Helio P70 - MediaTek

	Edit Values
	P70
	General Info
Designer	MediaTek,; ARM Holdings
Manufacturer	TSMC
Model Number	P70
Market	Mobile
Introduction	October 24, 2018 (announced); October 24, 2018 (launched)
	General Specs
Family	Helio
Series	Helio P
Frequency	2,100 MHz, 2,000 MHz
	Microarchitecture
ISA	ARMv8 (ARM)
Microarchitecture	Cortex-A73, Cortex-A53
Core Name	Cortex-A73, Cortex-A53
Process	12 nm
Technology	CMOS
Word Size	64 bit
Cores	8
Threads	8
Max Memory	8 GiB
	Multiprocessing
Max SMP	1-Way (Uniprocessor)

Helio P70 (MT????) is a 64-bit ARM LTE SoC introduced by MediaTek in late 2018. Fabricated on TSMC's 12 nm process, the chip incorporates eight cores - four Cortex-A53 little cores operating at up to 2 GHz and four Cortex-A73 cores operating at up to 2.1 Ghz. The P70 incorporates a Mali-G72 GPU operating at up to 900 MHz and an LTE modem supporting Cat-13 150 Mbps upload and Cat-7 300 Mbps download. This chip supports up to 8 GiB of dual-channel LPDDR4X-3600 memory.

Memory controller

The Helio P70 supports either: up to 4 GiB of single-channel 32-bit LPDDR3-1866, or up to 8 GiB of dual-channel 16 bit LPDDR4X-3600 memory.

[Edit/Modify Memory Info]

Integrated Memory Controller

Max Type	LPDDR4X-3600, LPDDR3-1866
Supports ECC	No
Max Mem	8 GiB
Controllers	1
Channels	2
Width	16 bit, 32 bit
Max Bandwidth	13.41 GiB/s 13,731.84 MiB/s 14.399 GB/s 14,398.878 MB/s 0.0131 TiB/s 0.0144 TB/s
Bandwidth	Single 6.71 GiB/s Double 13.41 GiB/s

NPU

This chip incorporates a Tensilica DSP serving as an NPU with a peak performance of 280 GMAC/s.

Graphics

[Edit/Modify IGP Info]

Integrated Graphics Information

GPU

Mali-G72

Designer

ARM Holdings

Execution Units

3

Frequency

900 MHz

0.9 GHz
900,000 KHz

Output

DSI

Max Resolution

DSI	2160x1080

Standards

Direct3D	12
OpenGL	3.2
OpenCL	2.0
OpenGL ES	3.2
OpenVG	1.1
Vulkan	1.1

Hardware Accelerated Video Capabilities
Codec	Encode	Decode
MPEG-4 AVC (H.264)	1080P @ 30 FPS	1080P @ 30 FPS
HEVC (H.265)	✘	1080P @ 30 FPS

Connectivity

Wireless Communications

Cellular

4G

LTE Advanced

E-UTRAN	Yes
UE Cat	7 (DL), 13 (UL)

Wireless: 802.11 a/b/g/n/ac
Bluetooth 4.2,
GNSS options

Camera

32MP (single), 20MP+16MP (dual)
- Recording:
  - 32MP@30FPS
  - 16MP@90FPS

Utilizing devices

Realme U1
UMIDIGI S3 Pro
REALME 3
OPPO F11 PRO
OPPO F11
Ulefone Armor 6E

This list is incomplete; you can help by expanding it.

base frequency	2,100 MHz (2.1 GHz, 2,100,000 kHz) + and 2,000 MHz (2 GHz, 2,000,000 kHz) +
core count	8 +
core name	Cortex-A73 + and Cortex-A53 +
designer	MediaTek + and ARM Holdings +
family	Helio +
first announced	October 24, 2018 +
first launched	October 24, 2018 +
full page name	mediatek/helio/p70 +
has 4g support	true +
has e-utran support	true +
has ecc memory support	false +
has lte advanced support	true +
instance of	microprocessor +
integrated gpu	Mali-G72 +
integrated gpu base frequency	900 MHz (0.9 GHz, 900,000 KHz) +
integrated gpu designer	ARM Holdings +
integrated gpu execution units	3 +
isa	ARMv8 +
isa family	ARM +
ldate	October 24, 2018 +
manufacturer	TSMC +
market segment	Mobile +
max cpu count	1 +
max memory	8,192 MiB (8,388,608 KiB, 8,589,934,592 B, 8 GiB, 0.00781 TiB) +
max memory bandwidth	13.41 GiB/s (13,731.84 MiB/s, 14.399 GB/s, 14,398.878 MB/s, 0.0131 TiB/s, 0.0144 TB/s) +
max memory channels	2 +
microarchitecture	Cortex-A73 + and Cortex-A53 +
model number	P70 +
name	P70 +
process	12 nm (0.012 μm, 1.2e-5 mm) +
series	Helio P +
smp max ways	1 +
supported memory type	LPDDR4X-3600 + and LPDDR3-1866 +
technology	CMOS +
thread count	8 +
used by	Realme U1 +, UMIDIGI S3 Pro +, REALME 3 +, OPPO F11 PRO +, OPPO F11 + and Ulefone Armor 6E +
user equipment category	7 (DL), 13 (UL) +
word size	64 bit (8 octets, 16 nibbles) +

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