This property describes a integrated circuit package type. Examples are:

• Flip-Chip Organic Land Grid Array (FC-OLGA)
• Organic Micro Ball Grid Array
• Ceramic Pin Grid Array (CPGA)

Only an abbreviation may be specified.

See also

• Property:socket
• Property:package
• Property:package type
• Property:package length
• Property:package width
• Property:package height
• Property:package contacts
• Property:package pitch

Pages using the property "package type"

Showing 25 pages using this property.

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Am186ER–33VI\W - AMD#package_1 +	TQFP  +
Am186ER–40KC\W - AMD#package_1 +	PQFP  +
Am186ER–40KI\W - AMD#package_1 +	PQFP  +
Am186ER–40VC\W - AMD#package_1 +	TQFP  +
Am186ER–40VI\W - AMD#package_1 +	TQFP  +
Am186ER–50KC\W - AMD#package_1 +	PQFP  +
Am186ER–50KI\W - AMD#package_1 +	PQFP  +
Am186ER–50VC\W - AMD#package_1 +	TQFP  +
Am186ER–50VI\W - AMD#package_1 +	TQFP  +
Am186ESLV–20KC\W - AMD#package_1 +	PQFP  +
Am186ESLV–20VC\W - AMD#package_1 +	TQFP  +
Am186ESLV–25KC\W - AMD#package_1 +	PQFP  +
Am186ESLV–25VC\W - AMD#package_1 +	TQFP  +
Am186ES–20KC\W - AMD#package_1 +	PQFP  +
Am186ES–20KI\W - AMD#package_1 +	PQFP  +
Am186ES–20VC\W - AMD#package_1 +	TQFP  +
Am186ES–25KC\W - AMD#package_1 +	PQFP  +
Am186ES–25KI\W - AMD#package_1 +	PQFP  +
Am186ES–25VC\W - AMD#package_1 +	TQFP  +
Am186ES–33KC\W - AMD#package_1 +	PQFP  +
Am186ES–33VC\W - AMD#package_1 +	TQFP  +
Am186ES–40KC\W - AMD#package_1 +	PQFP  +
Am186ES–40VC\W - AMD#package_1 +	TQFP  +
Socket 940 - AMD +	Ceramic Pin Grid Array  +
Socket AM3 - AMD +	Organic Micro Pin Grid Array  +