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Atom Z605
General Info
Designer	Intel
Manufacturer	Intel
Model Number	Z605
Part Number	AY80609005805AA
S-Spec	SLC3C
Market	Mobile
Introduction	May 4, 2010 (announced) May 4, 2010 (launched)
Shop	Amazon
General Specs
Family	Atom
Series	Z605
Locked	Yes
Frequency	1,000 MHz
Bus type	cDMI
Bus speed	100 MHz
Bus rate	400 MT/s
Clock multiplier	10
CPUID	20661
Microarchitecture
ISA	x86-32 (x86)
Microarchitecture	Bonnell
Platform	Moorestown
Chipset	Langwell
Core Name	Lincroft
Core Family	6
Core Model	38
Core Stepping	1
Process	45 nm
Transistors	140,000,000
Technology	CMOS
Die	65.2526 mm² 8.89 mm × 7.34 mm
Word Size	32 bit
Cores	1
Threads	2
Max Memory	2 GiB
Multiprocessing
Max SMP	1-Way (Uniprocessor)
Electrical
Vcore	0.75 V-1.2 V
TDP	2.2 W
Tjunction	0 °C – 90 °C
Tstorage	-55 °C – 125 °C
Packaging
Package FCBGA-518 (FCBGA) Dimension 13.8 mm x 13.8 mm x 1.1 mm Pin Count 518 Socket BGA-518 (BGA)

Atom Z605 is an ultra-low power 32-bit x86 system on a chip designed by Intel and introduced in early 2010. The Z605, which is based on the Bonnell microarchitecture (Lincroft core), is fabricated on a 45 nm process. This SoC incorporates a single core operating at 1 GHz with a low frequency mode of 600 MHz. The chip has a TDP of 2.2 W and supporting up to a 2 GiB of single-channel DDR2-800 memory. Additionally, the Z605 incorporates a GMA 600 IGP operating at 400 MHz.

This chip communicates with the southbridge chipset (PCH MP30) over two buses: cDMI and cDVO. Both buses go from the SoC to the chipset. cDMI, which is used as the data interface link, operates at 100 MHz using a quad-pumped rate (i.e. 400 MT/s). That bus is composed of an 8-bit transmit and 8-bit receive. The cDVO, which is used as a unidirectional display data link is a quad-pumped 6-bit bus operating 200 MHz for a 800 MT/s effective rate. This model uses a AGTL+ signaling bus for this.

Cache

Main article: Bonnell § Cache

[Edit/Modify Cache Info]

Cache Organization Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory. The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC. Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies. Note: All units are in kibibytes and mebibytes.

L1$ 56 KiB 57,344 B 0.0547 MiB L1I$ 32 KiB 32,768 B 0.0313 MiB 1x32 KiB 8-way set associative   L1D$ 24 KiB 24,576 B 0.0234 MiB 1x24 KiB 6-way set associative write-back L2$ 512 KiB 0.5 MiB 524,288 B 4.882812e-4 GiB     1x512 KiB 8-way set associative

Memory controller

[Edit/Modify Memory Info]

	Integrated Memory Controller
	Max Type DDR-400, DDR2-800 Supports ECC No Max Mem 2 GiB Controllers 1 Channels 1 Width 32 bit Max Bandwidth 2.98 GiB/s 3,051.52 MiB/s 3.2 GB/s 3,199.751 MB/s 0.00291 TiB/s 0.0032 TB/s Bandwidth Single 2.98 GiB/s Physical Address (PAE) 32 bit

Expansions

[Edit/Modify Expansions Info]

	Expansion Options
	USB Revision 2.0 Ports 4 UART GP I/O Yes

Graphics

This chip incroporates the "GMA 600" integrated graphics which is actually a re-branded licensed Imagination PowerVR SGX 535 IGP.

[Edit/Modify IGP Info]

	Integrated Graphics Information
	GPU PowerVR SGX535 Designer Imagination Technologies Max Displays 1 Max Memory 256 MiB 262,144 KiB 268,435,456 B 0.25 GiB Frequency 400 MHz 0.4 GHz 400,000 KHz Output DSI, LVDS Max Resolution DSI 1024x600 LVDS 1366x768 Standards Direct3D 9.0c OpenGL 2.1 OpenGL ES 1.1, 2.0 OpenVG 1.1 Additional Features Intel Clear Video

• Supports hardware-accelerated HD video decode (MPEG4 part 2, H.264, WMV, and VC1)
• Supports hardware-accelerated HD video encode (MPEG4 part 2 and H.264)

Features

[Edit/Modify Supported Features]

Supported x86 Extensions & Processor Features

MMX MMX Extension EMMX Extended MMX Extension SSE Streaming SIMD Extensions SSE2 Streaming SIMD Extensions 2 SSE3 Streaming SIMD Extensions 3 SSSE3 Supplemental SSE3 x86-16 16-bit x86 x86-32 32-bit x86 x86-64 64-bit x86 Real Real Mode Protected Protected Mode SMM System Management Mode FPU Integrated x87 FPU NX No-eXecute HT Hyper-Threading BPT Burst Performance Technology EIST Enhanced SpeedStep Technology

Die Shot

See also: Bonnell § Lincroft Die

• 45 nm process
• 140,000,000
• Die size 7.34 mm × 8.89 mm
• Size area 65.2526 mm²

Documents

Datasheet

• Atom Z6xx Datasheet, May 2011
• Atom Z6xx Specs Update, May 2011