...st 30% Skylake's composition and less than 1% on Apple's {{apple|A8}} or {{apple|A9}}. Those numbers are somewhat expected given tall logic cells are genera | Metal 0 || 56 || -

...[FinFET]] transistors with fin pitches in the 30s of nanometer and densest metal pitches in the upper 30s or low 50s of nanometers. Due to the small feature [[File:mss-n7-a12.jpg|right|thumb|Elements distribution of Apple's A12 SoC (MSS Corp). Cobalt contacts can be seen.]]

...ith quad patterning for the fins and double patterning for the rest of the metal stack. Note that Intel [[7 nm process]] is comparable to the foundry 5-nano Despite aggressively tighter pitches, TSMC says metal lines RC and via resistance have been kept relatively similar to N7. TSMC s

...power goals. Additionally, the X704 was caught in the crossfire between [[Apple]] and [[Macintosh clone]] manufacturers, which ultimately sealed their fat ...were operating at only 50-75 MHz max. By [[1993]] the idea was backed by [[Apple]] and their CEO [[wikipedia:Michael Spindler|Michael Spindler]] which becam

...s/domino|domino logic]]. Since 2010 the technology has been acquired by [[Apple]]. ...roduces smart density fill, power or ground, density fills reduce floating metal, and improves the integrity of the power grid. Inputs GDSII or PGNS layouts

...h. StrongARM enjoyed a series of design wins such as [[Psion]] 7 Series, [[Apple]]'s MessagePad 2000/2100, Yakumo Alpha PDA, and various PDAs from [[HP]]'s ...gate length and 0.25 µm effective channel length. The CMOS process had 3 metal layers and allowed for a supply voltage of 1.5 V with up to 2 V for highest

| Apple || macOS || style="background-color: #d6ffd8;" | 10.12.3 || iMac Pro * 12 metal layers

{{apple title|A11 Bionic}} |designer=Apple