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Latest revision | Your text | ||
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|package dimension=24.5 mm | |package dimension=24.5 mm | ||
|package dimension 2=24.5 mm | |package dimension 2=24.5 mm | ||
− | |package pitch=0.65 mm | + | |package pitch=0.65-1.1 mm |
}} | }} | ||
Facts about "Package FT3 - AMD"
designer | AMD + |
first launched | May 2013 + |
instance of | package + |
market segment | Mobile + and Embedded + |
microarchitecture | Jaguar + |
name | FT3 + |
package | BGA-769 + |
package contacts | 769 + |
package length | 24.5 mm (2.45 cm, 0.965 in) + |
package pitch | 0.65 mm (0.0256 in) + |
package type | Organic Micro Ball Grid Array + |
package width | 24.5 mm (2.45 cm, 0.965 in) + |
tdp | 25 W (25,000 mW, 0.0335 hp, 0.025 kW) + |