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Difference between revisions of "qualcomm/snapdragon 800/845"
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[[File:sdm845 block diagram.jpg|thumb|right|Block diagram]]
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'''Snapdragon 845''' is a high-performance {{arch|64}} [[ARM]] [[LTE]] [[system on a chip]] designed by [[Qualcomm]] and introduced in late [[2017]]. Fabricated on Samsung's [[10nm process|10nm 10LPP]], the 845 features four [[Kryo 385 Silver]] high-efficiency cores operating at 1.7 GHz along with four high-performance [[Kryo 385 Gold]] cores operating at 2.8 GHz. The Snapdragon 845 integrates the {{qualcomm|Adreno 630}} [[GPU]] operation at ? MHz and features an X20 LTE modem supporting Cat 13 uplink and Cat 18 downlink. This chip supports up to 8 GiB of quad-channel LPDDR4X-3733 memory.

Revision as of 22:39, 16 June 2019

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Snapdragon 845
sdm845 (front).png
Chip package, front
General Info
DesignerQualcomm,
ARM Holdings
ManufacturerSamsung
Model NumberSDM845
Part NumberSDM845
IntroductionDecember 6, 2017 (announced)
Fabruary, 2018 (launched)
General Specs
FamilySnapdragon 800
Series800
Frequency2,800 MHz, 1,7000 MHz
Microarchitecture
ISAARMv8.2 (ARM)
MicroarchitectureCortex-A75, Cortex-A55
Core NameKryo 385 Gold, Kryo 385 Silver
Process10 nm
Transistors5,300,000,000
TechnologyCMOS
Die95 mm²
Word Size64 bit
Cores8
Threads8
Max Memory8 GiB
Multiprocessing
Max SMP1-Way (Uniprocessor)
Packaging
sdm845 (back).png
Succession
Block diagram

Snapdragon 845 is a high-performance 64-bit ARM LTE system on a chip designed by Qualcomm and introduced in late 2017. Fabricated on Samsung's 10nm 10LPP, the 845 features four Kryo 385 Silver high-efficiency cores operating at 1.7 GHz along with four high-performance Kryo 385 Gold cores operating at 2.8 GHz. The Snapdragon 845 integrates the Adreno 630 GPU operation at ? MHz and features an X20 LTE modem supporting Cat 13 uplink and Cat 18 downlink. This chip supports up to 8 GiB of quad-channel LPDDR4X-3733 memory.

back imageFile:sdm845 (back).png +
base frequency2,800 MHz (2.8 GHz, 2,800,000 kHz) +
core count8 +
core nameKryo 385 Gold + and Kryo 385 Silver +
designerQualcomm + and ARM Holdings +
die area95 mm² (0.147 in², 0.95 cm², 95,000,000 µm²) +
familySnapdragon 800 +
first announcedDecember 6, 2017 +
first launched2018 +
full page namequalcomm/snapdragon 800/845 +
instance ofmicroprocessor +
isaARMv8.2 +
isa familyARM +
ldate2018 +
main imageFile:sdm845 (front).png +
main image captionChip package, front +
manufacturerSamsung +
max cpu count1 +
max memory8,192 MiB (8,388,608 KiB, 8,589,934,592 B, 8 GiB, 0.00781 TiB) +
microarchitectureCortex-A75 + and Cortex-A55 +
model numberSDM845 +
nameSnapdragon 845 +
part numberSDM845 +
process10 nm (0.01 μm, 1.0e-5 mm) +
series800 +
smp max ways1 +
technologyCMOS +
thread count8 +
transistor count5,300,000,000 +
word size64 bit (8 octets, 16 nibbles) +