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{{mediatek title|Helio X30 (MT6799)}}
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{{mediatek title|Helio X30}}
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{{chip
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{{mpu
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|name=MediaTek Helio X30
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| name               = MediaTek Helio X30
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|no image=Yes
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| no image           = yes
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|designer=MediaTek
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| image              =
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|designer 2=ARM Holdings
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| image size          =
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|manufacturer=TSMC
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| caption            =  
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|model number=Helio X30
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| designer           = MediaTek
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|part number=MT6799
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| designer 2         = ARM Holdings
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|market=Mobile
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| manufacturer       = TSMC
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|market 2=Embedded
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| model number       = Helio X30
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|first announced=September 26, 2016
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| part number         =
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|first launched=February 27, 2017
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| part number 2      =  
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|family=Helio
+
| market             = Mobile
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|series=Helio X
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| market 2           = Embedded
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|frequency=2,500 MHz
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| first announced     = September 26, 2016
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|frequency 2=2,200 MHz
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| first launched     = February 27, 2017
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|frequency 3=1,900 MHz
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| last order          =
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|bus type=AMBA 4 AXI
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| last shipment      =
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|isa=ARMv8
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| release price      =
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|isa family=ARM
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|microarch=Cortex-A53
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| family             = Helio
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|microarch 2=Cortex-A73
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| series             = Helio X
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|microarch 3=Cortex-A35
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| locked              =
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|core name=Cortex-A35
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| frequency           = 2,500 MHz
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|core name 2=Cortex-A53
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| frequency 2         = 2,200 MHz
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|core name 3=Cortex-A73
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| frequency 3         = 1,900 MHz
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|process=10 nm
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| bus type           = AMBA 4 AXI
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|technology=CMOS
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| bus speed          =
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|word size=64 bit
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| bus rate            =
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|core count=10
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| bus links          =
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|thread count=10
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| clock multiplier    =
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|max cpus=1
+
 
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|max memory=8 GiB
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| isa family         = ARM
 +
| isa                = ARMv8
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| microarch           = Cortex-A53
 +
| microarch 2         = Cortex-A73
 +
| microarch 3         = Cortex-A35
 +
| platform            =
 +
| chipset            =
 +
| core name           = Cortex-A35
 +
| core name 2         = Cortex-A53
 +
| core name 3         = Cortex-A73
 +
| core family        =
 +
| core model          =
 +
| core stepping      =
 +
| process             = 10 nm
 +
| transistors        =
 +
| technology         = CMOS
 +
| die area            = <!-- XX mm² -->
 +
| die width          =
 +
| die length          =
 +
| word size           = 64 bit
 +
| core count         = 10
 +
| thread count       = 10
 +
| max cpus           = 1
 +
| max memory         =
 +
 
 +
| electrical          =
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| power              =
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| v core              =
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| v core tolerance    =
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| v io                =
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| v io 2              =
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| v io 3              =
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| sdp                =
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| tdp                =
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| tdp typical        =
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| ctdp down          =
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| ctdp down frequency =
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| ctdp up            =
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| ctdp up frequency  =
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| temp min            =
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| temp max            =
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| tjunc min          =
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| tjunc max          =
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| tcase min          =
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| tcase max          =
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| tstorage min        = <!-- °C -->
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| tstorage max        =
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| tambient min        =
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| tambient max        =
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| packaging          =
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| package 0          =
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| package 0 type      =
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| package 0 pins      =
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| package 0 pitch    =
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| package 0 width    =
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| package 0 length    =
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| package 0 height    =  
 
}}
 
}}
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'''Helio X30''' ('''MT6799''') is a {{arch|64}} [[deca-core]] [[ARM]] [[LTE]] system on a chip designed by [[MediaTek]] and launched in early [[2017]]. This SoC incorporates 3 independent clusters of cores (called "Tri-Cluster" by MediaTek) operating at varying degrees of performance designed for certain workloads (operating at 1.9 GHz, 2.2 GHz, and 2.5 GHz) and supports up to 8 GiB of quad-channel LPDDR4X-3732 memory. This SoC also incorporates a {{imgtec|PowerVR GT7400 Plus}} [[IGP]] operating at 800 MHz. The chip has a modem supporting [[LTE]] User Equipment (UE) category 10.
+
'''Helio X30''' is a {{arch|64}} [[deca-core]] [[ARM]] [[LTE]] system on a chip designed by [[MediaTek]] and launched in early [[2017]]. This SoC incorporates 3 independent clusters of cores (called "Tri-Cluster" by MediaTek) operating at varying degrees of performance designed for certain workloads (operating at 1.9 GHz, 2.2 GHz, and 2.5 GHz) and supports dual-channel LPDDR4-1866. This SoC also incorporates a {{imgtec|PowerVR GT7400 Plus}} [[IGP]] operating at 800 MHz. The chip has a modem supporting [[LTE]] User Equipment (UE) category 10.
  
 
== Architecture ==
 
== Architecture ==
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* Extreme Performance - 2x {{armh|Cortex-A73|l=arch}} @ 2.5 GHz
 
* Extreme Performance - 2x {{armh|Cortex-A73|l=arch}} @ 2.5 GHz
 
* Performance/Power Balance - 4x {{armh|Cortex-A53|l=arch}} @ 2.2 GHz
 
* Performance/Power Balance - 4x {{armh|Cortex-A53|l=arch}} @ 2.2 GHz
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* Power Efficiency - 4x {{armh|Cortex-A35|l=arch}} @ 1.9 GHz
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* Power Efficiency - 4x {{armh|Cortex-A35|l=arch}} @ 1. GHz
  
 
The three clusters are designed as a modified {{armh|big.LITTLE}} configuration.
 
The three clusters are designed as a modified {{armh|big.LITTLE}} configuration.
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== Memory controller ==
 
== Memory controller ==
 
{{memory controller
 
{{memory controller
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|type=LPDDR4X-3732
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|type=LPDDR4-1866
 
|ecc=No
 
|ecc=No
 
|max mem=8 GiB
 
|max mem=8 GiB
 
|controllers=1
 
|controllers=1
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|channels=4
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|channels=2
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|width=16 bit
 
 
|max bandwidth=27.81 GiB/s
 
|max bandwidth=27.81 GiB/s
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|bandwidth schan=6.95 GiB/s
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|bandwidth schan=13.9 GiB/s
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|bandwidth dchan=13.9 GiB/s
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|bandwidth dchan=27.81 GiB/s
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|bandwidth qchan=27.81 GiB/s
 
 
}}
 
}}
  
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== Utilizing devices ==
 
== Utilizing devices ==
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* [[used by::Meizu Pro 7]]
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<!--
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* [[used by::Meizu Pro 7 Plus]]
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* [[used by::xxxxxxxxxxxxxxxxxxxxxx]]
 +
-->
 
{{expand list}}
 
{{expand list}}
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== Die ==
 
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* [[10 nm process]]
 
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:[[File:x30 die shot.png|500px]]
 
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== Bibliography ==
 
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* Mair, Hugh, et al. "3.4 A 10nm FinFET 2.8 GHz tri-gear deca-core CPU complex with optimized power-delivery network for mobile SoC performance." Solid-State Circuits Conference (ISSCC), 2017 IEEE International. IEEE, 2017.
 

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Facts about "Helio X30 (MT6799) - MediaTek"
RDF feed
base frequency2,500 MHz (2.5 GHz, 2,500,000 kHz) +, 2,200 MHz (2.2 GHz, 2,200,000 kHz) + and 1,900 MHz (1.9 GHz, 1,900,000 kHz) +
bus typeAMBA 4 AXI +
core count10 +
core nameCortex-A35 +, Cortex-A53 + and Cortex-A73 +
designerMediaTek + and ARM Holdings +
familyHelio +
first announcedSeptember 26, 2016 +
first launchedFebruary 27, 2017 +
full page namemediatek/helio/mt6799 +
has 2g supporttrue +
has 3g supporttrue +
has 4g supporttrue +
has cdma2000 1x supporttrue +
has cdma2000 1xev-do supporttrue +
has cdma2000 supporttrue +
has csd supporttrue +
has dc-hsdpa supporttrue +
has e-utran supporttrue +
has ecc memory supportfalse +
has edge supporttrue +
has gprs supporttrue +
has gsm supporttrue +
has hsupa supporttrue +
has lte advanced supporttrue +
has td-scdma supporttrue +
has umts supporttrue +
instance ofmicroprocessor +
integrated gpuPowerVR GT7400 Plus +
integrated gpu base frequency800 MHz (0.8 GHz, 800,000 KHz) +
integrated gpu designerImagination Technologies +
isaARMv8 +
isa familyARM +
ldateFebruary 27, 2017 +
manufacturerTSMC +
market segmentMobile + and Embedded +
max cpu count1 +
max memory8,192 MiB (8,388,608 KiB, 8,589,934,592 B, 8 GiB, 0.00781 TiB) +
max memory bandwidth27.81 GiB/s (28,477.44 MiB/s, 29.861 GB/s, 29,860.76 MB/s, 0.0272 TiB/s, 0.0299 TB/s) +
max memory channels4 +
microarchitectureCortex-A53 +, Cortex-A73 + and Cortex-A35 +
model numberHelio X30 +
nameMediaTek Helio X30 +
part numberMT6799 +
process10 nm (0.01 μm, 1.0e-5 mm) +
seriesHelio X +
smp max ways1 +
supported memory typeLPDDR4X-3732 +
technologyCMOS +
thread count10 +
used byMeizu Pro 7 + and Meizu Pro 7 Plus +
user equipment category10 +
word size64 bit (8 octets, 16 nibbles) +