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From WikiChip
Property:package pitch
733
U
This quantity specifies the orthogonal distance between electrical contacts (pins, balls, pads) on an integrated circuit package. Different pitches may be specified for the length and width dimension. BGA packages tend to arrange contacts in more complex patterns and may have multiple pitches. Presently only the minimum pitch is expected.
Units:
- 1 mm
- 0.03937007874015748031 in, ″, "
See also[edit]
- Property:socket
- Property:package
- Property:package type
- Property:package length
- Property:package width
- Property:package height
- Property:package contacts
- Property:package pitch
Pages using the property "package pitch"
Showing 1 page using this property.
X | |
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Xeon E7-8870 - Intel#package + | 1 mm 0.0394 in + |
Retrieved from "https://en.wikichip.org/w/index.php?title=Property:package_pitch&oldid=101237#SMWResults"
Facts about "package pitch"
Corresponds to This property is a special property in this wiki. | 1 mm + and 0.03937007874015748031 in, ″, " + |
Has type "Has type" is a predefined property that describes the datatype of a property and is provided by Semantic MediaWiki. | Quantity + |