Edit Values | |
Embedded G-Series T40N | |
General Info | |
Designer | AMD |
Manufacturer | TSMC |
Model Number | T40N |
Part Number | GET40NFPB22GVE |
Market | Embedded |
Introduction | January 19, 2011 (launched) |
End-of-life | 2021-Q2 (last order) 2021-Q4 (last shipment) |
Shop | Amazon |
General Specs | |
Family | Embedded G-Series |
Series | G-Series APU/CPU |
Frequency | 1,000 MHz |
Turbo Frequency | 1,100 MHz |
Clock multiplier | 10 |
Microarchitecture | |
ISA | x86-64 (x86) |
Microarchitecture | Bobcat |
Core Name | eBrazos |
Core Family | 20 |
Process | 40 nm |
Transistors | 451,000,000 |
Technology | CMOS |
Die | 75 mm² |
Word Size | 64 bit |
Cores | 2 |
Threads | 2 |
Multiprocessing | |
Max SMP | 1-Way (Uniprocessor) |
Electrical | |
TDP | 18 W |
Tjunction | 0 °C – 90 °C |
Packaging | |
Package | FT1, UOB413 (FC-OBGA) |
Dimension | 19 mm × 19 mm × 1.92 mm |
Pitch | 0.8 mm |
Contacts | 413 |
T40N is a 64-bit dual-core x86 embedded microprocessor introduced by AMD in early 2011. This processor is a member of the AMD Embedded G-Series formerly codenamed "eBrazos" with CPU cores based on the Bobcat microarchitecture and is fabricated on a TSMC 40 nm process. The T40N operates at a base frequency of 1.0 GHz and a boost frequency of up to 1.1 GHz with a TDP of 18 W. It supports single-channel DDR3-1066 memory and integrates a Radeon HD 6290 GPU operating at up to 280 MHz.
Cache
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory. The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC. Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies. Note: All units are in kibibytes and mebibytes. |
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Memory controller
Integrated Memory Controller
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Expansions
"eBrazos" processors integrate one 5-port, 8-lane PCIe Gen 1/2 (5 GT/s) controller. Four GPP lanes are configurable as up to four x4/x2/x1 wide (e.g. 1x2 + 2x1) links, the remaining four lanes are reserved for a UMI link to the chipset. The recommended AMD A50M "Hudson-M1" and A55E "Hudson-E1" controller hubs provide four PCIe Gen 1/2 lanes configurable as up to four x4/x2/x1 links, a 32-bit, 33 MHz PCI interface (A55E only), 6 × SATA Gen 1/2/3 (6 Gb/s), 14 × USB 1.1/2.0, 2 × USB 1.1, a Gb Ethernet MAC (A55E), HDA, LPC, SPI, SMBus, GPIO.
Expansion Options |
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Graphics
This processor integrates an AMD Radeon GPU of the Evergreen series with two compute units based on the TeraScale 2 microarchitecture. It features 80 stream processing units, 8 texture units, 16 Z/Stencil ROP units, and four color ROP units. Decoding of H.264, VC-1, MPEG-2, and DivX/Xvid video streams is accelerated by a UVD 3 engine. Two independent display controllers natively support the DisplayPort 1.1a protocol on two 4-lane DDIs, a Flat Panel Display (LVDS) link on the first port, and a VGA interface with 30 bpp color depth and up to 400 MHz pixel clock. The eDP, DVI, and HDMI protocols are supported with additional components. The maximum display resolution is 1920 × 1200 at 60 Hz.
Integrated Graphics Information
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Features
[Edit/Modify Supported Features]
Supported x86 Extensions & Processor Features
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Bibliography
- "Product Brief: AMD Embedded G-Series APU Platform", AMD Publ. #49282, 2013
- "BIOS and Kernel Developer’s Guide (BKDG) for AMD Family 14h Models 00h-0Fh Processors", AMD Publ. #43170, Rev. 3.13, February 17, 2012
- "Revision Guide for AMD Family 14h Models 00h-0Fh Processors", AMD Publ. #47534, Rev. 3.18, February 26, 2013
- Burgess, Brad. "“Bobcat” AMD’s New Low Power x86 Core Architecture", Hot Chips 22, August 24, 2010
- Burgess, Brad et al. (2011). Bobcat: AMD’s Low-Power x86 Processor. IEEE Micro. 31 (2): 16-25. doi:10.1109/MM.2011.2
- Foley, Denis et al. (2011). A Low-Power Integrated x86–64 and Graphics Processor for Mobile Computing Devices. IEEE JSSC. 47 (1): 220-231. doi:10.1109/JSSC.2011.2167776
- Rogers, Aaron; Kaplan, David; Quinnell, Eric; Kwan, Bill (2012). The Core-C6 (CC6) Sleep State of the AMD Bobcat x86 Microprocessor. ACM/IEEE ISLPED 2012. pp. 367-372. doi:10.1145/2333660.2333745
- "AMD Delivers the World's First and Only APU for Embedded Systems" (Press release). AMD.com. January 19, 2011.
Has subobject "Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki. | Embedded G-Series T40N - AMD#pcie + |
base frequency | 1,000 MHz (1 GHz, 1,000,000 kHz) + |
clock multiplier | 10 + |
core count | 2 + |
core family | 20 + |
core name | eBrazos + |
designer | AMD + |
die area | 75 mm² (0.116 in², 0.75 cm², 75,000,000 µm²) + |
family | Embedded G-Series + |
first launched | January 19, 2011 + |
full page name | amd/embedded/t40n + |
has amd amd-v technology | true + |
has ecc memory support | false + |
instance of | microprocessor + |
integrated gpu | Radeon HD 6290 + |
integrated gpu base frequency | 280 MHz (0.28 GHz, 280,000 KHz) + |
integrated gpu designer | AMD + |
integrated gpu execution units | 2 + |
isa | x86-64 + |
isa family | x86 + |
l1$ size | 128 KiB (131,072 B, 0.125 MiB) + |
l1d$ description | 8-way set associative + |
l1d$ size | 64 KiB (65,536 B, 0.0625 MiB) + |
l1i$ description | 2-way set associative + |
l1i$ size | 64 KiB (65,536 B, 0.0625 MiB) + |
l2$ description | 16-way set associative + |
l2$ size | 1 MiB (1,024 KiB, 1,048,576 B, 9.765625e-4 GiB) + |
ldate | January 19, 2011 + |
manufacturer | TSMC + |
market segment | Embedded + |
max cpu count | 1 + |
max junction temperature | 363.15 K (90 °C, 194 °F, 653.67 °R) + |
max memory bandwidth | 7.944 GiB/s (8,134.842 MiB/s, 8.53 GB/s, 8,530 MB/s, 0.00776 TiB/s, 0.00853 TB/s) + |
max memory channels | 1 + |
microarchitecture | Bobcat + |
min junction temperature | 273.15 K (0 °C, 32 °F, 491.67 °R) + |
model number | T40N + |
name | Embedded G-Series T40N + |
package | FT1 + and UOB413 + |
part number | GET40NFPB22GVE + |
process | 40 nm (0.04 μm, 4.0e-5 mm) + |
series | G-Series APU/CPU + |
smp max ways | 1 + |
supported memory type | DDR3-1066 + |
tdp | 18 W (18,000 mW, 0.0241 hp, 0.018 kW) + |
technology | CMOS + |
thread count | 2 + |
transistor count | 451,000,000 + |
turbo frequency | 1,100 MHz (1.1 GHz, 1,100,000 kHz) + |
word size | 64 bit (8 octets, 16 nibbles) + |