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'''Kaby Lake R''' ('''KBL-R''') is the name of the core for [[Intel]]'s line of low-power mobile processors based on the {{intel|Kaby Lake|l=arch}} microarchitecture serving as a refresh to {{intel|Kaby Lake U|l=core}}. These chips are primarily targeted towards light notebooks and laptops, portable all-in-ones (AiOs), minis, and conference rooms. Coffee Lake U processors are fabricated on Intel's 2nd generation enhanced [[14 nm lithography process|14nm+ process]].
 
'''Kaby Lake R''' ('''KBL-R''') is the name of the core for [[Intel]]'s line of low-power mobile processors based on the {{intel|Kaby Lake|l=arch}} microarchitecture serving as a refresh to {{intel|Kaby Lake U|l=core}}. These chips are primarily targeted towards light notebooks and laptops, portable all-in-ones (AiOs), minis, and conference rooms. Coffee Lake U processors are fabricated on Intel's 2nd generation enhanced [[14 nm lithography process|14nm+ process]].
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== Overview ==
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Kaby Lake R based processors are a single-chip solution - the chipset is packaged in the same physical casing as the CPU in a [[multi-chip package]] (MCP). Unlike {{\\|Kaby Lake U}}, there are no variations with 3 dies which incorporated an on-package cache (OPC) in addition to the hub and CPU. Communication between the separate dies are done via a lightweight On-Package Interconnect (OPI) interface, allowing for 4 GT/s transfer rate. All Kaby Lake R processors use {{intel|BGA-1356|Socket BGA-1356}}.
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=== Common Features ===
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All Kaby Lake R processors have the following:
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* Dual-channel Memory
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** Up to DDR4-2400, LPDDR3-2133
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** Up to 32 GiB
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* 12x PCIe
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* [[quad-core]] with 8 threads
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* Everything up to AVX2 (SMM, FPU, NX, MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AES, AVX1, AVX2)
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* Support [[AHCI]], [[High Definition Audio]], 4-6x [[USB 3.0]] ports, 8-10x [[USB 2.0]] ports, 2-4x [[SATA III]], 6x [[I2C]], 3x [[UART]], 1x [[SDXC]]
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* Graphics
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** {{intel|HD Graphics 620}} ({{intel|Gen9.5|l=arch}} GT2)({{intel|Gen9.5|l=arch}} GT3e)
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** 3 independent displays supported
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** Base frequency of 350 MHz
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** Burst frequency of 1-1.15 GHz
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{{clear}}

Revision as of 04:42, 21 August 2017

Edit Values
Kaby Lake R
General Info
DesignerIntel
ManufacturerIntel
IntroductionAugust 21, 2017 (announced)
August 21, 2017 (launched)
Microarchitecture
ISAx86-64
MicroarchitectureKaby Lake
Word Size
8 octets
16 nibbles
64 bit
Process14 nm
0.014 μm
1.4e-5 mm
TechnologyCMOS
Succession

Kaby Lake R (KBL-R) is the name of the core for Intel's line of low-power mobile processors based on the Kaby Lake microarchitecture serving as a refresh to Kaby Lake U. These chips are primarily targeted towards light notebooks and laptops, portable all-in-ones (AiOs), minis, and conference rooms. Coffee Lake U processors are fabricated on Intel's 2nd generation enhanced 14nm+ process.

Overview

Kaby Lake R based processors are a single-chip solution - the chipset is packaged in the same physical casing as the CPU in a multi-chip package (MCP). Unlike Kaby Lake U, there are no variations with 3 dies which incorporated an on-package cache (OPC) in addition to the hub and CPU. Communication between the separate dies are done via a lightweight On-Package Interconnect (OPI) interface, allowing for 4 GT/s transfer rate. All Kaby Lake R processors use Socket BGA-1356.

Common Features

All Kaby Lake R processors have the following:

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Facts about "Kaby Lake R - Cores - Intel"
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designerIntel +
first announcedAugust 21, 2017 +
first launchedAugust 21, 2017 +
instance ofcore +
isax86-64 +
manufacturerIntel +
microarchitectureKaby Lake +
nameKaby Lake R +
process14 nm (0.014 μm, 1.4e-5 mm) +
technologyCMOS +
word size64 bit (8 octets, 16 nibbles) +