Revision as of 04:35, 29 February 2020

TSARLET was a research microarchitecture designed by CEA-Leti demonstarting the theoretical capabilities of a large-scale high-performance 3D stacked chiplets-based SoC technology. The project comprised 96 MIPS cores built using 6 chiplets 3D stack on an active interposer in order to demonstarte in-package silicon scale-out capabilities with superior inter-chip capabilities while reducing the overall power and production cost.

Architecture

Memory Hierarchy

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Overview

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Package

package

• BGA-1517
• 39 x 39, 40 mm x 40 mm, 10 layers
  • 1517 balls
  • 500 µm, 1 mm pitch

Die

Compute chiplet

• STMicroelectronics 28 nm FDSOI
  • 10 metal layers, 0.5-1.3V + adaptive biasing
• 4 mm x 5.6 mm (22.4 mm²) silicon area
• 395,000,000 transistors
• I/O
  • 2D
    • 249 signal, 237 power
    • C4 bumps, 200 µm pitch
  • 3D
    • 2618 signal
    • up to metal 10 @ 20 µm pitch

Base interposer die

• 65 nm process
  • 7 metal layers, MIM option, 1.2 V
• 13.05 mm x 15.16 mm (197.8 mm²) silicon area
• 15,000,000 transistors
• I/O
  • 150,000 μ-bumps, 20 μm pitch
    • 20,000 signal, 120,000 power + 10,000 dummies
  • 14,000 TSV middle, 40 μm pitch
    • 2,000 signal, 12,000 power