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• microarchitecture
  ...r companies|companies]] with different design goals (e.g. budget, thermal, power, and performance). The exact design of the microarchitecture ultimately det
  3 KB (431 words) - 22:51, 21 November 2017
• amd/microarchitectures/zen
  ...ew design, built from the ground up for optimal balance of performance and power capable of covering the entire computing spectrum from fanless notebooks to ...roprocessor - transistor allocation/die size, clock/frequency restriction, power limitations, and new instructions to implement.
  79 KB (12,095 words) - 15:27, 9 June 2023
• amd/packages/socket am4
  |MA/MB_EVENT_L||DRAM Thermal Event Status |SATA_ZP(0-1)_L||Zero Power SATA {{abbr|ODD}}
  30 KB (6,098 words) - 01:58, 12 January 2024
• intel/cores/diamondville
  ...s based on the {{intel|Bonnell|l=arch}} microarchitecture. Those ultra-low power chips were manufactured on Intel's 45 nm process and were specifically aime ...h as full support for [[x86-64]]. Diamondville generally targets the 4-8 W thermal envelope typically fan-less designs.
  4 KB (470 words) - 22:20, 15 April 2017
• intel/atom/230
  | average power = | idle power =
  4 KB (479 words) - 16:14, 13 December 2017
• intel/atom/330
  | average power = | idle power =
  4 KB (524 words) - 16:14, 13 December 2017
• amd/infinity fabric
  ...llaneous system control signals - this includes things such as thermal and power management, tests, security, and 3rd party IP. With those two planes, AMD c .... Additionally [[inversion encoding]] was used to save another 10% average power per bit.
  8 KB (1,271 words) - 21:50, 18 August 2020
• amd/ryzen threadripper
  ...er models. Higher-performance dies allow for higher efficiency in terms of power consumption at higher clock speeds and in theory allow for higher overclock ...ntroduction of higher core count models but at the cost of a much higher [[thermal design point]]. 2900-Series doubled the core count to as much as [[32 cores
  13 KB (1,744 words) - 15:33, 16 April 2022
• x86/avx-512
  ...timizations where execution resources are dynamically disabled if power or thermal limits are reached instead of downclocking the CPU core which also affects
  83 KB (13,667 words) - 15:45, 16 March 2023
• intel/frequency behavior
  ...s are added and the overall core grows in capabilities. Unfortunately, the power constraints have remained the same and in many situations have gotten more ...act additional performance through higher frequency whenever the power and thermal budgets allow.
  5 KB (797 words) - 01:10, 1 June 2020
• small core
  ...meet stringent [[die size|area]] and electrical constraints (e.g., power, thermal, area). This is in contrast to a [[big core]] that implements the same [[ar
  407 bytes (61 words) - 05:47, 29 December 2018
• amd/frequency behavior
  ...act additional performance through higher frequency whenever the power and thermal budgets allow. ...ead, the processor will automatically allow turbo for as many cores as the power budget allows.
  2 KB (286 words) - 11:35, 2 May 2020
• intel/cores/coffee lake h
  ...chip to increase the clock frequency by an additional 200 MHz so long the thermal temperatures allows provided the cooling solution is adequate. |?intel thermal velocity boost#GHz
  5 KB (648 words) - 17:43, 6 December 2018
• intel/microarchitectures/enhanced netburst
  ...aul Otellini (then, president and chief operating officer) confirmed that "thermal considerations" were the root of the problem and that all future Intel proc
  3 KB (334 words) - 07:05, 29 December 2018
• intel/celeron/797
  |idle power=2.3 W * [[:File:2nd-gen-core-mobile-thermal-guide.pdf|Thermal Design Guide for Embedded Applications]]
  4 KB (642 words) - 19:19, 17 March 2018
• intel/celeron/787
  |idle power=2.3 W * [[:File:2nd-gen-core-mobile-thermal-guide.pdf|Thermal Design Guide for Embedded Applications]]
  4 KB (642 words) - 19:18, 17 March 2018
• intel/celeron/b720
  |idle power=3.1 W * [[:File:2nd-gen-core-mobile-thermal-guide.pdf|Thermal Design Guide for Embedded Applications]]
  4 KB (639 words) - 19:21, 17 March 2018
• intel/celeron/b710
  |idle power=3.1 W * [[:File:2nd-gen-core-mobile-thermal-guide.pdf|Thermal Design Guide for Embedded Applications]]
  4 KB (639 words) - 19:21, 17 March 2018
• intel/celeron/807
  |idle power=2.3 W * [[:File:2nd-gen-core-mobile-thermal-guide.pdf|Thermal Design Guide for Embedded Applications]]
  5 KB (655 words) - 19:19, 17 March 2018
• intel/celeron/887
  |idle power=2.3 W * [[:File:2nd-gen-core-mobile-thermal-guide.pdf|Thermal Design Guide for Embedded Applications]]
  4 KB (651 words) - 19:21, 17 March 2018

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