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Core i3-370M - Intel
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Intel Core i3-370M
General Info
DesignerIntel
ManufacturerIntel
Model Numberi3-370M
Part NumberCN80617004119AL,
CP80617004119AL
S-SpecSLBTX, SLBUK
MarketMobile
IntroductionJune 22, 2010 (announced)
June 22, 2010 (launched)
General Specs
FamilyCore i3
Seriesi3-300
LockedYes
Frequency2,399.99 MHz
Bus typeDMI 1.0
Bus rate1 × 2.5 GT/s
Clock multiplier18
CPUID0x20655
Microarchitecture
ISAx86-64 (x86)
MicroarchitectureWestmere
PlatformCalpella
ChipsetIbex Peak
Core NameArrandale
Core Family6
Core Model37
Core SteppingK0
Process32 nm
Transistors382,000,000
TechnologyCMOS
Die81 mm²
Word Size64 bit
Cores2
Threads4
Max CPUs1 (Uniprocessor)
Max Memory8 GiB
Electrical
TDP35 W
Tjunction0 °C – 105 °C
Tstorage-25 °C – 125 °C
Packaging
PackagerPGA-988A (rPGA)rPGA988A.svg
Dimension36 mm x 35 mm x 2.12 mm
Pitch1 mm
Pin Count988
SocketSocket-G1 (PGA)

Core i3-370M is a 64-bit dual-core x86 mobile microprocessor introduced by Intel in 2010. This processor operates at a frequency of 2.40 GHz and a TDP of 35 W. This MPU is manufactured on a 32 nm process based on the Westmere microarchitecture (Arrandale core). This processor incorporated the HD Graphics (Ironlake) IGP on the same package operating at a base frequency of 500.00 MHz and a burst frequency of 667.00 MHz.

Cache[edit]

Main article: Westmere § Cache

[Edit/Modify Cache Info]

hierarchy icon.svg
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.
L1$128 KiB
0.125 MiB
131,072 B
1.220703e-4 GiB
L1I$64 KiB
0.0625 MiB
65,536 B
6.103516e-5 GiB
2x32 KiB4-way set associativewrite-back
L1D$64 KiB
0.0625 MiB
65,536 B
6.103516e-5 GiB
2x32 KiB8-way set associativewrite-back

L2$512 KiB
0.5 MiB
524,288 B
4.882812e-4 GiB
  2x256 KiB8-way set associativewrite-back

L3$3 MiB
3,072 KiB
3,145,728 B
0.00293 GiB
  2x1.5 MiB12-way set associativewrite-back

Memory controller[edit]

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeDDR3-1066
Supports ECCNo
Max Mem8 GiB
Controllers1
Channels2
Max Bandwidth15.88 GiB/s
Bandwidth
Single 7.942 GiB/s
Double 15.88 GiB/s
Physical Address (PAE)36 bit

Expansions[edit]

[Edit/Modify Expansions Info]

ide icon.svg
Expansion Options
PCIe
Revision2.0
Max Lanes16
Configs1x16

Graphics[edit]

[Edit/Modify IGP Info]

screen icon.svg
Integrated Graphics Information
GPUHD Graphics (Ironlake)
DesignerIntelDevice ID0x0046
Execution Units12Max Displays2
Frequency500 MHz
0.5 GHz
500,000 KHz
Burst Frequency667 MHz
0.667 GHz
667,000 KHz
Output

Standards
DirectX10.1
OpenGL2.1

Additional Features
Intel Flexible Display Interface (FDI)
Intel Clear Video
Intel Clear Video HD

Features[edit]

[Edit/Modify Supported Features]

Cog-icon-grey.svg
Supported x86 Extensions & Processor Features
MMXMMX Extension
EMMXExtended MMX Extension
SSEStreaming SIMD Extensions
SSE2Streaming SIMD Extensions 2
SSE3Streaming SIMD Extensions 3
SSSE3Supplemental SSE3
SSE4.1Streaming SIMD Extensions 4.1
SSE4.2Streaming SIMD Extensions 4.2
x86-1616-bit x86
x86-3232-bit x86
x86-6464-bit x86
RealReal Mode
ProtectedProtected Mode
SMMSystem Management Mode
FPUIntegrated x87 FPU
NXNo-eXecute
HTHyper-Threading
EISTEnhanced SpeedStep Technology
VT-xVT-x (Virtualization)
EPTExtended Page Tables (SLAT)
Flex MemoryFlex Memory Access
FMAFast Memory Access (w\ GMCH)
Facts about "Core i3-370M - Intel"
Has subobject
"Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki.
Core i3-370M - Intel#package +
base frequency2,399.99 MHz (2.4 GHz, 2,399,990 kHz) +
bus links1 +
bus rate2,500 MT/s (2.5 GT/s, 2,500,000 kT/s) +
bus typeDMI 1.0 +
chipsetIbex Peak +
clock multiplier18 +
core count2 +
core family6 +
core model37 +
core nameArrandale +
core steppingK0 +
cpuid0x20655 +
designerIntel +
device id0x0046 +
die area81 mm² (0.126 in², 0.81 cm², 81,000,000 µm²) +
familyCore i3 +
first announcedJune 22, 2010 +
first launchedJune 22, 2010 +
full page nameintel/core i3/i3-370m +
has ecc memory supportfalse +
has extended page tables supporttrue +
has featureHyper-Threading Technology +, Enhanced SpeedStep Technology +, Intel VT-x +, Extended Page Tables + and Flex Memory Access +
has intel enhanced speedstep technologytrue +
has intel flex memory access supporttrue +
has intel vt-x technologytrue +
has locked clock multipliertrue +
has second level address translation supporttrue +
has simultaneous multithreadingtrue +
instance ofmicroprocessor +
integrated gpuHD Graphics (Ironlake) +
integrated gpu base frequency500 MHz (0.5 GHz, 500,000 KHz) +
integrated gpu designerIntel +
integrated gpu max frequency667 MHz (0.667 GHz, 667,000 KHz) +
isax86-64 +
isa familyx86 +
l1$ size0.125 MiB (128 KiB, 131,072 B, 1.220703e-4 GiB) +
l1d$ description8-way set associative +
l1d$ size0.0625 MiB (64 KiB, 65,536 B, 6.103516e-5 GiB) +
l1i$ description4-way set associative +
l1i$ size0.0625 MiB (64 KiB, 65,536 B, 6.103516e-5 GiB) +
l2$ description8-way set associative +
l2$ size0.5 MiB (512 KiB, 524,288 B, 4.882812e-4 GiB) +
l3$ description12-way set associative +
l3$ size3 MiB (3,072 KiB, 3,145,728 B, 0.00293 GiB) +
ldateJune 22, 2010 +
manufacturerIntel +
market segmentMobile +
max cpu count1 +
max junction temperature378.15 K (105 °C, 221 °F, 680.67 °R) +
max memory8,192 MiB (8,388,608 KiB, 8,589,934,592 B, 8 GiB, 0.00781 TiB) +
max memory channels2 +
max pcie lanes16 +
max storage temperature398.15 K (125 °C, 257 °F, 716.67 °R) +
microarchitectureWestmere +
min junction temperature273.15 K (0 °C, 32 °F, 491.67 °R) +
min storage temperature248.15 K (-25 °C, -13 °F, 446.67 °R) +
model numberi3-370M +
nameIntel Core i3-370M +
packagerPGA-988A +
part numberCN80617004119AL + and CP80617004119AL +
platformCalpella +
process32 nm (0.032 μm, 3.2e-5 mm) +
s-specSLBTX + and SLBUK +
seriesi3-300 +
supported memory typeDDR3-1066 +
tdp35 W (35,000 mW, 0.0469 hp, 0.035 kW) +
technologyCMOS +
thread count4 +
transistor count382,000,000 +
word size64 bit (8 octets, 16 nibbles) +