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  • ...edia Interface}} 1.0. All processors use [[packages/socket-g1|PGA-988]] ([[packages/socket-g1|Socket G1]]) packaging. They all have the following features: ...face}} 1.0 and introduced {{x86|AES}} instructions. These processors use {{packages|Socket-G1}}. They all have the following features:
    43 KB (5,739 words) - 21:30, 22 April 2024
  • ...is attractive where performance is more important than cost. Flip-chip BGA packages can be mounted using standard [[printed circuit board]]s and can be replace ...d, high density ceramic substrates or organic laminate. Additionally fcBGA packages are often offered in bare die, flat lid, and full lid configuration. They a
    2 KB (239 words) - 07:17, 17 December 2013
  • File:Typical Flip Chip BGA Package (Cross-Sectional View).png
    [[Category:Semiconductor packages]]
    (1,249 × 513 (23 KB)) - 02:29, 17 December 2013
  • File:TI 288GTS - FCBGA package footprint.png
    [[Category:Semiconductor packages]]
    (501 × 477 (53 KB)) - 07:14, 17 December 2013
  • |package module 1={{packages/pdip-28}} |package module 2={{packages/cdip-28}}
    617 bytes (77 words) - 16:03, 13 December 2017
  • ...h the [[Intel 4004]]. The chip came in 16-pin [[Dual in-line package|DIP]] packages. The HD35404 was part of the [[Hitachi HMCS-4]], an [[Intel MCS-4]] clone.
    1 KB (157 words) - 01:34, 24 December 2015
  • ...tch: {{{2|}}} | arch = - Microarchitectures | core = - Cores | package = - Packages }} - AMD}}<!-- {{amd menu}} -->{{DEFAULTSORT:{{{1}}}, AMD|noerror}}<noinclu
    250 bytes (27 words) - 17:16, 28 April 2019
  • ...arch = microarchitectures/ | core = cores/ | pack = packages/ | package = packages/ }}{{lc:{{url parse article|{{{1}}}}}}}#{{url parse anchor|{{{1}}}}}|{{{2|{
    283 bytes (26 words) - 17:37, 10 May 2023
  • ...ters may be formed by powering selected LED elements. SSDs come in various packages and pin arranges.
    4 KB (490 words) - 09:47, 24 July 2019
  • local package_info = pdata['packages'][package_location[1]][package_location[2]] ...an>, example below. You will notice the code accepts a page name like "amd/packages/socket am4" in addition to "vendor,name" which I think beats guessing names
    16 KB (2,551 words) - 20:15, 19 March 2024
  • 1 KB (209 words) - 20:19, 26 November 2015
  • ...packages]]. Most designers are thus restricted to one of those pre-defined packages. Sometimes the device that's designed does not utilize all the pins for var
    2 KB (238 words) - 20:56, 26 November 2015
  • |package module 1={{packages/intel/fcbga-1364}}
    4 KB (404 words) - 16:22, 13 December 2017
  • |package module 1={{packages/intel/fcbga-1364}}
    3 KB (401 words) - 14:24, 12 February 2019
  • |package module 1={{packages/intel/fcbga-1364}}
    3 KB (399 words) - 16:22, 13 December 2017
  • |package module 1={{packages/intel/fcbga-1364}}
    3 KB (400 words) - 16:22, 13 December 2017
  • |package module 1={{packages/intel/fcbga-1364}}
    3 KB (399 words) - 16:22, 13 December 2017
  • |package module 1={{packages/intel/fcbga-1364}}
    3 KB (386 words) - 09:14, 26 December 2017
  • |package module 1={{packages/intel/fcbga-1364}}
    3 KB (401 words) - 16:22, 13 December 2017
  • |package module 1={{packages/intel/fcbga-1364}}
    3 KB (397 words) - 16:22, 13 December 2017

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