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POWER9 02CY771 - IBM
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02CY771
General Info
DesignerIBM
ManufacturerGlobalFoundries
Model Number02CY771
Part Number02CY771
MarketServer, Workstation
IntroductionNovember, 2017 (announced)
November, 2017 (launched)
General Specs
FamilyPOWER
SeriesPOWER9
Frequency2.20 GHz
Turbo Frequency3.80 GHz
Microarchitecture
ISAPower ISA v3.0B (Power ISA)
MicroarchitecturePOWER9
Core NameSforza
Process14 nm
Transistors8,000,000,000
TechnologyCMOS
Die693.37 mm²
25.228 mm × 27.48416 mm
Word Size64 bit
Cores12
Threads48
Max Memory2 TiB
Multiprocessing
Max SMP2-Way (Multiprocessor)
Electrical
TDP105 W
Tjunction0 °C – 85 °C
Packaging
PackageFCLGA-2601 (PLGA)
Dimension50 mm × 50 mm
Pitch1.016 mm
Contacts2601

POWER9 02CY771 is a 12-core POWER server and workstation microprocessor designed by IBM and introduced in late 2017. This chip is based on the POWER9 microarchitecture and is fabricated on GlobalFoundries 14nm SOI Process. The 02CY771 has a base frequency of 2.2 GHz with a bost frequency of 3.80 GHz and a TDP of 105 W.

Facts about "POWER9 02CY771 - IBM"
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POWER9 02CY771 - IBM#pcie +
base frequency2,200 MHz (2.2 GHz, 2,200,000 kHz) +
core count12 +
core nameSforza +
designerIBM +
die area693.37 mm² (1.075 in², 6.934 cm², 693,370,000 µm²) +
die length25.228 mm (2.523 cm, 0.993 in, 25,228 µm) +
die width27.484 mm (2.748 cm, 1.082 in, 27,484.16 µm) +
familyPOWER +
first announcedNovember 2017 +
first launchedNovember 2017 +
full page nameibm/power/02cy771 +
has ecc memory supportfalse +
instance ofmicroprocessor +
isaPower ISA v3.0B +
isa familyPower ISA +
l1$ size768 KiB (786,432 B, 0.75 MiB) +
l1d$ description8-way set associative +
l1d$ size384 KiB (393,216 B, 0.375 MiB) +
l1i$ description8-way set associative +
l1i$ size384 KiB (393,216 B, 0.375 MiB) +
l2$ description8-way set associative +
l2$ size3 MiB (3,072 KiB, 3,145,728 B, 0.00293 GiB) +
l3$ description20-way set associative +
l3$ size60 MiB (61,440 KiB, 62,914,560 B, 0.0586 GiB) +
ldateNovember 2017 +
manufacturerGlobalFoundries +
market segmentServer + and Workstation +
max cpu count2 +
max junction temperature358.15 K (85 °C, 185 °F, 644.67 °R) +
max memory2,097,152 MiB (2,147,483,648 KiB, 2,199,023,255,552 B, 2,048 GiB, 2 TiB) +
max memory bandwidth158.95 GiB/s (162,764.8 MiB/s, 170.671 GB/s, 170,671.263 MB/s, 0.155 TiB/s, 0.171 TB/s) +
max memory channels8 +
microarchitecturePOWER9 +
min junction temperature273.15 K (0 °C, 32 °F, 491.67 °R) +
model number02CY771 +
name02CY771 +
packageFCLGA-2601 +
part number02CY771 +
process14 nm (0.014 μm, 1.4e-5 mm) +
seriesPOWER9 +
smp max ways2 +
supported memory typeDDR4-2666 +
tdp105 W (105,000 mW, 0.141 hp, 0.105 kW) +
technologyCMOS +
thread count48 +
transistor count8,000,000,000 +
turbo frequency3,800 MHz (3.8 GHz, 3,800,000 kHz) +
word size64 bit (8 octets, 16 nibbles) +