Flip Chip Ball Grid Array (fcBGA or simply Flip-chip BGA) is a mid-cost, high-performance, semiconductor packaging solution that utilizes the controlled collapse chip connection technology, also known as flip chip, for its die to substrate interconnection. fcBGA provides the design flexibility for much higher signal density and functionality into a smaller die and packaging footprint. fcBGA packaging is attractive where performance is more important than cost. Flip-chip BGA packages can be mounted using standard printed circuit boards and can be replaced using existing standard repair practices.

Typical Flip Chip BGA Package (Cross-Sectional View)

Today most flip-chip BGA packages are assembled on two-metal layer or multi-layered, high density ceramic substrates or organic laminate. Additionally fcBGA packages are often offered in bare die, flat lid, and full lid configuration. They are used extensively ASIC, DSP, and various other high performance applications.

fcBGA packages is used in all main semiconductor manufacturers such as in the latest Intel's Core i7, Texas Instruments custom ASICs, and Freescale processors.

TI's 288GTS package footprint - a 288-ball FCBGA package

μFCBGA

μFCBGA or micro-FCBGA is a line of fcBGA packages that ships with Intel's line of processors.

• FCBGA 1466
• FCBGA 1364
• FCBGA 1357
• FCBGA 1284
• FCBGA 1283
• FCBGA 1224
• FCBGA 1170
• FCBGA 1168
• FCBGA 1088
• FCBGA 1023
• FCBGA 676
• FCBGA 559
• FCBGA 437

BGA CPU Packages

• BGA-1288 (Intel)

BGA CPU Packages
General				Details
Name	Package	Contacts	TDP	Socket	µarch	Market	Release
FT3	BGA-769	769	25 W 25,000 mW 0.0335 hp 0.025 kW		Jaguar	Mobile, Embedded	May 2013
FT3b	BGA-769	769	25 W 25,000 mW 0.0335 hp 0.025 kW		Puma	Mobile, Embedded	4 June 2014
FT4	BGA-769	769	15 W 15,000 mW 0.0201 hp 0.015 kW		Excavator	Mobile	June 2016
Package CBGA-360	CBGA-360	360	11 W 11,000 mW 0.0148 hp 0.011 kW		K6	Mobile	5 March 1998
Package FP2	BGA-827, FP2	827	25 W 25,000 mW 0.0335 hp 0.025 kW		Piledriver	Mobile, Embedded	15 May 2012
Package FP3	BGA-854, FP3	854	35 W 35,000 mW 0.0469 hp 0.035 kW		Steamroller	Mobile, Embedded	June 2014
Package FP4	BGA-968, FP4	968	45 W 45,000 mW 0.0603 hp 0.045 kW		Excavator	Mobile, Embedded	June 2015
Package OBGA-349	OBGA-349	349	18 W 18,000 mW 0.0241 hp 0.018 kW		K6	Embedded	25 September 2000
Package SP1	BGA-1021	1,021	32 W 32,000 mW 0.0429 hp 0.032 kW		Cortex-A57	Embedded, Server	January 2016