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  • ...acturing using 32 nm process began in 2010. This technology was superseded by the [[28 nm lithography process|28 nm process]] (HN) / [[22 nm lithography ...Common Platform Alliance 20 nm node was a collaboration between [[IBM]], [[Samsung]], [[Freescale]], [[Toshiba]], [[Chartered Semiconductor Manufacturing]], [
    10 KB (1,090 words) - 19:14, 8 July 2021
  • ...lf pitch. The 14 nm node was introduced in 2014/2015 and has been replaced by the [[10 nm process]]. <!-- Samsung -->
    17 KB (2,243 words) - 19:32, 25 May 2023
  • ...gan in 2008 for memory and 2012 for [[MPU]]s. This technology was replaced by with [[20 nm lithography process|20 nm process]] (HN) in 2014 and [[16 nm l <!-- Samsung -->
    7 KB (891 words) - 09:52, 25 November 2020