Template:mpu Z500 is an ultra-low power 32-bit x86 microprocessor introduced by Intel in early 2008 specifically for Mobile Internet Devices (MID). The Z500, which is based on the Bonnell microarchitecture (Silverthorne core), is manufactured on a 45 nm process. This processor operates at 800 MHz with a TDP of just 650 mW and an average power of 160 mW. The MPU features a legacy 400 MT/s front-side bus capable of communicating with the Poulsbo chipset in both low-power CMOS mode as well as normal GTL mode (which also works with other chipsets).

Cache

Main article: Bonnell § Cache

[Edit/Modify Cache Info]

Cache Organization Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory. The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC. Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies. Note: All units are in kibibytes and mebibytes.

L1$ 56 KiB 57,344 B 0.0547 MiB L1I$ 32 KiB 32,768 B 0.0313 MiB 1x32 KiB 8-way set associative   L1D$ 24 KiB 24,576 B 0.0234 MiB 1x24 KiB 6-way set associative write-back L2$ 512 KiB 0.5 MiB 524,288 B 4.882812e-4 GiB     1x512 KiB 8-way set associative

Memory controller

This processor has no integrated memory controller.

Graphics

This processor has no integrated graphics.

Features

[Edit/Modify Supported Features]

	Supported x86 Extensions & Processor Features
	MMX MMX Extension EMMX Extended MMX Extension SSE Streaming SIMD Extensions SSE2 Streaming SIMD Extensions 2 SSE3 Streaming SIMD Extensions 3 SSSE3 Supplemental SSE3 x86-16 16-bit x86 x86-32 32-bit x86 Real Real Mode Protected Protected Mode SMM System Management Mode FPU Integrated x87 FPU NX No-eXecute EIST Enhanced SpeedStep Technology

Die Shot

See also: Bonnell § Silverthorne Die

• 45 nm process
• 9 metal layers
• 47,212,207 transistors
• 3.1 mm x 7.8 mm
• 24.18 mm² die size