Template:mpu Kirin 970 is a 64-bit octa-core high-performance mobile ARM LTE SoC introduced by HiSilicon in mid-2017 at the 2017 IFA. This chip, which is fabricated on a 10 nm process, features four Cortex-A73 big cores operating at up to 2.4 GHz along with four Cortex-A53 little cores operating at up to 1.8 GHz. The 970 incorporates ARM's Mali G72 (12 core) IGP operating at ? MHz and supports up to 6 GiB of dual-channel LPDDR4-1866 memory.

Introduced at the 2017 IFA, the overall core organization is identical to the Kirin 960 which was introduced the previous year, but features 20% power efficiency and 40% smaller die area due to the process shrink. The 970 adds many enhancements, including a more powerful Mali G72 GPU and incorporates a new Neural Network Processing Unit (NPU) designed for AI acceleration. The 970 has two improved ISPs and a more powerful LTE modem supporting up to User Equipment (UE) category 18 capable of reaching a maximum downlink of 1.2 Gbps (4x4 MIMO, 256 QAM, 3CC CA).