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Difference between revisions of "qualcomm/snapdragon 800/845"
< qualcomm

(Snapdragon 845)
 
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{{qualcomm title|Snapdragon 845}}
 
{{qualcomm title|Snapdragon 845}}
−
{{chip}}
+
{{chip
 +
|name=Snapdragon 845
 +
|image=sdm845 (front).png
 +
|back image=sdm845 (back).png
 +
|caption=Chip package, front
 +
|designer=Qualcomm
 +
|designer 2=ARM Holdings
 +
|manufacturer=Samsung
 +
|model number=SDM845
 +
|part number=SDM845
 +
|first announced=December 6, 2017
 +
|first launched=Fabruary, 2018
 +
|family=Snapdragon 800
 +
|series=800
 +
|frequency=2,800 MHz
 +
|frequency 2=1,7000 MHz
 +
|isa=ARMv8.2
 +
|isa family=ARM
 +
|microarch=Cortex-A75
 +
|microarch 2=Cortex-A55
 +
|core name=Kryo 385 Gold
 +
|core name 2=Kryo 385 Silver
 +
|process=10 nm
 +
|transistors=5,300,000,000
 +
|technology=CMOS
 +
|die area=95 mm²
 +
|word size=64 bit
 +
|core count=8
 +
|thread count=8
 +
|max cpus=1
 +
|max memory=8 GiB
 +
|predecessor=Snapdragon 835
 +
|predecessor link=qualcomm/snapdragon_800/835
 +
|successor=Snapdragon 855
 +
|successor link=qualcomm/snapdragon_800/855
 +
}}

Revision as of 22:29, 16 June 2019

Edit Values
Snapdragon 845
sdm845 (front).png
Chip package, front
General Info
DesignerQualcomm,
ARM Holdings
ManufacturerSamsung
Model NumberSDM845
Part NumberSDM845
IntroductionDecember 6, 2017 (announced)
Fabruary, 2018 (launched)
General Specs
FamilySnapdragon 800
Series800
Frequency2,800 MHz, 1,7000 MHz
Microarchitecture
ISAARMv8.2 (ARM)
MicroarchitectureCortex-A75, Cortex-A55
Core NameKryo 385 Gold, Kryo 385 Silver
Process10 nm
Transistors5,300,000,000
TechnologyCMOS
Die95 mm²
Word Size64 bit
Cores8
Threads8
Max Memory8 GiB
Multiprocessing
Max SMP1-Way (Uniprocessor)
Packaging
sdm845 (back).png
Succession
Retrieved from "https://en.wikichip.org/w/index.php?title=qualcomm/snapdragon_800/845&oldid=92014"
Facts about "Snapdragon 845 - Qualcomm"
RDF feed
back imageFile:sdm845 (back).png +
base frequency2,800 MHz (2.8 GHz, 2,800,000 kHz) +
core count8 +
core nameKryo 385 Gold + and Kryo 385 Silver +
designerQualcomm + and ARM Holdings +
die area95 mm² (0.147 in², 0.95 cm², 95,000,000 µm²) +
familySnapdragon 800 +
first announcedDecember 6, 2017 +
first launched2018 +
full page namequalcomm/snapdragon 800/845 +
instance ofmicroprocessor +
isaARMv8.2 +
isa familyARM +
ldate2018 +
main imageFile:sdm845 (front).png +
main image captionChip package, front +
manufacturerSamsung +
max cpu count1 +
max memory8,192 MiB (8,388,608 KiB, 8,589,934,592 B, 8 GiB, 0.00781 TiB) +
microarchitectureCortex-A75 + and Cortex-A55 +
model numberSDM845 +
nameSnapdragon 845 +
part numberSDM845 +
process10 nm (0.01 μm, 1.0e-5 mm) +
series800 +
smp max ways1 +
technologyCMOS +
thread count8 +
transistor count5,300,000,000 +
word size64 bit (8 octets, 16 nibbles) +