Semiconductor & Computer Engineering
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39 bytes (6 words) - 02:29, 17 December 2013
- {{title|BGA-1288}}[[File:BGA-1288.svg|300px|right]] '''BGA-1288''' is a microprocessor package designed by [[Intel]] for their {{intel2 KB (274 words) - 18:31, 1 December 2016
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38 bytes (4 words) - 02:35, 17 May 2023
Page text matches
- | socket = BGA4 KB (434 words) - 03:31, 15 February 2016
- ...obile models use {{intel|BGA-1356}} socket for U-series models and {{intel|BGA-1440}} socket for H-series, are [[dual-core]] with {{intel|Hyper-Threading} ...price as previous generation. All mobile models still use soldered {{intel|BGA-1356}} socket and as with previous generation, those new mobile Core i7 chi43 KB (5,739 words) - 21:30, 22 April 2024
- ...ing is attractive where performance is more important than cost. Flip-chip BGA packages can be mounted using standard [[printed circuit board]]s and can b ...BGA Package (Cross-Sectional View).png|thumb|350px|right|Typical Flip Chip BGA Package (Cross-Sectional View)]]2 KB (239 words) - 07:17, 17 December 2013
- | socket 0 = BGA-1168 | socket 0 type = BGA5 KB (469 words) - 16:22, 13 December 2017
- | socket 0 = BGA-576 | socket 0 type = BGA3 KB (323 words) - 16:10, 13 December 2017
- | socket = BGA17 KB (2,292 words) - 09:32, 16 July 2019
- ..." | {{intel|Mobile Pentium III}} || style="background-color: #b3ffb3;" | [[BGA]]<br>[[Socket 495]] || style="background-color: #ebebe0;" | [[180 nm]] ...-color: #ffe6ff;" | {{intel|P6}} || style="background-color: #b3ffb3;" | [[BGA]]<br>[[Socket 479]] || style="background-color: #ebebe0;" | [[130 nm]] || s10 KB (1,057 words) - 19:30, 1 November 2021
- | socket type = BGA4 KB (462 words) - 16:15, 13 December 2017
- | socket type = BGA4 KB (472 words) - 16:15, 13 December 2017
- |socket=BGA-1170 |socket type=BGA4 KB (475 words) - 17:42, 27 March 2018
- | socket type = BGA5 KB (573 words) - 16:15, 13 December 2017
- | socket type = BGA5 KB (572 words) - 16:15, 13 December 2017
- | socket type = BGA6 KB (744 words) - 18:35, 14 January 2019
- |socket type=BGA5 KB (736 words) - 03:44, 19 August 2023
- | socket type = BGA5 KB (558 words) - 16:15, 13 December 2017
- | socket = BGA-592 | socket 2 = BGA-13803 KB (342 words) - 17:29, 3 December 2016
- |socket=BGA-11704 KB (488 words) - 19:42, 5 October 2020
- ...duced in early [[2017]]. Those models use standard {{intel|BGA-1356|Socket BGA-1356}}. While no major new features were introduced, those Kaby Lake Celero25 KB (3,201 words) - 03:13, 22 September 2018
- |socket type=BGA4 KB (529 words) - 17:41, 27 March 2018
- |socket type=BGA5 KB (701 words) - 17:40, 27 March 2018
- |socket type=BGA4 KB (540 words) - 17:40, 27 March 2018
- |socket type=BGA4 KB (544 words) - 17:43, 27 March 2018
- |socket type=BGA4 KB (580 words) - 09:40, 8 July 2022
- |socket type=BGA5 KB (724 words) - 06:10, 2 December 2018
- |socket type=BGA4 KB (539 words) - 17:39, 27 March 2018
- |socket type=BGA4 KB (535 words) - 17:39, 27 March 2018
- |socket type=BGA5 KB (722 words) - 01:50, 24 November 2018
- |socket type=BGA4 KB (533 words) - 17:41, 27 March 2018
- |socket type=BGA4 KB (539 words) - 17:39, 27 March 2018
- | socket = BGA-166713 KB (1,784 words) - 08:04, 6 April 2019
- ...packages: [[PGA]] for mobile computers, [[LGA]] for desktop systems and [[BGA]] for small form factor systems. For each of the three different dies (see84 KB (13,075 words) - 00:54, 29 December 2020
- * 540-pin BGA (Ball Grid Array)3 KB (325 words) - 21:34, 22 February 2020
- ...00px|link=intel/cores/skylake_y]] || {{intel|Skylake Y|l=core}} || {{intel|BGA-1515}} || Yes || 1-chip || rowspan="2" | N/A || rowspan="2" | OPI ...00px|link=intel/cores/skylake_u]] || {{intel|Skylake U|l=core}} || {{intel|BGA-1356}} || Yes || 1-chip79 KB (11,922 words) - 06:46, 11 November 2022
- ...|link=intel/cores/kaby_lake_y]] || {{intel|Kaby Lake Y|l=core}} || {{intel|BGA-1515}} || Yes || 1-chip || rowspan="3" | N/A || rowspan="3" | OPI ...res/kaby_lake_u]] || {{intel|Kaby Lake U|l=core}} || rowspan="2" | {{intel|BGA-1356}} || rowspan="2" | Yes || rowspan="2" | 1-chip38 KB (5,431 words) - 10:41, 8 April 2024
- ...MHZ, 333 MHZ, 300PE MHZ, AND 266PE MHZ.pdf|MOBILE PENTIUM II PROCESSOR IN BGA PACKAGE AT 366 MHZ, 333 MHZ, 300PE MHZ, AND 266PE MHZ]] ...Guide (April 1998).pdf|Mobile Pentium II Processor Mini-Cartridge 240-Pin BGA Connector Assembly Development Guide (April 1998)]]5 KB (635 words) - 09:54, 11 November 2017
- | socket type 2 = BGA3 KB (366 words) - 16:25, 13 December 2017
- | socket type 2 = BGA3 KB (360 words) - 16:25, 13 December 2017
- | socket type 2 = BGA3 KB (320 words) - 16:25, 13 December 2017
- | socket type 2 = BGA3 KB (309 words) - 16:25, 13 December 2017
- | socket type 2 = BGA3 KB (345 words) - 16:25, 13 December 2017
- | socket = BGA-12347 KB (949 words) - 20:01, 8 August 2018
- | socket = BGA-1234 | socket type = BGA6 KB (626 words) - 19:52, 6 October 2020
- | socket = BGA-1234 | socket type = BGA6 KB (603 words) - 16:24, 13 December 2017
- | socket = BGA-1234 | socket type = BGA6 KB (601 words) - 16:24, 13 December 2017
- | socket = BGA-1234 | socket type = BGA6 KB (603 words) - 16:24, 13 December 2017
- | socket = BGA-1234 | socket type = BGA6 KB (623 words) - 16:24, 13 December 2017
- | socket = BGA-1234 | socket type = BGA6 KB (623 words) - 16:24, 13 December 2017
- | socket = BGA-1234 | socket type = BGA6 KB (627 words) - 16:24, 13 December 2017
- ...obile models use {{intel|BGA-1356}} socket for U-series models and {{intel|BGA-1440}} socket for H-series with the following common features:25 KB (3,397 words) - 03:12, 3 October 2022
- ...obile models use {{intel|BGA-1356}} socket for U-series models and {{intel|BGA-1440}} socket for H-series, are [[dual-core]] with {{intel|Hyper-Threading} ...price as previous generation. All mobile models still use soldered {{intel|BGA-1356}} socket and as with previous generation, those new mobile Core i5 chi34 KB (4,663 words) - 20:38, 20 February 2023
