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MediaTek Helio X30
General Info
Designer	MediaTek, ARM Holdings
Manufacturer	TSMC
Model Number	Helio X30
Part Number	MT6799
Market	Mobile, Embedded
Introduction	September 26, 2016 (announced) February 27, 2017 (launched)
General Specs
Family	Helio
Series	Helio X
Frequency	2,500 MHz, 2,200 MHz, 1,900 MHz
Bus type	AMBA 4 AXI
Microarchitecture
ISA	ARMv8 (ARM)
Microarchitecture	Cortex-A53, Cortex-A73, Cortex-A35
Core Name	Cortex-A35, Cortex-A53, Cortex-A73
Process	10 nm
Technology	CMOS
Word Size	64 bit
Cores	10
Threads	10
Max Memory	8 GiB
Multiprocessing
Max SMP	1-Way (Uniprocessor)

Helio X30 (MT6799) is a 64-bit deca-core ARM LTE system on a chip designed by MediaTek and launched in early 2017. This SoC incorporates 3 independent clusters of cores (called "Tri-Cluster" by MediaTek) operating at varying degrees of performance designed for certain workloads (operating at 1.9 GHz, 2.2 GHz, and 2.5 GHz) and supports up to 8 GiB of quad-channel LPDDR4X-3732 memory. This SoC also incorporates a PowerVR GT7400 Plus IGP operating at 800 MHz. The chip has a modem supporting LTE User Equipment (UE) category 10.

Architecture

The Helio X30 is designed is composed of 3 individual clusters of CPU cores depending on the level of performance required by the active applications.

• Extreme Performance - 2x Cortex-A73 @ 2.5 GHz
• Performance/Power Balance - 4x Cortex-A53 @ 2.2 GHz
• Power Efficiency - 4x Cortex-A35 @ 1.9 GHz

The three clusters are designed as a modified big.LITTLE configuration.

Cache

Main articles: Cortex-A53 § Cache and Cortex-A73 § Cache

This section is empty; you can help add the missing info by editing this page.

Memory controller

[Edit/Modify Memory Info]

	Integrated Memory Controller
	Max Type LPDDR4X-3732 Supports ECC No Max Mem 8 GiB Controllers 1 Channels 4 Width 16 bit Max Bandwidth 27.81 GiB/s 28,477.44 MiB/s 29.861 GB/s 29,860.76 MB/s 0.0272 TiB/s 0.0299 TB/s Bandwidth Single 6.95 GiB/s Double 13.9 GiB/s Quad 27.81 GiB/s

Expansions

[Edit/Modify Expansions Info]

	Expansion Options
	USB Revision 2.0, 3.0 Ports 8 UART GP I/O Yes

Graphics

[Edit/Modify IGP Info]

	Integrated Graphics Information
	GPU PowerVR GT7400 Plus Designer Imagination Technologies Frequency 800 MHz 0.8 GHz 800,000 KHz Output DSI Max Resolution DSI 3840x2160 Standards Direct3D 11.2 OpenGL 3.3 OpenCL 2.0 OpenGL ES 3.2 Vulkan 1.0

Wireless

Wireless Communications
Wi-Fi
WiFi	802.11ac Yes
Cellular
2G	CSD   Yes GSM   Yes GPRS   Yes EDGE   Yes
3G	UMTS TD-SCDMA Yes DC-HSDPA Yes HSUPA Yes CDMA2000 1X Yes 1xEV-DO Yes
4G	LTE Advanced E-UTRAN Yes UE Cat 10

Image

• Integrated image signal processor supports 28 MP
• Supports image stabilization
• Supports video stabilization
• Supports noise reduction
• Supports lens shading correction
• Supports AE/AWB/AF
• Supports edge enhancement
• Supports face detection and visual tracking
• Hardware JPEG encoder

Video

• Video encoding 4K2K @ 30fps with H.265 and HDR
• Video decoding 4K2K @ 30fps, h.264, h.265 / HEVC, MPEG-1/2/4, VC-1, VP-8, VP-9

Audio

• Audio content sampling rates 8kHz to 192kHz
• Audio content sampling format 8-bit/16-bit/24-bit Mono/Stereo
• I2S, PCM
• Encode: AMR-NB, AMR-WB, AAC, OGG, ADPCM
• Decode: WAV, MP3, MP2, AAC, AMR-NB, AMR-WB, MIDI, Vorbis, APE, AAC-plus v1, AAC-plus v2, FLAC, WMA, ADPCM
• 7.1 channel MHL output

Utilizing devices

• Meizu Pro 7
• Meizu Pro 7 Plus

This list is incomplete; you can help by expanding it.

Die

• 10 nm process

Bibliography

• Mair, Hugh, et al. "3.4 A 10nm FinFET 2.8 GHz tri-gear deca-core CPU complex with optimized power-delivery network for mobile SoC performance." Solid-State Circuits Conference (ISSCC), 2017 IEEE International. IEEE, 2017.