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Difference between revisions of "metallization stack"

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{{title|Metal Interconnect Layers}}
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{{title|Metallization Stack}}
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'''Metal interconnect layers''' refers to the series of electrically insulated metallic interconnecting wires that are used to connect together the various devices on an [[integrated circuit]].
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The '''metallization stack''' is a stacked series of electrically insulated [[metal interconnect layer|metallic interconnecting wires]] that are used to connect together the various devices on an [[integrated circuit]]. Adjacent layers are linked together through the use of electrical contacts and [[via]]s. Modern high-end integrated circuits can have as much as 10-20 metal layers in order to ease the task of routing an integrated circuit.
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Latest revision as of 14:06, 15 December 2017

The metallization stack is a stacked series of electrically insulated metallic interconnecting wires that are used to connect together the various devices on an integrated circuit. Adjacent layers are linked together through the use of electrical contacts and vias. Modern high-end integrated circuits can have as much as 10-20 metal layers in order to ease the task of routing an integrated circuit.


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