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Core i7-2860QM - Intel
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Cache

Main article: Sandy Bridge § Cache

[Edit/Modify Cache Info]

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Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.
L1$256 KiB
262,144 B
0.25 MiB
L1I$128 KiB
131,072 B
0.125 MiB
4x32 KiB8-way set associative 
L1D$128 KiB
131,072 B
0.125 MiB
4x32 KiB8-way set associativewrite-back

L2$1 MiB
1,024 KiB
1,048,576 B
9.765625e-4 GiB
  4x256 KiB8-way set associativewrite-back

L3$8 MiB
8,192 KiB
8,388,608 B
0.00781 GiB
  4x2 MiB16-way set associativewrite-back

Memory controller

Expansions

Graphics

Features

[Edit/Modify Supported Features]

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Supported x86 Extensions & Processor Features
Has subobject
"Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki.
Core i7-2860QM - Intel#package + and Core i7-2860QM - Intel#pcie +
base frequency2,500 MHz (2.5 GHz, 2,500,000 kHz) +
bus links4 +
bus rate5,000 MT/s (5 GT/s, 5,000,000 kT/s) +
bus typeDMI 2.0 +
chipsetCougar Point +
clock multiplier25 +
core count4 +
core family6 +
core model42 +
core nameSandy Bridge M +
core steppingD2 +
core voltage (max)1.52 V (15.2 dV, 152 cV, 1,520 mV) +
core voltage (min)0.3 V (3 dV, 30 cV, 300 mV) +
cpuid0x206A7 +
designerIntel +
device id0x116 +
die area216 mm² (0.335 in², 2.16 cm², 216,000,000 µm²) +
familyCore i7 +
first announcedSeptember 4, 2011 +
first launchedSeptember 4, 2011 +
full page nameintel/core i7/i7-2860qm +
has 4g supporttrue +
has advanced vector extensionstrue +
has ecc memory supportfalse +
has extended page tables supporttrue +
has featureAdvanced Vector Extensions +, Advanced Encryption Standard Instruction Set Extension +, Hyper-Threading Technology +, Turbo Boost Technology 2.0 +, Enhanced SpeedStep Technology +, Trusted Execution Technology +, Intel vPro Technology +, Intel VT-x +, Intel VT-d +, Extended Page Tables +, Flex Memory Access +, My WiFi Technology + and Identity Protection Technology +
has intel enhanced speedstep technologytrue +
has intel flex memory access supporttrue +
has intel identity protection technology supporttrue +
has intel my wifi technology supporttrue +
has intel trusted execution technologytrue +
has intel turbo boost technology 2 0true +
has intel vpro technologytrue +
has intel vt-d technologytrue +
has intel vt-x technologytrue +
has locked clock multipliertrue +
has second level address translation supporttrue +
has simultaneous multithreadingtrue +
has wimax supporttrue +
has x86 advanced encryption standard instruction set extensiontrue +
instance ofmicroprocessor +
integrated gpuHD Graphics 3000 +
integrated gpu base frequency650 MHz (0.65 GHz, 650,000 KHz) +
integrated gpu designerIntel +
integrated gpu execution units12 +
integrated gpu max frequency1,300 MHz (1.3 GHz, 1,300,000 KHz) +
isax86-64 +
isa familyx86 +
l1$ size256 KiB (262,144 B, 0.25 MiB) +
l1d$ description8-way set associative +
l1d$ size128 KiB (131,072 B, 0.125 MiB) +
l1i$ description8-way set associative +
l1i$ size128 KiB (131,072 B, 0.125 MiB) +
l2$ description8-way set associative +
l2$ size1 MiB (1,024 KiB, 1,048,576 B, 9.765625e-4 GiB) +
l3$ description16-way set associative +
l3$ size8 MiB (8,192 KiB, 8,388,608 B, 0.00781 GiB) +
ldateSeptember 4, 2011 +
manufacturerIntel +
market segmentMobile +
max cpu count1 +
max junction temperature373.15 K (100 °C, 212 °F, 671.67 °R) +
max memory32,768 MiB (33,554,432 KiB, 34,359,738,368 B, 32 GiB, 0.0313 TiB) +
max memory bandwidth23.84 GiB/s (24,412.16 MiB/s, 25.598 GB/s, 25,598.005 MB/s, 0.0233 TiB/s, 0.0256 TB/s) +
max memory channels2 +
max storage temperature398.15 K (125 °C, 257 °F, 716.67 °R) +
microarchitectureSandy Bridge +
min junction temperature273.15 K (0 °C, 32 °F, 491.67 °R) +
min storage temperature248.15 K (-25 °C, -13 °F, 446.67 °R) +
model numberi7-2860QM +
nameCore i7-2860QM +
packageFCBGA-1224 + and rPGA988B +
part numberFF8062701065100 + and AV8062701065200 +
platformSandy Bridge M +
power dissipation (idle)3.9 W (3,900 mW, 0.00523 hp, 0.0039 kW) +
process32 nm (0.032 μm, 3.2e-5 mm) +
release price$ 568.00 (€ 511.20, £ 460.08, ¥ 58,691.44) +
s-specSR02X + and SR02Q +
seriesi7-2000 +
smp max ways1 +
socketSocket G2 +
supported memory typeDDR3-1600 +, DDR3-1333 + and DDR3-1066 +
tdp45 W (45,000 mW, 0.0603 hp, 0.045 kW) +
technologyCMOS +
thread count8 +
transistor count1,160,000,000 +
turbo frequency (1 core)3,600 MHz (3.6 GHz, 3,600,000 kHz) +
turbo frequency (2 cores)3,500 MHz (3.5 GHz, 3,500,000 kHz) +
turbo frequency (3 cores)3,400 MHz (3.4 GHz, 3,400,000 kHz) +
turbo frequency (4 cores)3,400 MHz (3.4 GHz, 3,400,000 kHz) +
word size64 bit (8 octets, 16 nibbles) +