From WikiChip
Difference between revisions of "intel/core m/m3-7y30"
< intel‎ | core m

(updated expansions)
(updated graphics specs)
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== Graphics ==
 
== Graphics ==
−
{{integrated graphic
+
{{integrated graphics
−
| gpu                = Intel HD Graphics 615
+
| gpu                = HD Graphics 615
 
| device id          = 0x591E
 
| device id          = 0x591E
 +
| designer            = Intel
 
| execution units    = 24
 
| execution units    = 24
−
| displays           = 3
+
| max displays       = 3
 +
| max memory          = 16 GiB
 
| frequency          = 300 MHz
 
| frequency          = 300 MHz
 
| max frequency      = 900 MHz
 
| max frequency      = 900 MHz
−
| max memory          = 16 GB
 
  
 
| output crt          =  
 
| output crt          =  
Line 156: Line 157:
 
| output dvi          = Yes
 
| output dvi          = Yes
  
−
| directx ver         = 12
+
| directx ver       = 12
−
| opengl ver         = 4.4
+
| opengl ver         = 4.4
−
| opencl ver         = 2.0
+
| opencl ver         = 2.0
−
| opengl es ver       =  
+
| hdmi ver          = 1.4a
−
| hdmi ver            = 1.4a
+
| dp ver             = 1.2
−
| dvi ver            =  
+
| edp ver            = 1.3
−
| dsi ver            =  
+
| max res hdmi      = 4096x2304
−
| vulkan ver          =  
+
| max res hdmi freq  = 24 Hz
−
| dp ver              = 1.2
+
| max res dp        = 4096x2304
−
| edp ver            = 1.3
+
| max res dp freq    = 60 Hz
 +
| max res edp        = 4096x2304
 +
| max res edp freq  = 60 Hz
 +
| max res vga        =
 +
| max res vga freq  =  
  
−
| max res hdmi        = 4096x2304
+
| features            = Yes
−
| max res hdmi freq  = 24 Hz
+
| intel quick sync     = Yes
−
| max res dvi        =
+
| intel intru 3d       = Yes
−
| max res dvi freq    =  
+
| intel insider       =  
−
| max res dsi        =
+
| intel widi           =  
−
| max res dsi freq    =
+
| intel fdi           =  
−
| max res dp          = 3840x2160
+
| intel clear video   = Yes
−
| max res dp freq    = 60 Hz
+
| intel clear video hd = Yes
−
| max res dp 2        = 2880x1800
 
−
| max res dp 2 freq  = 60 Hz
 
−
| max res edp        = 3840x2160
 
−
| max res edp freq    = 60 Hz
 
−
| max res edp 2      = 3840x2160
 
−
| max res edp 2 freq  = 60 Hz
 
−
| max res vga        =
 
−
| max res vga freq    =
 
−
 
 
−
| intel quick sync   = Yes
 
−
| intel intru 3d     = Yes
 
−
| intel insider     = Yes
 
−
| intel widi         = Yes
 
−
| intel fdi         =  
 
−
| intel clear video = Yes
 
 
}}
 
}}
  

Revision as of 02:01, 7 January 2017

Template:mpu Core M3-7Y30 is a 64-bit dual-core low-end performance x86 mobile microprocessor introduced by Intel in mid-2016. This chip, which is based on the Kaby Lake microarchitecture, is fabricated on Intel's 14nm+ process. The M3-7Y30 operates at 1 GHz with a TDP of 4.5 W supporting a Turbo Boost frequency of 2.6 GHz. The processor supports up to 16 GiB of dual-channel non-ECC LPDDR3-1866 memory and incorporates Intel's HD Graphics 615 IGP operating at 300 MHz with a burst frequency of 900 MHz.

Cache

Main article: Kaby Lake § Cache

[Edit/Modify Cache Info]

hierarchy icon.svg
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.
L1$128 KiB
131,072 B
0.125 MiB
L1I$64 KiB
65,536 B
0.0625 MiB
2x32 KiB8-way set associativewrite-back
L1D$64 KiB
65,536 B
0.0625 MiB
2x32 KiB8-way set associativewrite-back
L2$512 KiB
0.5 MiB
524,288 B
4.882812e-4 GiB
  2x256 KiB4-way set associativewrite-back
L3$4 MiB
4,096 KiB
4,194,304 B
0.00391 GiB
  2x2 MiB12-way set associativewrite-back

Memory controller

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeDDR3L-1600, LPDDR3-1866
Supports ECCNo
Max Mem16 GiB
Controllers1
Channels2
Max Bandwidth27.81 GiB/s
28,477.44 MiB/s
29.861 GB/s
29,860.76 MB/s
0.0272 TiB/s
0.0299 TB/s
Bandwidth
Single 13.9 GiB/s
Double 27.81 GiB/s

Expansions

[Edit/Modify Expansions Info]

ide icon.svg
Expansion Options
PCIe
Revision3.0
Max Lanes10
Configs1x4, 2x2, 1x2+2x1, 4x1


Graphics

[Edit/Modify IGP Info]

screen icon.svg
Integrated Graphics Information
GPUHD Graphics 615
DesignerIntelDevice ID0x591E
Execution Units24Max Displays3
Max Memory16 GiB
16,384 MiB
16,777,216 KiB
17,179,869,184 B
Frequency300 MHz
0.3 GHz
300,000 KHz
Burst Frequency900 MHz
0.9 GHz
900,000 KHz
OutputDP, eDP, HDMI, DVI
Max Resolution
HDMI4096x2304 @24 Hz
DP4096x2304 @60 Hz
eDP4096x2304 @60 Hz
Standards
DirectX12
OpenGL4.4
OpenCL2.0
DP1.2
eDP1.3
HDMI1.4a
Additional Features
Intel Quick Sync Video
Intel InTru 3D
Intel Clear Video
Intel Clear Video HD

Features

Template:mpu features

Retrieved from "https://en.wikichip.org/w/index.php?title=intel/core_m/m3-7y30&oldid=33341"
Facts about "Core M3-7Y30 - Intel"
RDF feed
Has subobject
"Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki.
Core M3-7Y30 - Intel#io +
base frequency1,000 MHz (1 GHz, 1,000,000 kHz) +
bus rate4,000 MT/s (4 GT/s, 4,000,000 kT/s) +
bus typeOPI +
clock multiplier10 +
core count2 +
core family6 +
core model142 +
core nameKaby Lake Y +
core steppingH0 +
core voltage (max)1.52 V (15.2 dV, 152 cV, 1,520 mV) +
core voltage (min)0.55 V (5.5 dV, 55 cV, 550 mV) +
designerIntel +
device id0x591E +
familyCore M3 +
first announcedAugust 30, 2016 +
first launchedAugust 30, 2016 +
full page nameintel/core m/m3-7y30 +
has advanced vector extensionstrue +
has advanced vector extensions 2true +
has ecc memory supportfalse +
has extended page tables supporttrue +
has featureAdvanced Encryption Standard Instruction Set Extension +, Advanced Vector Extensions +, Advanced Vector Extensions 2 +, Enhanced SpeedStep Technology +, Extended Page Tables +, Flex Memory Access +, Hyper-Threading Technology +, Intel VT-d +, Intel VT-x +, Memory Protection Extensions +, My WiFi Technology +, OS Guard +, Secure Key Technology +, Smart Response Technology +, Software Guard Extensions +, Speed Shift Technology + and Turbo Boost Technology 2.0 +
has intel enhanced speedstep technologytrue +
has intel flex memory access supporttrue +
has intel my wifi technology supporttrue +
has intel secure key technologytrue +
has intel smart response technology supporttrue +
has intel speed shift technologytrue +
has intel supervisor mode execution protectiontrue +
has intel turbo boost technology 2 0true +
has intel vt-d technologytrue +
has intel vt-x technologytrue +
has locked clock multipliertrue +
has second level address translation supporttrue +
has simultaneous multithreadingtrue +
has x86 advanced encryption standard instruction set extensiontrue +
instance ofmicroprocessor +
integrated gpuHD Graphics 615 +
integrated gpu base frequency300 MHz (0.3 GHz, 300,000 KHz) +
integrated gpu designerIntel +
integrated gpu execution units24 +
integrated gpu max frequency900 MHz (0.9 GHz, 900,000 KHz) +
integrated gpu max memory16,384 MiB (16,777,216 KiB, 17,179,869,184 B, 16 GiB) +
isax86-64 +
isa familyx86 +
l1$ size128 KiB (131,072 B, 0.125 MiB) +
l1d$ description8-way set associative +
l1d$ size64 KiB (65,536 B, 0.0625 MiB) +
l1i$ description8-way set associative +
l1i$ size64 KiB (65,536 B, 0.0625 MiB) +
l2$ description4-way set associative +
l2$ size0.5 MiB (512 KiB, 524,288 B, 4.882812e-4 GiB) +
l3$ description12-way set associative +
l3$ size4 MiB (4,096 KiB, 4,194,304 B, 0.00391 GiB) +
ldateAugust 30, 2016 +
main imageFile:kaby lake y (front).png +
manufacturerIntel +
market segmentMobile +
max cpu count1 +
max junction temperature373.15 K (100 °C, 212 °F, 671.67 °R) +
max memory16,384 MiB (16,777,216 KiB, 17,179,869,184 B, 16 GiB, 0.0156 TiB) +
max memory bandwidth27.81 GiB/s (28,477.44 MiB/s, 29.861 GB/s, 29,860.76 MB/s, 0.0272 TiB/s, 0.0299 TB/s) +
max memory channels2 +
max pcie lanes10 +
max storage temperature398.15 K (125 °C, 257 °F, 716.67 °R) +
microarchitectureKaby Lake +
min junction temperature273.15 K (0 °C, 32 °F, 491.67 °R) +
min storage temperature248.15 K (-25 °C, -13 °F, 446.67 °R) +
model numberM3-7Y30 +
nameCore M3-7Y30 +
packageFCBGA-1515 +
part numberHE8067702739824 +
platformKaby Lake +
process14 nm (0.014 μm, 1.4e-5 mm) +
release price$ 281.00 (€ 252.90, £ 227.61, ¥ 29,035.73) +
s-specSR2ZY + and SR347 +
seriesm3-7Y +
smp max ways1 +
supported memory typeDDR3L-1600 + and LPDDR3-1866 +
tdp4.5 W (4,500 mW, 0.00603 hp, 0.0045 kW) +
tdp down3.75 W (3,750 mW, 0.00503 hp, 0.00375 kW) +
tdp down frequency600 MHz (0.6 GHz, 600,000 kHz) +
tdp up7 W (7,000 mW, 0.00939 hp, 0.007 kW) +
tdp up frequency1,600 MHz (1.6 GHz, 1,600,000 kHz) +
technologyCMOS +
thread count4 +
turbo frequency (1 core)2,600 MHz (2.6 GHz, 2,600,000 kHz) +
word size64 bit (8 octets, 16 nibbles) +
x86/has memory protection extensionstrue +
x86/has software guard extensionstrue +