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- {{ic family ...ges/socket-g1|PGA-988]] ([[packages/socket-g1|Socket G1]]) packaging. They all have the following features:43 KB (5,740 words) - 03:11, 3 October 2022
- ...ters may be formed by powering selected LED elements. SSDs come in various packages and pin arranges. ...d together. In a CA SSD, power must be supplied to anode that is common to all the segments. Appropriate segments can be lit up by applying ground to them4 KB (490 words) - 09:47, 24 July 2019
- ...re-defined packages. Sometimes the device that's designed does not utilize all the pins for various reasons. It may also be as a result of [[post-package * [[IC package]]2 KB (238 words) - 20:56, 26 November 2015
- {{ic family ...came from its simplicity, being an [[in-order]] dual-issue pipelined CPU. All Bonnell-based processors were manufactured on Intel's [[45 nm process]].17 KB (2,292 words) - 09:32, 16 July 2019
- {{ic family ...t Media Interface}} 1.0. These processors use {{packages|Socket-G1}}. They all have the following features:20 KB (2,661 words) - 00:45, 11 October 2017
- {{ic family ...t Media Interface}} 1.0. These processors use {{packages|Socket-G1}}. They all have the following features:25 KB (3,201 words) - 03:13, 22 September 2018
- {{ic family | type = System in packages13 KB (1,784 words) - 08:04, 6 April 2019
- {{ic family All Core i3 processors up to Coffee Lake are dual-core.25 KB (3,397 words) - 03:12, 3 October 2022
- {{ic family ...{x86|AES}} instructions. These processors use {{packages|Socket-G1}}. They all have the following features:34 KB (4,663 words) - 20:38, 20 February 2023
- |package name=amd/packages/bga-2409 [[Category:all ic packages]]{{#set:package=BGA-2409|package type=FC-OBGA}}15 KB (2,390 words) - 02:54, 17 May 2023
- {{ic family ...al-die configuration and use a multi-chip module {{amd|Package SP4}}. Both packages are ball grid arrays (BGAs) and are pin-compatible with each other. Geared5 KB (724 words) - 15:06, 25 May 2019
- ...('''CoWoS''') is a [[two-point-five dimensional integrated circuit]] (2.5D IC) [[through-silicon via]] (TSV) [[interposer]]-based packaging technology de ..., TSMC has since increased the interposer size to 1,700 mm². Those large packages are referred to as CoWoS-XL2.6 KB (943 words) - 23:31, 1 August 2021