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Helio A22 (MT6762M) - MediaTek
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Helio A22
helio a22.png
General Info
DesignerMediaTek,
ARM Holdings
ManufacturerTSMC
Model NumberHelio A22
Part NumberMT6762M
MarketMobile, Embedded
IntroductionJuly 17, 2018 (announced)
July 17, 2018 (launched)
General Specs
FamilyHelio
SeriesHelio A
Frequency2,000 MHz
Microarchitecture
ISAARMv8 (ARM)
MicroarchitectureCortex-A53
Core NameCortex-A53
Process12 nm
TechnologyCMOS
Word Size64 bit
Cores4
Threads4
Max Memory6 GiB
Multiprocessing
Max SMP1-Way (Uniprocessor)

Helio A22 (MT6762M) is a 64-bit quad-core ARM LTE system on a chip designed by MediaTek and launched in mid-2018. Manufactured on TSMC's 12 nm process, this SoC integrates four Cortex-A53 cores operating at up to GHz and supports up to 6 GiB of dual-channel LPDDR4X-3200 memory. This SoC also incorporates a PowerVR GE8320 IGP. The chip has a modem supporting LTE cat 7 download and cat 13 upload.

Memory controller[edit]

The maximum memory is 4 GiB if LPDDR3 (1x32-bit) is used and 6 GiB if LPDDR4X (2x16-bit) is used.

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeLPDDR4X-3200
Supports ECCNo
Max Mem6 GiB
Controllers1
Channels2
Width16 bit
Max Bandwidth13.9 GiB/s
14,233.6 MiB/s
14.925 GB/s
14,925.011 MB/s
0.0136 TiB/s
0.0149 TB/s
Bandwidth
Single 6.95 GiB/s
Double 13.9 GiB/s

Graphics[edit]

[Edit/Modify IGP Info]

screen icon.svg
Integrated Graphics Information
GPUPowerVR GE8320
DesignerImagination Technologies
OutputDSI
Max Resolution
DSI1600x720
Standards
Direct3D9.3
OpenGL3.0
OpenCL1.2
OpenGL ES3.0
Vulkan1.0
  • Encoding
    • H.264 (1080P @ 30 fps)
  • Decoding
    • H.264, H.265 / HEVC
      • 1080P @ 30 fps

ISP[edit]

  • 21MP, 13+8MP
    • 21MP@30fps; 13MP+8MP@30fps

Connectivity[edit]

  • WiFi
    • Integrated 802.11a/b/g/n/ac
  • Bluetooth 5.0
  • RF Front End
  • LTE Modem
    • Carrier Aggregation (CA), CDMA2000 1x/EVDO Rev. A (SRLTE), FDD / TDD LTE, HSPA+
    • Downlink
      • Cat-7, 300 Mbps
    • Uplink
      • Cat-13, 150 Mbps

Location[edit]

  • GPS
    • Beidou, Galileo, Glonass

Utilizing devices[edit]

  • Nokia 2.3
  • Nokia 2.2
  • Elephone A6 Mini
  • Huawei Y5 2019
  • Infinix hot 8
  • Leagoo M13
  • Ouktel C15 Pro
  • Vivo Y85
  • Xiaomi Redmi 6A
  • Tecno Spark Go
  • Teracube 2e
  • Umdigi A3X
  • Nokia 2 V Tella
  • Xiaomi Redmi A1
  • Xiaomi Redmi A1 Plus

walton This list is incomplete; you can help by expanding it.

Retrieved from "https://en.wikichip.org/w/index.php?title=mediatek/helio/mt6762m&oldid=101198"
Facts about "Helio A22 (MT6762M) - MediaTek"
RDF feed
base frequency2,000 MHz (2 GHz, 2,000,000 kHz) +
core count4 +
core nameCortex-A53 +
designerMediaTek + and ARM Holdings +
familyHelio +
first announcedJuly 17, 2018 +
first launchedJuly 17, 2018 +
full page namemediatek/helio/mt6762m +
has ecc memory supportfalse +
instance ofmicroprocessor +
integrated gpuPowerVR GE8320 +
integrated gpu designerImagination Technologies +
isaARMv8 +
isa familyARM +
ldateJuly 17, 2018 +
main imageFile:helio a22.png +
manufacturerTSMC +
market segmentMobile + and Embedded +
max cpu count1 +
max memory6,144 MiB (6,291,456 KiB, 6,442,450,944 B, 6 GiB, 0.00586 TiB) +
max memory bandwidth13.9 GiB/s (14,233.6 MiB/s, 14.925 GB/s, 14,925.011 MB/s, 0.0136 TiB/s, 0.0149 TB/s) +
max memory channels2 +
microarchitectureCortex-A53 +
model numberHelio A22 +
nameHelio A22 +
part numberMT6762M +
process12 nm (0.012 μm, 1.2e-5 mm) +
seriesHelio A +
smp max ways1 +
supported memory typeLPDDR4X-3200 +
technologyCMOS +
thread count4 +
used byXiaomi Redmi 6A +, Vivo Y85 +, Elephone A6 Mini +, Leagoo M13 +, Ouktel C15 Pro +, Huawei Y5 2019 +, Nokia 2.2 +, Infinix hot 8 +, Tecno Spark Go +, Nokia 2.3 +, Umdigi A3X +, Nokia 2 V Tella +, Teracube 2e +, Xiaomi Redmi A1 Plus + and Xiaomi Redmi A1 +
word size64 bit (8 octets, 16 nibbles) +