Semiconductor & Computer Engineering
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Difference between revisions of "hisilicon/k3/k3v2e"
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Revision as of 12:36, 6 September 2017
Template:mpu K3V2E is a 32-bit quad-core mobile ARM microprocessor introduced by HiSilicon in late 2012. This chip, which is fabricated on a 40 nm process, incorporates four Cortex-A9 cores operating at 1.5 GHz. The K3V2 integrated Vivante's GC4000 (16 cores) IGP and supports up to 2 channels of LPDDR2-900 memory. The K3V2E is an enhanced version of the K3V2, although the exact changes are not well-documented.
Facts about "K3V2E - HiSilicon"
| has ecc memory support | false + |
| integrated gpu | GC4000 + |
| integrated gpu base frequency | 480 MHz (0.48 GHz, 480,000 KHz) + |
| integrated gpu designer | Vivante + |
| integrated gpu execution units | 16 + |
| l1$ size | 256 KiB (262,144 B, 0.25 MiB) + |
| l1d$ description | 4-way set associative + |
| l1d$ size | 128 KiB (131,072 B, 0.125 MiB) + |
| l1i$ description | 4-way set associative + |
| l1i$ size | 128 KiB (131,072 B, 0.125 MiB) + |
| l2$ description | 8-way set associative + |
| l2$ size | 1 MiB (1,024 KiB, 1,048,576 B, 9.765625e-4 GiB) + |
| max memory bandwidth | 6.71 GiB/s (6,871.04 MiB/s, 7.205 GB/s, 7,204.808 MB/s, 0.00655 TiB/s, 0.0072 TB/s) + |
| max memory channels | 2 + |
| supported memory type | LPDDR2-900 + |
| used by | Huawei HN3-U01 +, Huawei Ascend P6 +, Ascend W2 + and Huawei Honor 3 + |
