Semiconductor & Computer Engineering
From WikiChip
POWER9 02CY228 - IBM
| Edit Values | |
| 02CY228 | |
| General Info | |
| Designer | IBM |
| Manufacturer | GlobalFoundries |
| Model Number | 02CY228 |
| Part Number | 02CY228 |
| Market | Server, Workstation |
| Introduction | November, 2017 (announced) November, 2017 (launched) |
| General Specs | |
| Family | POWER |
| Series | POWER9 |
| Frequency | 2.70 GHz |
| Turbo Frequency | 3.80 GHz |
| Microarchitecture | |
| ISA | Power ISA v3.0B (Power ISA) |
| Microarchitecture | POWER9 |
| Core Name | Sforza |
| Process | 14 nm |
| Transistors | 8,000,000,000 |
| Technology | CMOS |
| Die | 693.37 mm² 25.228 mm × 27.48416 mm |
| Word Size | 64 bit |
| Cores | 20 |
| Threads | 80 |
| Max Memory | 2 TiB |
| Multiprocessing | |
| Max SMP | 2-Way (Multiprocessor) |
| Electrical | |
| TDP | 190 W |
| Tjunction | 0 °C – 85 °C |
| Packaging | |
| Package | FCLGA-2601 (PLGA) |
| Dimension | 50 mm × 50 mm |
| Pitch | 1.016 mm |
| Contacts | 2601 |
POWER9 02CY228 is a 20-core POWER server and workstation microprocessor designed by IBM and introduced in late 2017. This chip is based on the POWER9 microarchitecture and is fabricated on GlobalFoundries 14nm SOI Process. The 02CY228 has a base frequency of 2.70 GHz with a bost frequency of 3.80 GHz and a TDP of 190 W.
Facts about "POWER9 02CY228 - IBM"
| base frequency | 2,700 MHz (2.7 GHz, 2,700,000 kHz) + |
| core count | 20 + |
| core name | Sforza + |
| designer | IBM + |
| die area | 693.37 mm² (1.075 in², 6.934 cm², 693,370,000 µm²) + |
| die length | 25.228 mm (2.523 cm, 0.993 in, 25,228 µm) + |
| die width | 27.484 mm (2.748 cm, 1.082 in, 27,484.16 µm) + |
| family | POWER + |
| first announced | November 2017 + |
| first launched | November 2017 + |
| full page name | ibm/power/02cy228 + |
| instance of | microprocessor + |
| isa | Power ISA v3.0B + |
| isa family | Power ISA + |
| ldate | November 2017 + |
| manufacturer | GlobalFoundries + |
| market segment | Server + and Workstation + |
| max cpu count | 2 + |
| max junction temperature | 358.15 K (85 °C, 185 °F, 644.67 °R) + |
| max memory | 2,097,152 MiB (2,147,483,648 KiB, 2,199,023,255,552 B, 2,048 GiB, 2 TiB) + |
| microarchitecture | POWER9 + |
| min junction temperature | 273.15 K (0 °C, 32 °F, 491.67 °R) + |
| model number | 02CY228 + |
| name | 02CY228 + |
| package | FCLGA-2601 + |
| part number | 02CY228 + |
| process | 14 nm (0.014 μm, 1.4e-5 mm) + |
| series | POWER9 + |
| smp max ways | 2 + |
| tdp | 190 W (190,000 mW, 0.255 hp, 0.19 kW) + |
| technology | CMOS + |
| thread count | 80 + |
| transistor count | 8,000,000,000 + |
| turbo frequency | 3,800 MHz (3.8 GHz, 3,800,000 kHz) + |
| word size | 64 bit (8 octets, 16 nibbles) + |