{{intel title|Skylake|arch}}

|name=Skylake

|isa=x86-16

|isa 3=x86-64

'''Skylake''' ('''SKL''') is [[Intel]]'s successor to {{\\|Broadwell}}, a [[14 nm process]] [[microarchitecture]] for mainstream desktops, servers, and mobile devices. Skylake succeeded the short-lived {{\\|Broadwell}} which experienced severe delays. Skylake is the "Architecture" phase as part of Intel's {{intel|PAO}} model. The microarchitecture was developed by Intel's R&D center in [[wikipedia:Haifa, Israel|Haifa, Israel]].

For desktop and mobile, Skylake is branded as 6th Generation Intel {{intel|Core i3}}, {{intel|Core i5}}, {{intel|Core i7}}, and {{intel|Core i9}} processors. For workstations it's branded as {{intel|Xeon E3|Xeon E3 v5}} For scalable server class processors, Intel branded it as {{intel|Xeon Bronze}}, {{intel|Xeon Silver}}, {{intel|Xeon Gold}}, and {{intel|Xeon Platinum}}.

! Core !! Abbrev !! Target

| {{intel|Skylake Y|l=core}} || SKL-Y || 2-in-1s detachable, tablets, and computer sticks

| {{intel|Skylake U|l=core}} || SKL-U || Light notebooks, portable All-in-Ones (AiOs), Minis, and conference room

| {{intel|Skylake H|l=core}} || SKL-H || Ultimate mobile performance, mobile workstations

| {{intel|Skylake S|l=core}} || SKL-S || Desktop performance to value, AiOs, and minis

| {{intel|Skylake X|l=core}} || SKL-X || High-end desktops & enthusiasts market

|-

| {{intel|Skylake DT|l=core}} || SKL-DT || Workstations & entry-level servers

[[File:xeon scalable family decode.png|thumb|right|250px|New Xeon branding]]

Intel released Skylake under 7 main brand families.

 

Additionally, Intel introduced a number of new server chip families with the introduction of {{intel|Skylake SP|l=core}}.

! Cores !! {{intel|Hyper-Threading|HT}} !! {{x86|AVX}} !! {{x86|AVX2}} !! {{x86|AVX-512}} !! {{intel|Turbo Boost|TBT}} !! [[ECC]]

| rowspan="2" | [[File:intel celeron (2015).png|50px|link=intel/celeron]] || rowspan="2" |  {{intel|Celeron}} || style="text-align: left;" | Entry-level Budget || rowspan="2" | [[dual-core|dual]] || {{tchk|no}} || {{tchk|no}} || {{tchk|no}} || {{tchk|no}} || {{tchk|no}} || {{tchk|no}}

| style="text-align: left;" | Entry-level Budget (Embedded) || {{tchk|no}} || {{tchk|no}} || {{tchk|no}} || {{tchk|no}} || {{tchk|no}} || {{tchk|yes}}

| rowspan="2" | [[File:intel pentium (2015).png|50px|link=intel/pentium_(2009)]] || rowspan="2" | {{intel|Pentium (2009)|Pentium}} || style="text-align: left;" | Budget (Mobile) || rowspan="2" | dual || {{tchk|yes}} || {{tchk|no}} || {{tchk|no}} || {{tchk|no}} || {{tchk|no}} || {{tchk|no}}

| style="text-align: left;" | Budget (Desktop) || {{tchk|no}} || {{tchk|no}} || {{tchk|no}} || {{tchk|no}} || {{tchk|no}} || {{tchk|yes}}

| rowspan="2" | [[File:core i3 logo (2015).png|50px|link=intel/core_i3]] || rowspan="2" |  {{intel|Core i3}} || style="text-align: left;" | Low-end Performance || rowspan="2" |  dual || {{tchk|yes}} || {{tchk|yes}} || {{tchk|yes}} || {{tchk|no}} || {{tchk|no}} || {{tchk|no}}

| style="text-align: left;" | Low-end Performance<br>(Desktop/Embedded) || {{tchk|yes}} || {{tchk|yes}} || {{tchk|yes}} || {{tchk|no}} || {{tchk|no}} || {{tchk|yes}}

| rowspan="2" | [[File:core i5 logo (2015).png|50px|link=intel/core_i5]] || rowspan="2" | {{intel|Core i5}} || rowspan="2" style="text-align: left;" | Mid-range Performance || dual || {{tchk|yes}} || {{tchk|yes}} || {{tchk|yes}} || {{tchk|no}} || {{tchk|yes}} || {{tchk|no}}

|[[quad-core|quad]] || {{tchk|no}} || {{tchk|yes}} || {{tchk|yes}} || {{tchk|no}} || {{tchk|yes}} || {{tchk|no}}

| rowspan="3" | [[File:core i7 logo (2015).png|50px|link=intel/core_i7]] || rowspan="3" | {{intel|Core i7}} || rowspan="2" style="text-align: left;" | High-end Performance || dual || {{tchk|yes}} || {{tchk|yes}} || {{tchk|yes}} || {{tchk|no}} || {{tchk|yes}} || {{tchk|no}}

|quad || {{tchk|yes}} || {{tchk|yes}} || {{tchk|yes}} || {{tchk|no}} || {{tchk|yes}} || {{tchk|no}}

| [[File:xeon logo (2015).png|50px|link=intel/xeon e3]] ||  {{intel|Xeon E3}} || style="text-align: left;" | Workstation/dense servers || quad || {{tchk|some}} || {{tchk|yes}} || {{tchk|yes}} || {{tchk|no}} || {{tchk|yes}} || {{tchk|yes}}

| rowspan="2" | [[File:xeon gold (2017).png|50px]] || {{intel|Xeon Gold}} 5000 || style="text-align: left;" | High performance || [[4 cores|4]] - [[14 cores|14]] || {{tchk|yes}} || {{tchk|yes}} || {{tchk|yes}} || 1 || 2 || Up to 4

Skylake was first demonstrated at the 2014 Intel Developer Forum in San Francisco on September 9 with the goals of launching in the second half of 2015. Skylake-based {{intel|Core X}} was introduced in May 2017 while {{intel|Skylake SP|l=core}} was introduced in July 2017.

Skylake uses the same [[14 nm process]] used for the Broadwell microarchitecture for all mainstream consumer parts (Core, Celeron, et al). Unlike mainstream Skylake models, the enthusiasts ({{intel|Skylake X|l=core}}) models are fabricated on Intel's enhanced 14+ nm process which is used by {{\\|Kaby Lake}} (see {{intel|kaby lake#Process_Technology|Kaby Lake § Process Technology}} for more info).

| rowspan="4" | Microsoft || rowspan="4" | Windows || style="background-color: #ffdad6;" | Windows Vista || No Support

| style="background-color: #d6ffd8;" | Windows 7 || rowspan="2" | Support ends July 2017

| rowspan="2" | {{intel|Skylake DT|DT|l=core}}/{{intel|Skylake H|H|l=core}}/{{intel|Skylake S|S|l=core}}/{{intel|Skylake X|X|l=core}} || 0 || 0x6 || 0x5 || 0xE

**** Limits motherboard trace design to 7 inches max from (down from 8) from the CPU to chipset

*** 1,152 GFLOPS @ 1 GHz

 

 

*** hex-channel DDR4-2666 (from quad-channel)

* Most ALU operations have 4 op/cycle 1 for 8 and 32-bit registers. 64-bit ops are still limited to 3 op/cycle. (16-bit throughput varies per op, can be 4, 3.5 or 2 op/cycle).

* MOVSX and MOVZX have 4 op/cycle throughput for 16->32 and 32->64 forms, in addition to Haswell's 8->32, 8->64 and 16->64 bit forms.

* ADC and SBB have throughput of 1 op/cycle, same as Haswell.

* Vector moves have throughput of 4 op/cycle (move elimination).

* Not only zeroing vector vpXORxx and vpSUBxx ops, but also vPCMPxxx on the same register, have throughput of 4 op/cycle.

* Vector ALU ops are often "standardized" to latency of 4. for example, vADDPS and vMULPS used to have L of 3 and 5, now both are 4.

* Fused multiply-add ops have latency of 4 and throughput of 0.5 op/cycle.

* Throughput of vADDps, vSUBps, vCMPps, vMAXps, their scalar and double analogs is increased to 2 op/cycle.

* Throughput of vPSLxx and vPSRxx with immediate (i.e. fixed vector shifts) is increased to 2 op/cycle.

** {{x86|SGX1|<code>SGX1</code>}} - Software Guard Extensions, Version 1

** {{x86|MPX|<code>MPX</code>}} -Memory Protection Extensions

** {{x86|XSAVEC|<code>XSAVEC</code>}} - Save processor extended states with compaction to memory

** {{x86|XSAVES|<code>XSAVES</code>}} - Save processor supervisor-mode extended states to memory.

** {{x86|CLFLUSHOPT|<code>CLFLUSHOPT</code>}} - Flush & Invalidates memory operand and its associated cache line (All L1/L2/L3 etc..)

====== Entire SoC Overview (dual) ======

====== Entire SoC Overview (quad) ======

====== Individual Core ======

[[File:skylake block diagram.svg]]

====== Gen9 ======

**** 4 entries; fully associative

* Cache

** L2 Cache:

*** Unified, 1 MiB, 16-way set associative

*** 1.375 MiB/s, shared across all cores

**** Note that some models have non-default cache sizes which are larger due to some disabled cores

== Overview (Client) ==

Accompanying the cores is the {{\\|Gen9}} [[integrated graphics]] unit which comes in a number of different tiers ranging from just 12 execution units (used in the ultra-low power models) all the way the GT4 ({{\\|gen9#Scalability|Gen9 § Pipeline}}) with 72 execution units boasting a peak performance of up to 2,534.4 GFLOPS (HF) / 1,267.2 GFLOPS (SP) on the highest-end workstation model. The two highest-tier models are also accompanied by dedicated [[eDRAM]] ranging from 64 GiB to 120 GiB in capacity. The eDRAM is packaged along with the SoC in the same package.

== Core (Client) ==

This design philosophy has changed with Skylake. In order to better accommodate the different functionalities of each segment without sacrificing features or making unnecessary compromises Intel went with a configurable core. The Skylake core is a single development project, making up a master superset core. The project result in two derivatives: one for servers and one for clients. All mainstream models (from {{intel|Celeron}}/{{intel|Pentium (2009)|Pentium}} all the way up to {{intel|Core i7}}/{{intel|Xeon E3}}) use the client core configuration. Server models (e.g. {{intel|Xeon E5}}/{{intel|Xeon E7}}) will be using the new server configuration.

Each core enjoys a slice of a third level of cache that is shared by all the core. In the client configuration for Skylake, there are either [[two cores]] or [[four cores]] connected while in the server configuration, up to [[28 cores]] may be hooked together on a single chip.

The front-end is is tasked with the challenge of fetching the complex [[x86]] instructions from memory, decoding them, and delivering them to the execution units. In other words, the front end needs to be able to consistently deliver enough [[µOPs]] from the instruction code stream to keep the back-end busy. When the back-end is not being fully utilized, the core is not reaching its full performance. A poorly or under-performing front-end will translate directly to a poorly performing core. This challenge is further complicated by various redirection such as branches and the complex nature of the [[x86]] instructions themselves.

On their first pass, instructions should have already been prefetched from the [[L2 cache]] and into the [[L1 cache]]. The L1 is a 32 [[KiB]], 8-way set associative cache, identical in size and organization to {{intel|microarchitectures|previous generations}}. Skylake fetching is done on a 16-byte fetch window. A window size that has not changed in a number of generations. Up to 16 bytes of code can be fetched each cycle. Note that fetcher is shared evenly between two thread, so that each thread gets every other cycle. At this point they are still [[macro-ops]] (i.e. variable-length [[x86]] architectural instruction). Instructions are brought into the pre-decode buffer for initial preparation.

[[x86]] instructions are complex, variable length, have inconsistent encoding, and may contain multiple operations. At the pre-decode buffer the instructions boundaries get detected and marked. This is a fairly difficult task because each instruction can vary from a single byte all the way up to fifteen. Moreover, determining the length requires inspecting a couple of bytes of the instruction. In addition boundary marking, prefixes are also decoded and checked for various properties such as branches. As with previous microarchitectures, the pre-decoder has a [[throughput]] of 6 [[macro-ops]] per cycle or until all 16 bytes are consumed, whichever happens first. Note that the predecoder will not load a new 16-byte block until the previous block has been fully exhausted. For example, suppose a new chunk was loaded, resulting in 7 instructions. In the first cycle, 6 instructions will be processed and a whole second cycle will be wasted for that last instruction. This will produce the much lower throughput of 3.5 instructions per cycle which is considerably less than optimal. Likewise, if the 16-byte block resulted in just 4 instructions with 1 byte of the 5th instruction received, the first 4 instructions will be processed in the first cycle and a second cycle will be required for the last instruction. This will produce an average throughput of 2.5 instructions per cycle. Note that there is a special case for {{x86|length-changing prefix}} (LCPs) which will incur additional pre-decoding costs. Real code is often less than 4 bytes which usually results in a good rate.  

{{see also|Macro-Operation Fusion}}

The pre-decoded instructions are delivered to the Instruction Queue (IQ). In {{\\|Broadwell}}, the Instruction Queue has been increased to 25 entries duplicated over for each thread (i.e. 50 total entries). It's unclear if that has changed with Skylake. One key optimization the instruction queue does is [[macro-op fusion]]. Skylake can fuse two [[macro-ops]] into a single complex one in a number of cases. In cases where a {{x86|test}} or {{x86|compare}} instruction with a subsequent conditional jump is detected, it will be converted into a single compare-and-branch instruction. Those fused instructions remain fused throughout the entire pipeline and get executed as a single operation by the branch unit thereby saving bandwidth everywhere. Only one such fusion can be performed each cycle.

Up to five pre-decoded instructions are sent to the decoders each cycle. Like the fetchers, the Decoders alternate between the two thread each cycle. Decoders read in [[macro-operations]] and emit regular, fixed length [[µOPs]]. Skylake represents a big genealogical change from the last couple of microarchitectures. Skylake's pipeline is wider than it predecessors; Skylake adds another [[simple decoder]]. The five decoders are asymmetric; the first one, Decoder 0,  is a [[complex decoder]] while the other four are [[simple decoders]]. A simple decoder is capable of translating instructions that emit a single fused-[[µOP]]. By contrast, a [[complex decoder]] can decode anywhere from one to four fused-µOPs. Skylake is now capable of decoding 5 macro-ops per cycle or 25% more than {{\\|Broadwell}}, however this does not translates directly to direct IPC uplift to due to various other more restricting points in the pipeline. Intel chose not increase the number of complex decoders because it's much harder to extract additional parallelism from the µOPs emitted by a complex instruction. Overall up to 5 simple instructions can be decoded each cycle with lesser amounts if the complex decoder needs to emit addition µOPs; i.e., for each additional µOP the complex decoder needs to emit, 1 less simple decoder can operate. In other words, for each additional µOP the complex decoder emits, one less decoder is active.

[[x86]] has dedicated [[stack machine]] operations. Instructions such as <code>{{x86|PUSH}}</code>, <code>{{x86|POP}}</code>, as well as <code>{{x86|CALL}}</code>, and <code>{{x86|RET}}</code> all operate on the [[stack pointer]] (<code>{{x86|ESP}}</code>). Without any specialized hardware, such operations would would need to be sent to the back-end for execution using the general purpose ALUs, using up some of the bandwidth and utilizing scheduler and execution units resources. Since {{\\|Pentium M}}, Intel has been making use of a [[Stack Engine]]. The Stack Engine has a set of three dedicated adders it uses to perform and eliminate the stack-updating µOPs (i.e. capable of handling three additions per cycle). Instruction such as <code>{{x86|PUSH}}</code> are translated into a store and a subtraction of 4 from <code>{{x86|ESP}}</code>. The subtraction in this case will be done by the Stack Engine. The Stack Engine sits after the [[instruction decode|decoders]] and monitors the µOPs stream as it passes by. Incoming stack-modifying operations are caught by the Stack Engine. This operation alleviate the burden of the pipeline from stack pointer-modifying µOPs. In other words, it's cheaper and faster to calculate stack pointer targets at the Stack Engine than it is to send those operations down the pipeline to be done by the execution units (i.e., general purpose ALUs).

Decoding the variable-length, inconsistent, and complex [[x86]] instructions is a nontrivial task. It's also expensive in terms of performance and power. Therefore, the best way for the pipeline to avoid those things is to simply not decode the instructions. This is the job of the [[µOP cache]] or the Decoded Stream Buffer (DSB). Skylake's µOP cache is organized similarly to previous generations like {{\\|Sandy Bridge}}, however both the bandwidth and the tracking window was increased. The cache is organized into 32 sets of 8 cache lines with each line holding up to 6 µOP for a total of 1,536 µOPs. Whereas previously (e.g. {{\\|Haswell}}) the µOP cache operated on 32-byte windows, in Skylake the window size has been doubled to 64-bytes. The micro-operation cache is competitively shared between the two threads and can also hold pointers to the microcode. The µOP cache has an average hit rate of 80%.

A hit in the µOP allows for up to 6 µOP (i.e., entire line) per cycle to be sent directly to the Instruction Decode Queue (IDQ), bypassing all the pre-decoding and decoding that would otherwise have to be done. Whereas the legacy decode path works in 16-byte instruction fetch windows, the µOP cache has no such restriction and can deliver 6 µOP/cycle corresponding to the much bigger 64-byte window. Previously (e.g., {{\\|Broadwell}}), the bandwidth was lower at 4 µOP per cycle. The 1.5x bandwidth increase greatly improves the numbers of µOP that the back-end can take advantage of in the [[out-of-order]] part of the machine.

* '''NOTE:''' A microcode update appear to have disabled the LSD on client processors. See [[#Front-end_2|§ Server Front-end]].

Like the front-end, the [[Reorder Buffer]] has been increased to 224 entries, 32 entries more than {{\\|Broadwell}}. It is at this stage that [[architectural registers]] are mapped onto the underlying [[physical registers]]. Other additional bookkeeping tasks are also done at this point such as allocating resources for stores, loads, and determining all possible scheduler ports. Register renaming is also controlled by the [[Register Alias Table]] (RAT) which is used to mark where the data we depend on is coming from (after that value, too, came from an instruction that has previously been renamed). In {{intel|microarchitectures|previous microarchitectures}}, the RAT could handle 4 µOPs each cycle. Intel has not disclosed if that has changed in Skylake but it's possible. If this has not change, Skylake can rename any four registers per cycle. This includes the same register renamed four times in a single cycle. If the rename has not increased in Skylake, some aspects of improvements that were done in the prefetch/decode stages are effectively lost. Note that the ROB still operates on fused µOPs, therefore 4 µOPs can effectively be as high as 8 µOPs.

Skylake as a number of optimizations it performs prior to entering the out-of-order and renaming part. Three of those optimizations include [[Move Elimination]] and [[Zeroing Idioms]], and [[Ones Idioms]]. A Move Elimination is capable of eliminating register-to-register moves (including chained moves) prior to bookkeeping at the ROB, allowing those µOPs to save resources and eliminating them entirely. Eliminated moves are zero latency and are entirely removed from the pipeline. This optimization does not always succeed; when it fails, the operands were simply not ready. On average this optimization is almost always successful (upward of 85% in most cases). Move elimination works on all 32- and 64-bit GP integer registers as well as all 128- and 256-bit vector registers.

| Not only does this instruction get eliminated at the ROB, but it's actually encoded as just 2 bytes <code>31 C0</code> vs the 4 bytes for <code>{{x86|mov}} {{x86|eax}}, 0x0</code> which is encoded as <code>b8 00 00 00 00</code>.

The [[ones idioms]] is another dependency breaking idiom that can be optimized. In all the various {{x86|PCMPEQ|PCMPEQx}} instructions that perform packed comparison the same register with itself always set all bits to one. On those cases, while the µOP still has to be executed, the instructions may be scheduled as soon as possible because all the decencies are resolved.

The scheduler itself was increased by 50%; with up to 97 entries (from 64 in {{\\|Broadwell}}) being competitively shared between the two threads. Skylake continues with a unified design; this is in contrast to designs such as [[AMD]]'s {{amd|Zen|l=arch}} which uses a split design each one holding different types of µOPs. Scheduler includes the two register files for integers and vectors. It's in those [[register files]] that output operand data is store. In Skylake, the [[integer]] [[register file]] was also slightly increased from 160 entries to 180.

At this point µOPs are not longer fused and will be dispatched to the execution units independently. The scheduler holds the µOPs while they wait to be executed. A µOP could be waiting on an operand that has not arrived (e.g., fetched from memory or currently being calculated from another µOPs) or because the execution unit it needs is busy. Once the µOP is ready, they are dispatched through their designated port. The scheduler will send the oldest ready µOP to be executed on each of the eight ports each cycle.

The scheduler had its ports rearranged to better balance various instructions. For example, divide and [[sqrt]] instructions latency and throughput were improved. The latency and throughput of [[floating point]] ADD, MUL, and FMA were made uniformed at 4 cycles with a throughput of 2 µOPs/clock. Likewise the latency of {{x86|AES|AES instructions}} were significantly reduced from 7 cycles down to 4.

Skylake's memory subsystem is in charge of the loads and store requests and ordering. Since {{\\|Haswell}}, it's possible to sustain two memory reads (on ports 2 and 3) and one memory write (on port 4) each cycle. Each memory operation can be of any register size up to 256 bits. Skylake memory subsystem has been improved. The store buffer has been increased by 14 entries from {{\\|Broadwell}} to 56 for a total of 128 simultaneous memory operations in-flight or roughly 60% of all µOPs. Special care was taken to reduce the penalty for page-split loads; previously scenarios involving page-split loads were thought to be rarer than they actually are. This was addressed in Skylake with page-split loads are now made equal to other splits loads. Expect page split load penalty down to 5 cycles from 100 cycles in {{\\|Broadwell}}. The average latency to forward a load to store has also been improved and stores that miss in the L1$ generate L2$ requests to the next level cache much earlier in Skylake than before.

The L2 to L1 bandwidth in Skylake is the same as {{\\|Haswell}} at 64 bytes per cycle in either direction. Note that one operation can be done each cycle; i.e., the L1 can either receive data from the L1 or send data to the Load/Store buffers each cycle, but not both. Latency from L2$ to L3$ has also been increased from 4 cycles/line to 2 cycles/line. The bandwidth from the level 2 cache to the shared level 3 is 32 bytes per cycle.

== Overview (Server) ==

 

 

 

 

 

 

 

 

 

 

 

 

 

It should be pointed out that the directory-base coherency optimizations that were done in previous generations have been furthered improved with Skylake - particularly OSB, {{intel|HitME}} cache, IO directory cache. Skylake maintained support for {{intel|Opportunistic Snoop Broadcast}} (OSB) which allows the network to opportunistically make use of the UPI links when idle or lightly loaded thereby avoiding an expensive memory directory lookup. With the mesh network and distributed CHAs, HitME is now distributed and scales with the CHAs, enhancing the speeding up of cache-to-cache transfers (Those are your migratory cache lines that frequently get transferred between nodes). Specifically for I/O operations, the I/O directory cache (IODC), which was introduced with {{intel|Haswell|l=arch}}, improves stream throughput by eliminating directory reads for InvItoE from snoopy caching agent. Previously this was implemented as a 64-entry directory cache to complement the directory in memory. In Skylake, with a distributed CHA at each node, the IODC is implemented as an eight-entry directory cache per CHA.

 

In previous generations Intel had a feature called {{intel|cluster-on-die}} (COD) which was introduced with {{intel|Haswell|l=arch}}. With Skylake, there's a similar feature called {{intel|sub-NUMA cluster}} (SNC). With a memory controller physically located on each side of the die, SNC allows for the creation of two localized domains with each memory controller belonging to each domain. The processor can then map the addresses from the controller to the distributed home ages and LLC in its domain. This allows executing code to experience lower LLC and memory latency within its domain compared to accesses outside of the domain.

 

It should be pointed out that in contrast to COD, SNC has a unique location for every adddress in the LCC and is evenr duplicated across LLC banks (previously, COD cache lines could have copies). Additionally, on multiprocessor system, address mapped to memory on remote sockets are still uniformally distributed across all LLC banks irrespective of the localized SNC domain.

 

In the last couple of generations, Intel has been utilizing {{intel|QuickPath Interconnect}} (QPI) which served as a high-speed point-to-point interconnect. QPI has been replaced the {{intel|Ultra Path Interconnect}} (UPI) which is higher-efficiency coherent interconnect for scalable systems, allowing multiple processors to share a single shared address space. Depending on the exact model, each processor can have either either two or three UPI links connecting to the other processors.

 

UPI links eliminate some of the scalability limited that surfaced in QPI. They use directory-based home snoop coherency protocol and operate at up either 10.4 GT/s or 9.6 GT/s. This is quite a bit different form previous generations. In addition to the various improvements done to the protocol layer, {{intel|Skylake SP|l=arch}} now implements a distributed CHA that is situated along with the LLC bank on each core. It's in charge of tracking the various requests form the core as well as responding to snoop requests from both local and remote agents. The ease of distributing the home agent is a result of Intel getting rid of the requirement on preallocation of resources at the home agent. This also means that future architectures should be able to scale up well.

 

Depending on the exact model, Skylake processors can scale from 2-way all the way up to 8-way multiprocessing. Note that the high-end models that support 8-way multiprocessing also only come with three UPI links for this purpose while the lower end processors can have either two or three UPI links. Below are the typical configurations for those processors.

 

 

<div style="display: inline-block;">

<div style="float: left; margin: 15px; text-align: center;">'''2-way SMP; 2 UPI links'''<br><br>[[File:skylake sp 2-way 2 upi.svg|400px]]</div>

<div style="float: left; margin: 15px; text-align: center;">'''2-way SMP; 3 UPI links'''<br><br>[[File:skylake sp 2-way 3 upi.svg|400px]]</div>

 

 

<div style="display: inline-block;">

<div style="float: left; margin: 15px; text-align: center;">'''4-way SMP; 2 UPI links'''<br><br>[[File:skylake sp 4-way 2 upi.svg|400px]]</div>

<div style="float: left; margin: 15px; text-align: center;">'''4-way SMP; 3 UPI links'''<br><br>[[File:skylake sp 4-way 3 upi.svg|400px]]</div>

 

 

<div style="display: inline-block;">

<div style="text-align: center;">'''8-way SMP; 3 UPI links'''<br><br>[[File:skylake sp 8-way 3 upi.svg|400px]]</div>

 

[[File:omni-path ift carrier.png|thumb|right|300px|IFT (Internal Faceplate Transition) Carrier]]

A number of {{intel|Skylake SP|l=core}} models (specifically those with the "''F''" suffix) incorporate the {{intel|Omni-Path}} Host Fabric Interface (HFI) on-package. This was previously done with the {{intel|Knights Landing|l=arch}} ("''F''" suffixed) models. This, in addition to improving cost and power efficiencies, also eliminates the dependency on the x16 PCIe lanes on the motherboard. With the HFI on package, the chip can be plugged in directly to the IFT (Internal Faceplate Transition) carrier via a separate IFP (Internal Faceplate-to-Processor) 1-port cable (effectively a [[Twinax cable]]).

 

 

==== Software Guard Extension (SGX) ====

==== Memory Protection Extension (MPX) ====

Information from the new domains, including additional thermal skin temperature control information is now supplied to OEMs.

Note that core ratio has been increased to a [theoretical] x83 multiplier and the coarse-grain ratio was dropped from Skylake allowing a BCLK ratio to have granularity of 1 MHz increments with BCLK frequency of over 200 readily achievable. The FIVER was removed and the voltage control was given back to the motherboard manufacturers; i.e., voltage supplies can be entirely motherboard-controlled. Skylake also bumped the DDR ratio up to 4133 MT/s.

* 13 [[megapixel|MP]] zero [[shutter lag]] 1080p60/2160p30 video capture and imaging and a large array of standardized image processing capabilities.  

| {{intel|HD Graphics 510}} || 12 || GT1 || {{intel|Skylake U|U|l=core}}, {{intel|Skylake S|S|l=core}} ||  - || rowspan="11" colspan="2" style="text-align: center;" | '''1.0''' || rowspan="11" style="text-align: center;" | '''12''' || rowspan="11" style="text-align: center;" | '''N/A''' || rowspan="11" style="text-align: center;" | '''5.1''' || rowspan="11" style="text-align: center;" | '''4.5''' || rowspan="11" style="text-align: center;" | '''4.5''' || rowspan="11" style="text-align: center;" colspan="2" | '''2.0'''

| [[File:skylake h (back).png|100px|link=intel/cores/skylake_h]] || {{intel|Skylake H|l=core}} || {{intel|BGA-1440}} || Yes || 2-chip || rowspan="2" | {{intel|Sunrise Point}} || rowspan="4" | [[DMI 3.0]]

=== Client Die ===

==== System Agent ====

==== Core ====

==== Core Group ====

Client models come in groups of 2 or 4 cores. (die sizes includes the dark silicon space where the L3 ends).

* ~8.91 mm x ~2.845 mm

* ~8.844 mm x 5.694 mm

 

==== Integrated Graphics ====

==== Dual-core ====

* ~9.57 mm x ~10.3 mm

* ~98.57 mm² die size

==== Quad-core ====

Die shot of the [[quad-core]] {{\\|Gen9|GT2}} Skyllake processors. Those are found in almost all mainstream desktop processors.

* ~122 mm² die size

: [[File:skylake (quad-core).png|650px]]

{{#ask:

|template=proc table 3

|?thread count

|userparam=26:21

{{#ask:

[[Category:microprocessor models by intel]] [[instance of::microprocessor]] [[microarchitecture::Skylake]] [[max cpu count::8]]

|?turbo frequency (1 core)#GHz

{{comp table count|ask=[[Category:microprocessor models by intel]] [[instance of::microprocessor]] [[microarchitecture::Skylake]]}}