
- Doogee F7 Pro
- Elephone R9
- Elephone S7
- HomTom HT10
- Kodak Ektra
- LeEco Le 2 Pro X620
- LeEco Le 2 X620
- LeEco Le S3 X626
- Meizu MX6
- Sharp Z2
- Vernee Apollo Lite
- Xiaomi Redmi Note 4
- Xiaomi Redmi Pro
- Leagoo T10
- Lenovo k8 Note
- Chuwi Hi9 Air
- CHAOHENG 10
- Infinix Zero 4 Plus
This list is incomplete; you can help by expanding it.
Bibliography[edit]
- Mair, Hugh T., et al. "4.3 A 20nm 2.5 GHz ultra-low-power tri-cluster CPU subsystem with adaptive power allocation for optimal mobile SoC performance." Solid-State Circuits Conference (ISSCC), 2016 IEEE International. IEEE, 2016.