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{{mediatek title|Helio X30 (MT6799)}}
+
{{mediatek title|Helio X30}}
{{chip
+
{{mpu
|name=MediaTek Helio X30
+
| future              = Yes
|no image=Yes
+
| name               = MediaTek Helio X20
|designer=MediaTek
+
| no image           = yes
|designer 2=ARM Holdings
+
| image              =
|manufacturer=TSMC
+
| image size          =
|model number=Helio X30
+
| caption            =  
|part number=MT6799
+
| designer           = MediaTek
|market=Mobile
+
| designer 2         = ARM Holdings
|market 2=Embedded
+
| manufacturer       = TSMC
|first announced=September 26, 2016
+
| model number       = Helio X20
|first launched=February 27, 2017
+
| part number         =
|family=Helio
+
| part number 2      =  
|series=Helio X
+
| market             = Mobile
|frequency=2,500 MHz
+
| market 2           = Embedded
|frequency 2=2,200 MHz
+
| first announced     = September 26, 2016
|frequency 3=1,900 MHz
+
| first launched     =
|bus type=AMBA 4 AXI
+
| last order          =
|isa=ARMv8
+
| last shipment      =  
|isa family=ARM
+
| release price      =
|microarch=Cortex-A53
+
 
|microarch 2=Cortex-A73
+
| family             = Helio
|microarch 3=Cortex-A35
+
| series             = Helio X
|core name=Cortex-A35
+
| locked              =
|core name 2=Cortex-A53
+
| frequency           = 2,800 MHz
|core name 3=Cortex-A73
+
| frequency 2         = 2,200 MHz
|process=10 nm
+
| frequency 3         = 2,000 MHz
|technology=CMOS
+
| bus type           = AMBA 4 AXI
|word size=64 bit
+
| bus speed          =
|core count=10
+
| bus rate            =
|thread count=10
+
| bus links          =
|max cpus=1
+
| clock multiplier    =
|max memory=8 GiB
+
 
 +
| isa family         = ARM
 +
| isa                = ARMv8
 +
| microarch           = Cortex-A53
 +
| microarch 2         = Cortex-A73
 +
| platform            =
 +
| chipset            =  
 +
| core name           = Cortex-A53
 +
| core name 2         = Cortex-A73
 +
| core family        =
 +
| core model          =
 +
| core stepping      =  
 +
| process             = 20 nm
 +
| transistors        =
 +
| technology         = CMOS
 +
| die area            = <!-- XX mm² -->
 +
| die width          =
 +
| die length          =
 +
| word size           = 64 bit
 +
| core count         = 10
 +
| thread count       = 10
 +
| max cpus           = 1
 +
| max memory         =
 +
 
 +
| electrical          =
 +
| power              =
 +
| v core              =
 +
| v core tolerance    =
 +
| v io                =
 +
| v io 2              =
 +
| v io 3              =
 +
| sdp                =
 +
| tdp                =
 +
| tdp typical        =
 +
| ctdp down          =
 +
| ctdp down frequency =
 +
| ctdp up            =
 +
| ctdp up frequency  =
 +
| temp min            =
 +
| temp max            =
 +
| tjunc min          =
 +
| tjunc max          =
 +
| tcase min          =
 +
| tcase max          =
 +
| tstorage min        = <!-- °C -->
 +
| tstorage max        =
 +
| tambient min        =
 +
| tambient max        =
 +
 
 +
| packaging          =
 +
| package 0          =
 +
| package 0 type      =
 +
| package 0 pins      =
 +
| package 0 pitch    =
 +
| package 0 width    =
 +
| package 0 length    =
 +
| package 0 height    =  
 
}}
 
}}
'''Helio X30''' ('''MT6799''') is a {{arch|64}} [[deca-core]] [[ARM]] [[LTE]] system on a chip designed by [[MediaTek]] and launched in early [[2017]]. This SoC incorporates 3 independent clusters of cores (called "Tri-Cluster" by MediaTek) operating at varying degrees of performance designed for certain workloads (operating at 1.9 GHz, 2.2 GHz, and 2.5 GHz) and supports up to 8 GiB of quad-channel LPDDR4X-3732 memory. This SoC also incorporates a {{imgtec|PowerVR GT7400 Plus}} [[IGP]] operating at 800 MHz. The chip has a modem supporting [[LTE]] User Equipment (UE) category 10.
+
'''Helio X30''' is a {{arch|64}} [[deca-core]] [[ARM]] [[LTE]] system on a chip designed by [[MediaTek]] and set to be launched in early [[2017]]. This SoC incorporates 3 independent clusters of cores (called "Tri-Cluster" by MediaTek) operating at varying degrees of performance designed for certain workloads (operating at 2 GHz, 2.2 GHz, and 2.8 GHz) and supports dual-channel LPDDR3-1866. This SoC also incorporates a {{imgtec|PowerVR GT7400}} [[IGP]] operating at 870 MHz. The chip has a modem supporting [[LTE]] User Equipment (UE) category 10.
  
 
== Architecture ==
 
== Architecture ==
 
The Helio X30 is designed is composed of 3 individual clusters of CPU cores depending on the level of performance required by the active applications.
 
The Helio X30 is designed is composed of 3 individual clusters of CPU cores depending on the level of performance required by the active applications.
  
* Extreme Performance - 2x {{armh|Cortex-A73|l=arch}} @ 2.5 GHz
+
* Extreme Performance - 2x {{armh|Cortex-A73|l=arch}} @ 2.8 GHz
 
* Performance/Power Balance - 4x {{armh|Cortex-A53|l=arch}} @ 2.2 GHz
 
* Performance/Power Balance - 4x {{armh|Cortex-A53|l=arch}} @ 2.2 GHz
* Power Efficiency - 4x {{armh|Cortex-A35|l=arch}} @ 1.9 GHz
+
* Power Efficiency - 4x {{armh|Cortex-A53|l=arch}} @ 2 GHz
  
 
The three clusters are designed as a modified {{armh|big.LITTLE}} configuration.
 
The three clusters are designed as a modified {{armh|big.LITTLE}} configuration.
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== Memory controller ==
 
== Memory controller ==
 
{{memory controller
 
{{memory controller
|type=LPDDR4X-3732
+
|type=LPDDR3-1866
 
|ecc=No
 
|ecc=No
 
|max mem=8 GiB
 
|max mem=8 GiB
 
|controllers=1
 
|controllers=1
|channels=4
+
|channels=2
|width=16 bit
 
 
|max bandwidth=27.81 GiB/s
 
|max bandwidth=27.81 GiB/s
|bandwidth schan=6.95 GiB/s
+
|bandwidth schan=13.9 GiB/s
|bandwidth dchan=13.9 GiB/s
+
|bandwidth dchan=27.81 GiB/s
|bandwidth qchan=27.81 GiB/s
 
 
}}
 
}}
  
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== Graphics ==
 
== Graphics ==
 
{{integrated graphics
 
{{integrated graphics
| gpu                = PowerVR GT7400 Plus
+
| gpu                = PowerVR GT7400
 
| device id          =  
 
| device id          =  
 
| designer            = Imagination Technologies
 
| designer            = Imagination Technologies
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| max displays        =  
 
| max displays        =  
 
| max memory          =  
 
| max memory          =  
| frequency          = 800 MHz
+
| frequency          = 870 MHz
  
 
| output dsi          = Yes
 
| output dsi          = Yes
  
| max res dsi        = 3840x2160
+
| max res dsi        = 2560x1600
  
 
| direct3d ver        = 11.2
 
| direct3d ver        = 11.2
| opencl ver          = 2.0
+
| opencl ver          = 1.2
| opengl ver          = 3.3
+
| opengl ver          = 3.1
| opengl es ver      = 3.2
+
| opengl es ver      = 3.1
 
| vulkan ver          = 1.0
 
| vulkan ver          = 1.0
 
}}
 
}}
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| ue cat            = 10
 
| ue cat            = 10
 
}}
 
}}
 
== Image ==
 
* Integrated image signal processor supports 28 MP
 
* Supports image stabilization
 
* Supports video stabilization
 
* Supports noise reduction
 
* Supports lens shading correction
 
* Supports AE/AWB/AF
 
* Supports edge enhancement
 
* Supports face detection and visual tracking
 
* Hardware JPEG encoder
 
 
== Video ==
 
* Video encoding 4K2K @ 30fps with H.265 and HDR
 
* Video decoding 4K2K @ 30fps, h.264, h.265 / HEVC, MPEG-1/2/4, VC-1, VP-8, VP-9
 
 
== Audio ==
 
* Audio content sampling rates 8kHz to 192kHz
 
* Audio content sampling format 8-bit/16-bit/24-bit Mono/Stereo
 
* I2S, PCM
 
* Encode: AMR-NB, AMR-WB, AAC, OGG, ADPCM
 
* Decode: WAV, MP3, MP2, AAC, AMR-NB, AMR-WB, MIDI, Vorbis, APE, AAC-plus v1, AAC-plus v2, FLAC, WMA, ADPCM
 
* 7.1 channel MHL output
 
 
== Utilizing devices ==
 
* [[used by::Meizu Pro 7]]
 
* [[used by::Meizu Pro 7 Plus]]
 
{{expand list}}
 
 
== Die ==
 
* [[10 nm process]]
 
 
:[[File:x30 die shot.png|500px]]
 
 
== Bibliography ==
 
* Mair, Hugh, et al. "3.4 A 10nm FinFET 2.8 GHz tri-gear deca-core CPU complex with optimized power-delivery network for mobile SoC performance." Solid-State Circuits Conference (ISSCC), 2017 IEEE International. IEEE, 2017.
 

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base frequency2,500 MHz (2.5 GHz, 2,500,000 kHz) +, 2,200 MHz (2.2 GHz, 2,200,000 kHz) + and 1,900 MHz (1.9 GHz, 1,900,000 kHz) +
bus typeAMBA 4 AXI +
core count10 +
core nameCortex-A35 +, Cortex-A53 + and Cortex-A73 +
designerMediaTek + and ARM Holdings +
familyHelio +
first announcedSeptember 26, 2016 +
first launchedFebruary 27, 2017 +
full page namemediatek/helio/mt6799 +
has 2g supporttrue +
has 3g supporttrue +
has 4g supporttrue +
has cdma2000 1x supporttrue +
has cdma2000 1xev-do supporttrue +
has cdma2000 supporttrue +
has csd supporttrue +
has dc-hsdpa supporttrue +
has e-utran supporttrue +
has ecc memory supportfalse +
has edge supporttrue +
has gprs supporttrue +
has gsm supporttrue +
has hsupa supporttrue +
has lte advanced supporttrue +
has td-scdma supporttrue +
has umts supporttrue +
instance ofmicroprocessor +
integrated gpuPowerVR GT7400 Plus +
integrated gpu base frequency800 MHz (0.8 GHz, 800,000 KHz) +
integrated gpu designerImagination Technologies +
isaARMv8 +
isa familyARM +
ldateFebruary 27, 2017 +
manufacturerTSMC +
market segmentMobile + and Embedded +
max cpu count1 +
max memory8,192 MiB (8,388,608 KiB, 8,589,934,592 B, 8 GiB, 0.00781 TiB) +
max memory bandwidth27.81 GiB/s (28,477.44 MiB/s, 29.861 GB/s, 29,860.76 MB/s, 0.0272 TiB/s, 0.0299 TB/s) +
max memory channels4 +
microarchitectureCortex-A53 +, Cortex-A73 + and Cortex-A35 +
model numberHelio X30 +
nameMediaTek Helio X30 +
part numberMT6799 +
process10 nm (0.01 μm, 1.0e-5 mm) +
seriesHelio X +
smp max ways1 +
supported memory typeLPDDR4X-3732 +
technologyCMOS +
thread count10 +
used byMeizu Pro 7 + and Meizu Pro 7 Plus +
user equipment category10 +
word size64 bit (8 octets, 16 nibbles) +