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AMD-K6-2/300BNZ-66 - AMD
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K6-2/300BNZ-66
General Info
DesignerAMD
ManufacturerAMD
Model NumberK6-2/300BNZ-66
Part NumberAMD-K6-2/300BNZ-66
MarketMobile
IntroductionMarch 22, 1999 (announced)
March 22, 1999 (launched)
ShopAmazon
General Specs
FamilyK6-2
SeriesK6-2 Mobile
Frequency299.99 MHz
Bus typeFSB
Bus speed66.66 MHz
Bus rate66.66 MT/s
Clock multiplier4.5
CPUID58C
Microarchitecture
MicroarchitectureK6-2
PlatformSuper 7
Core NameChomper Extended
Core Family5
Core Model8
Core Stepping12
Process0.25 µm
Transistors9,300,000
TechnologyCMOS
Die81 mm²
Word Size32 bit
Cores1
Threads1
Max Memory4 GiB
Multiprocessing
Max SMP1-Way (Uniprocessor)
Electrical
Power dissipation10 W
Vcore1.8 V ± 0.1 V
VI/O3.3675 V ± 7%
Tcase0 °C – 85 °C
Tstorage-65 °C – 150 °C

K6-2/300BNZ-66 was a 32-bit x86 K6-2-based mobile microprocessor designed and manufactured in 1999 by AMD. Manufactured using a 0.25 µm process, this MPU operated at 300 MHz with a FSB operating at 66 MHz.

Cache[edit]

Main article: K6-2 § Cache

L2$ can be 512 KiB to 1 MiB, depending on manufacturer and motherboard model. L2$ is off-chip.

Cache Info [Edit Values]
L1I$ 32 KiB
32,768 B
0.0313 MiB
1x32 KiB 2-way set associative
L1D$ 32 KiB
32,768 B
0.0313 MiB
1x32 KiB 2-way set associative

Graphics[edit]

This SoC has no integrated graphics processing unit.

Features[edit]

  • Auto-power down state
  • Stop clock state

Documents[edit]

DataSheet[edit]

base frequency299.99 MHz (0.3 GHz, 299,990 kHz) +
bus rate66.66 MT/s (0.0667 GT/s, 66,660 kT/s) +
bus speed66.66 MHz (0.0667 GHz, 66,660 kHz) +
bus typeFSB +
clock multiplier4.5 +
core count1 +
core family5 +
core model8 +
core nameChomper Extended +
core stepping12 +
core voltage1.8 V (18 dV, 180 cV, 1,800 mV) +
core voltage tolerance0.1 V +
cpuid58C +
designerAMD +
die area81 mm² (0.126 in², 0.81 cm², 81,000,000 µm²) +
familyK6-2 +
first announcedMarch 22, 1999 +
first launchedMarch 22, 1999 +
full page nameamd/k6-2/k6-2-300bnz-66 +
instance ofmicroprocessor +
io voltage3.368 V (33.675 dV, 336.75 cV, 3,367.5 mV) +
io voltage tolerance7% +
l1d$ description2-way set associative +
l1d$ size32 KiB (32,768 B, 0.0313 MiB) +
l1i$ description2-way set associative +
l1i$ size32 KiB (32,768 B, 0.0313 MiB) +
ldateMarch 22, 1999 +
manufacturerAMD +
market segmentMobile +
max case temperature358.15 K (85 °C, 185 °F, 644.67 °R) +
max cpu count1 +
max memory4,096 MiB (4,194,304 KiB, 4,294,967,296 B, 4 GiB, 0.00391 TiB) +
max storage temperature423.15 K (150 °C, 302 °F, 761.67 °R) +
microarchitectureK6-2 +
min case temperature273.15 K (0 °C, 32 °F, 491.67 °R) +
min storage temperature208.15 K (-65 °C, -85 °F, 374.67 °R) +
model numberK6-2/300BNZ-66 +
nameK6-2/300BNZ-66 +
part numberAMD-K6-2/300BNZ-66 +
platformSuper 7 +
power dissipation10 W (10,000 mW, 0.0134 hp, 0.01 kW) +
process250 nm (0.25 μm, 2.5e-4 mm) +
seriesK6-2 Mobile +
smp max ways1 +
technologyCMOS +
thread count1 +
transistor count9,300,000 +
word size32 bit (4 octets, 8 nibbles) +