This property describes a integrated circuit package type. Examples are:

• Flip-Chip Organic Land Grid Array (FC-OLGA)
• Organic Micro Ball Grid Array
• Ceramic Pin Grid Array (CPGA)

Only an abbreviation may be specified.

See also

• Property:socket
• Property:package
• Property:package type
• Property:package length
• Property:package width
• Property:package height
• Property:package contacts
• Property:package pitch

Pages using the property "package type"

Showing 25 pages using this property.

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A
Socket AM3+ - AMD +	Organic Micro Pin Grid Array  +
Athlon MP 1200 - AMD#package +	OPGA  +
Athlon MP 1500+ - AMD#package +	OPGA  +
Athlon MP 1600+ - AMD#package +	OPGA  +
Athlon MP 1800+ - AMD#package +	OPGA  +
Athlon MP 1900+ - AMD#package +	OPGA  +
Athlon MP 2000+ - AMD#package +	OPGA  +
Athlon MP 2000+ - AMD#package +	OPGA  +
Athlon MP 2000+ - AMD#package +	OPGA  +
Athlon MP 2100+ - AMD#package +	OPGA  +
Athlon MP 2200+ - AMD#package +	OPGA  +
Athlon MP 2400+ - AMD#package +	OPGA  +
Athlon MP 2400+ - AMD#package +	OPGA  +
Athlon MP 2600+ - AMD#package +	OPGA  +
Athlon MP 2600+ - AMD#package +	OPGA  +
Athlon MP 2800+ - AMD#package +	OPGA  +
Atom 230 - Intel#package +	FCBGA  +
Atom 330 - Intel#package +	FCBGA  +
Atom C3308 - Intel#package +	BGA  +
Atom C3338 - Intel#package +	BGA  +
Atom C3508 - Intel#package +	BGA  +
Atom C3538 - Intel#package +	BGA  +
Atom C3558 - Intel#package +	BGA  +
Atom C3708 - Intel#package +	BGA  +
Atom C3750 - Intel#package +	BGA  +