From WikiChip
Flip Chip Ball Grid Array
Revision as of 11:05, 6 October 2025 by 95.24.58.111 (talk) (→‎μFCBGA)

TI's 288GTS package footprint - a 288-ball FCBGA package

Flip Chip Ball Grid Array (FCBGA or simply Flip-chip BGA) is a mid-cost, high-performance, semiconductor packaging solution that utilizes the controlled collapse chip connection technology, also known as flip chip, for its die to substrate interconnection. FCBGA provides the design flexibility for much higher signal density and functionality into a smaller die and packaging footprint. FCBGA packaging is attractive where performance is more important than cost. Flip-chip BGA packages can be mounted using standard printed circuit boards and can be replaced using existing standard repair practices.

Typical Flip Chip BGA Package (Cross-Sectional View)

Today most flip-chip BGA packages are assembled on two-metal layer or multi-layered, high density ceramic substrates or organic laminate. Additionally FCBGA packages are often offered in bare die, flat lid, and full lid configuration. They are used extensively ASIC, DSP, and various other high performance applications.

FCBGA packages is used in all main semiconductor manufacturers such as in the latest Intel's Core i7, Texas Instruments custom ASICs, and Freescale processors.


μFCBGA

μFCBGA or micro-FCBGA is a line of fcBGA packages that ships with Intel's line of processors.

BGA/FCBGA

PackageFCBGA-437 (FCBGA)
Dimension22 mm x 22 mm x 1.6 mm
Pin Count437
SocketBGA-437 (BGA)
PackageFCBGA-441 (FCBGA)
Dimension13 mm x 14 mm
Pin Count441
SocketBGA-441 (BGA)
PackageFCBGA-518 (FCBGA)
Dimension13.8 mm x 13.8 mm x 1.1 mm
Pin Count518
SocketBGA-518 (BGA)
PackageFCBGA-1023 (BGA)
Dimension31 mm x 24 mm
Pitch0.65 mm
Contacts1023
PackageFCBGA-1090 (BGA)
Dimension25 mm x 24 mm
Contacts1090
PackageFCBGA-1224 (BGa)
Dimension31 mm x 24 mm
Pitch0.65 mm
Contacts1224
PackageBGA-1288 (BGA)BGA-1288.svg
Dimension34 mm x 28 mm x 2.1 mm
Pitch0.7 mm
Pin Count1288
PackageFCBGA-1310 (BGA)
Dimension34 mm x 28 mm
Ball Count1310
Ball CompSAC405
InterconnectBGA-1310
PackageFCBGA-1356 (BGA)
Dimension42 mm x 24 mm x 1.3 mm
Pitch0.65 mm
Ball Count1356
Ball CompSAC405
InterconnectBGA-1356
PackageFCBGA-1364 (BGA)
Dimension37.4 mm x 32 mm
Pitch0.7 mm
Ball Count1364
Ball CompSAC405
InterconnectBGA-1364
PackageFCBGA-1440 (BGA)
Dimension42 mm x 28 mm x 1.49 mm
Pitch0.65 mm
Ball Count1440
Ball CompSAC405
InterconnectBGA-1440
PackageFCBGA-1528 (BGA)
Dimension46 mm x 24 mm x 1.3 mm
Ball Count1528
Ball CompSAC405
InterconnectBGA-1528
PackageFCBGA-2518 (BGA)
Dimension45 mm x 52.5 mm
Contacts2518


LGA/FCLGA

PackageFCLGA-1151 (LGA)
FC-LGA14C		FCLGA-1151.svg
Dimension37.5 mm x 37.5 mm x 4.4 mm
Pitch0.914 mm
Contacts1151
SocketLGA-1151
PackageFCLGA-1155 (LGA)125px
Dimension37.5 mm x 37.5 mm
Contacts1155
SocketLGA-1155
PackageFCLGA-8 (LGA)FCLGA-8.svg
Dimension49.1 mm x 56.4 mm x 4.2 mm
Pitch1 mm
Pin Count1567
SocketLGA-1567


PGA/FCPGA

• Socket G1 (rPGA 988A) • Mobile Core i (Gen 1), Pentium, Celeron • Socket G2 (rPGA 988B) • Mobile Core i (Gen 2/3), Pentium, Celeron • Socket G3 (rPGA 946) • Mobile Core i (Gen 4), Pentium, Celeron

PackagerPGA-988A (rPGA)rPGA988A.svg
Dimension36 mm x 35 mm x 2.12 mm
Pitch1 mm
Pin Count988
SocketSocket-G1 (PGA)
PackagerPGA988B (PGA)
Dimension37.5 mm x 37.5 mm
Pitch1 mm
Contacts988
SocketSocket G2
  • FCPGA-946 (PGA) • rPGA-946B/947 (FCPGA-1364)
PackageFCPGA-946 (PGA)
Dimension37.5 mm x 37.5 mm
Pitch1.0 mm
Pins946
InterconnectrPGA-946B/947


BGA CPU Packages

AMD BGA Packages

List of AMD CPU sockets
BGA CPU Packages
GeneralDetails
NamePackageContactsTDPSocketµarchMarketRelease
Package ASB1ASB1, BGA-81281218 W
18,000 mW
0.0241 hp
0.018 kW
K8Mobile8 January 2009
Package ASB2ASB2, BGA-81281215 W
15,000 mW
0.0201 hp
0.015 kW
K10Mobile12 May 2010
Package CBGA-360CBGA-36036011 W
11,000 mW
0.0148 hp
0.011 kW
K6Mobile5 March 1998
Package FP2BGA-827, FP282725 W
25,000 mW
0.0335 hp
0.025 kW
PiledriverMobile, Embedded15 May 2012
Package FP3BGA-854, FP385435 W
35,000 mW
0.0469 hp
0.035 kW
SteamrollerMobile, EmbeddedJune 2014
Package FP4BGA-968, FP496845 W
45,000 mW
0.0603 hp
0.045 kW
ExcavatorMobile, EmbeddedJune 2015
Package FP5BGA-11401,14045 W
45,000 mW
0.0603 hp
0.045 kW
Zen, Zen+Mobile, Embedded8 January 2018
Package FP6BGA-11401,14055 W
55,000 mW
0.0738 hp
0.055 kW
Zen 2, Zen 3Mobile, Embedded16 March 2020
Package FT1BGA-413, UOB-41341318 W
18,000 mW
0.0241 hp
0.018 kW
BobcatMobile, Embedded4 January 2011
Package FT3BGA-76976925 W
25,000 mW
0.0335 hp
0.025 kW
JaguarMobile, EmbeddedMay 2013
Package FT3bBGA-76976925 W
25,000 mW
0.0335 hp
0.025 kW
PumaMobile, Embedded4 June 2014
Package FT4BGA-76976915 W
15,000 mW
0.0201 hp
0.015 kW
ExcavatorMobileJune 2016
Package OBGA-349OBGA-34934918 W
18,000 mW
0.0241 hp
0.018 kW
K6Embedded25 September 2000
Package SP1BGA-10211,02132 W
32,000 mW
0.0429 hp
0.032 kW
Cortex-A57Embedded, ServerJanuary 2016
Package SP4BGA-20282,028100 W
100,000 mW
0.134 hp
0.1 kW
ZenEmbedded21 February 2018
Package SP4r2BGA-20282,02855 W
55,000 mW
0.0738 hp
0.055 kW
ZenEmbedded21 February 2018

Intel BGA Packages

  • FCBGA-1377 • Ice Lake Y
  • FCBGA-1392 • Cannon Lake Y
  • FCBGA-1440 (42 x 28 mm) • Coffee Lake H, HR
  • FCBGA-1510 • Cannon Lake U
  • FCBGA-1515 (20 x 16.5 mm) • Amber Lake Y
  • FCBGA-1526 (50 x 25 mm) • Ice Lake U
  • FCBGA-1528 • Whiskey Lake U
  • FCBGA-1667 (37.5 x 37.5 mm) • Broadwell DE, Hewitt Lake
  • FCBGA-2579 • Ice Lake D
  • FCBGA-3325 (60 x 60 mm) • Intel Nervana
  • FCBGA-5903 • Cascade Lake AP

LGA

  • FCLGA-1151 • FCLGA14C (37.5 x 37.5 mm) • Coffee Lake S, E
• LGA-1151 • Socket H4
  • FCLGA-1700 (45.0 x 37.5 mm) • Alder Lake S
• LGA-1700 • Socket V
  • FCLGA-2601 (50 x 50 mm) • IBM Power9 Sforza
• PLGA-2601


Intel CPU Packages

Intel CPU Packages
GeneralDetails
PackageNameContactsTDPSocketµarchMarketRelease
FCBGA-437Atom 2304 W
4,000 mW
0.00536 hp
0.004 kW
BGA-437BonnellMobile3 June 2008
FCBGA-437Atom 3308 W
8,000 mW
0.0107 hp
0.008 kW
BGA-437BonnellMobile21 September 2008
FCBGA-437Atom N2702.5 W
2,500 mW
0.00335 hp
0.0025 kW
BGA-437BonnellMobile3 June 2008
FCBGA-437Atom N2802.5 W
2,500 mW
0.00335 hp
0.0025 kW
BGA-437BonnellMobile7 February 2009
FCBGA-441Atom Z5000.65 W
650 mW
8.7165e-4 hp
6.5e-4 kW
BGA-441BonnellMobile2 April 2008
FCBGA-441Atom Z5102 W
2,000 mW
0.00268 hp
0.002 kW
BGA-441BonnellMobile2 April 2008
FCBGA-437Atom Z510P2 W
2,000 mW
0.00268 hp
0.002 kW
BGA-437BonnellMobile2 March 2009
FCBGA-437Atom Z510PT2 W
2,000 mW
0.00268 hp
0.002 kW
BGA-437BonnellMobile2 March 2009
FCBGA-441Atom Z5150.65 W
650 mW
8.7165e-4 hp
6.5e-4 kW
BGA-441BonnellMobile8 April 2009
FCBGA-441Atom Z5202 W
2,000 mW
0.00268 hp
0.002 kW
BGA-441BonnellMobile2 April 2008
FCBGA-437Atom Z520PT2 W
2,000 mW
0.00268 hp
0.002 kW
BGA-437BonnellMobile2 March 2009
FCBGA-441Atom Z5302.2 W
2,200 mW
0.00295 hp
0.0022 kW
BGA-441BonnellMobile2 April 2008
FCBGA-437Atom Z530P2 W
2,000 mW
0.00268 hp
0.002 kW
BGA-437BonnellMobile2 March 2009
FCBGA-441Atom Z5402.4 W
2,400 mW
0.00322 hp
0.0024 kW
BGA-441BonnellMobile2 April 2008
FCBGA-441Atom Z5502.4 W
2,400 mW
0.00322 hp
0.0024 kW
BGA-441BonnellMobile8 April 2009
FCBGA-441Atom Z5602.5 W
2,500 mW
0.00335 hp
0.0025 kW
BGA-441BonnellMobileJune 2010
FCBGA-437, PBGA-441Intel AtomBGABonnell2 April 2008

See also

Retrieved from "https://en.wikichip.org/w/index.php?title=Flip_Chip_Ball_Grid_Array&oldid=103778"
Facts about "Flip Chip Ball Grid Array"
RDF feed
Has subobject
"Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki.
Flip Chip Ball Grid Array#package +
packageFCBGA-437 +, FCBGA-441 +, FCBGA-518 +, FCBGA-1023 +, FCBGA-1090 +, FCBGA-1224 +, BGA-1288 +, FCBGA-1310 +, FCBGA-1356 +, FCBGA-1364 +, FCBGA-1440 +, FCBGA-1528 +, FCBGA-2518 +, FCLGA-1151 +, FCLGA-1155 +, FCLGA-8 +, rPGA-988A +, rPGA988B + and FCPGA-1364 +
socketBGA-437 +, BGA-441 +, BGA-518 +, LGA-1151 +, LGA-1155 + and Socket G2 +