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Core M3-7Y32 - Intel
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Core M3-7Y32
kaby lake y (front).png
General Info
DesignerIntel
ManufacturerIntel
Model NumberM3-7Y32
Part NumberHE8067702739830
S-SpecSR346
MarketMobile
IntroductionApril 10, 2017 (launched)
Release Price$281.00
General Specs
FamilyCore M3
Seriesm3-7Y
LockedYes
Frequency1,100 MHz
Turbo Frequency3,000 MHz (1 core)
Bus typeOPI
Bus rate4 GT/s
Clock multiplier11
Microarchitecture
ISAx86-64 (x86)
MicroarchitectureKaby Lake
PlatformKaby Lake
Core NameKaby Lake Y
Core Family6
Core Model142
Core SteppingH0
Process14 nm
TechnologyCMOS
Word Size64 bit
Cores2
Threads4
Max CPUs1 (Uniprocessor)
Max Memory16 GiB
Electrical
Vcore0.55 V-1.52 V
TDP4.5 W
cTDP down3.75 W
cTDP down frequency600 MHz
cTDP up7 W
cTDP up frequency1,600 MHz
Tjunction0 °C – 100 °C
Tstorage-25 °C – 125 °C
Packaging
PackageFCBGA-1515 (BGA)
Dimension20.5 mm x 16.5 mm
Pitch0.4 mm
Pin Count1515

Core M3-7Y32 is a 64-bit dual-core low-end performance ultra-low power x86 mobile microprocessor introduced by Intel in early 2017. This chip, which is based on the Kaby Lake microarchitecture, is fabricated on Intel's 14nm+ process. The M3-7Y32 operates at 1.1 GHz with a TDP of 4.5 W supporting a Turbo Boost frequency of 3 GHz. The processor supports up to 16 GiB of dual-channel non-ECC LPDDR3-1866 memory and incorporates Intel's HD Graphics 615 IGP operating at 300 MHz with a burst frequency of 900 MHz.

This specific model has a configurable TDP-down of 3.75 W with a frequency of 600 MHz and a configurable TDP-up of 7 W with a frequency of 1.6 GHz.

The Core M3-7Y32 superceeds the M3-7Y30 which was released in August 2016, offering 100 MHz higher base clock and 400 MHz higher turbo frequency for the exact same price.

Cache[edit]

Main article: Kaby Lake § Cache

[Edit/Modify Cache Info]

hierarchy icon.svg
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.
L1$128 KiB
0.125 MiB
131,072 B
1.220703e-4 GiB
L1I$64 KiB
0.0625 MiB
65,536 B
6.103516e-5 GiB
2x32 KiB8-way set associative 
L1D$64 KiB
0.0625 MiB
65,536 B
6.103516e-5 GiB
2x32 KiB8-way set associativewrite-back

L2$512 KiB
0.5 MiB
524,288 B
4.882812e-4 GiB
  2x256 KiB4-way set associativewrite-back

L3$4 MiB
4,096 KiB
4,194,304 B
0.00391 GiB
  2x2 MiB12-way set associativewrite-back

Memory controller[edit]

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeDDR3L-1600, LPDDR3-1866
Supports ECCNo
Max Mem16 GiB
Controllers1
Channels2
Max Bandwidth27.81 GiB/s
Bandwidth
Single 13.9 GiB/s
Double 27.81 GiB/s

Expansions[edit]

[Edit/Modify Expansions Info]

ide icon.svg
Expansion Options
PCIe
Revision3.0
Max Lanes10
Configs1x4, 2x2, 1x2+2x1, 4x1

Graphics[edit]

[Edit/Modify IGP Info]

screen icon.svg
Integrated Graphics Information
GPUHD Graphics 615
DesignerIntelDevice ID0x591E
Execution Units24Max Displays3
Max Memory16 GiB
16,384 MiB
16,777,216 KiB
17,179,869,184 B
Frequency300 MHz
0.3 GHz
300,000 KHz
Burst Frequency900 MHz
0.9 GHz
900,000 KHz
OutputDisplayPort, Embedded DisplayPort, HDMI, DVI

Max Resolution
HDMI4096x2304 @24 Hz
DP4096x2304 @60 Hz
eDP4096x2304 @60 Hz

Standards
DirectX12
OpenGL4.4
OpenCL2.0
DP1.2
eDP1.4
HDMI1.4a

Additional Features
Intel Quick Sync Video
Intel InTru 3D
Intel Clear Video
Intel Clear Video HD

Features[edit]

[Edit/Modify Supported Features]

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Supported x86 Extensions & Processor Features
MMXMMX Extension
EMMXExtended MMX Extension
SSEStreaming SIMD Extensions
SSE2Streaming SIMD Extensions 2
SSE3Streaming SIMD Extensions 3
SSSE3Supplemental SSE3
SSE4.1Streaming SIMD Extensions 4.1
SSE4.2Streaming SIMD Extensions 4.2
SSE4aStreaming SIMD Extensions 4a
AVXAdvanced Vector Extensions
AVX2Advanced Vector Extensions 2
ABMAdvanced Bit Manipulation
BMI1Bit Manipulation Instruction Set 1
BMI2Bit Manipulation Instruction Set 2
FMA33-Operand Fused-Multiply-Add
AESAES Encryption Instructions
RdRandHardware RNG
ADXMulti-Precision Add-Carry
CLMULCarry-less Multiplication Extension
F16C16-bit Floating Point Conversion
x86-1616-bit x86
x86-3232-bit x86
x86-6464-bit x86
RealReal Mode
ProtectedProtected Mode
SMMSystem Management Mode
FPUIntegrated x87 FPU
NXNo-eXecute
HTHyper-Threading
TBT 2.0Turbo Boost Technology 2.0
EISTEnhanced SpeedStep Technology
SSTSpeed Shift Technology
VT-xVT-x (Virtualization)
VT-dVT-d (I/O MMU virtualization)
EPTExtended Page Tables (SLAT)
MPXMemory Protection Extensions
SGXSoftware Guard Extensions
Secure KeySecure Key Technology
SMEPOS Guard Technology
Flex MemoryFlex Memory Access
ISRTSmart Response Technology
MWTMy WiFi Technology
Facts about "Core M3-7Y32 - Intel"
Has subobject
"Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki.
Core M3-7Y32 - Intel#package +
base frequency1,100 MHz (1.1 GHz, 1,100,000 kHz) +
bus rate4,000 MT/s (4 GT/s, 4,000,000 kT/s) +
bus typeOPI +
clock multiplier11 +
core count2 +
core family6 +
core model142 +
core nameKaby Lake Y +
core steppingH0 +
core voltage (max)1.52 V (15.2 dV, 152 cV, 1,520 mV) +
core voltage (min)0.55 V (5.5 dV, 55 cV, 550 mV) +
designerIntel +
device id0x591E +
familyCore M3 +
first launchedApril 10, 2017 +
full page nameintel/core m/m3-7y32 +
has advanced vector extensionstrue +
has advanced vector extensions 2true +
has ecc memory supportfalse +
has extended page tables supporttrue +
has featureAdvanced Vector Extensions +, Advanced Vector Extensions 2 +, Advanced Encryption Standard Instruction Set Extension +, Hyper-Threading Technology +, Turbo Boost Technology 2.0 +, Enhanced SpeedStep Technology +, Speed Shift Technology +, Intel VT-x +, Intel VT-d +, Secure Key Technology +, Flex Memory Access +, Smart Response Technology +, My WiFi Technology + and OS Guard +
has intel enhanced speedstep technologytrue +
has intel flex memory access supporttrue +
has intel my wifi technology supporttrue +
has intel secure key technologytrue +
has intel smart response technology supporttrue +
has intel speed shift technologytrue +
has intel supervisor mode execution protectiontrue +
has intel turbo boost technology 2 0true +
has intel vt-d technologytrue +
has intel vt-x technologytrue +
has locked clock multipliertrue +
has second level address translation supporttrue +
has simultaneous multithreadingtrue +
has x86 advanced encryption standard instruction set extensiontrue +
instance ofmicroprocessor +
integrated gpuHD Graphics 615 +
integrated gpu base frequency300 MHz (0.3 GHz, 300,000 KHz) +
integrated gpu designerIntel +
integrated gpu max frequency900 MHz (0.9 GHz, 900,000 KHz) +
integrated gpu max memory16,384 MiB (16,777,216 KiB, 17,179,869,184 B, 16 GiB) +
isax86-64 +
isa familyx86 +
l1$ size0.125 MiB (128 KiB, 131,072 B, 1.220703e-4 GiB) +
l1d$ description8-way set associative +
l1d$ size0.0625 MiB (64 KiB, 65,536 B, 6.103516e-5 GiB) +
l1i$ description8-way set associative +
l1i$ size0.0625 MiB (64 KiB, 65,536 B, 6.103516e-5 GiB) +
l2$ description4-way set associative +
l2$ size0.5 MiB (512 KiB, 524,288 B, 4.882812e-4 GiB) +
l3$ description12-way set associative +
l3$ size4 MiB (4,096 KiB, 4,194,304 B, 0.00391 GiB) +
ldateApril 10, 2017 +
main imageFile:kaby lake y (front).png +
manufacturerIntel +
market segmentMobile +
max cpu count1 +
max junction temperature373.15 K (100 °C, 212 °F, 671.67 °R) +
max memory16,384 MiB (16,777,216 KiB, 17,179,869,184 B, 16 GiB, 0.0156 TiB) +
max pcie lanes10 +
max storage temperature398.15 K (125 °C, 257 °F, 716.67 °R) +
microarchitectureKaby Lake +
min junction temperature273.15 K (0 °C, 32 °F, 491.67 °R) +
min storage temperature248.15 K (-25 °C, -13 °F, 446.67 °R) +
model numberM3-7Y32 +
nameCore M3-7Y32 +
packageFCBGA-1515 +
part numberHE8067702739830 +
platformKaby Lake +
process14 nm (0.014 μm, 1.4e-5 mm) +
release price$ 281.00 (€ 252.90, £ 227.61, ¥ 29,035.73) +
s-specSR346 +
seriesm3-7Y +
supported memory typeDDR3L-1600 + and LPDDR3-1866 +
tdp4.5 W (4,500 mW, 0.00603 hp, 0.0045 kW) +
tdp down3.75 W (3,750 mW, 0.00503 hp, 0.00375 kW) +
tdp down frequency600 MHz (0.6 GHz, 600,000 kHz) +
tdp up7 W (7,000 mW, 0.00939 hp, 0.007 kW) +
tdp up frequency1,600 MHz (1.6 GHz, 1,600,000 kHz) +
technologyCMOS +
thread count4 +
turbo frequency (1 core)3,000 MHz (3 GHz, 3,000,000 kHz) +
word size64 bit (8 octets, 16 nibbles) +