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Core i3-2350M - Intel
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Facts about "Core i3-2350M - Intel"
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Core i3-2350M - Intel#package + and Core i3-2350M - Intel#pcie +
base frequency2,300 MHz (2.3 GHz, 2,300,000 kHz) +
bus links4 +
bus rate5,000 MT/s (5 GT/s, 5,000,000 kT/s) +
bus typeDMI 2.0 +
chipsetCougar Point +
clock multiplier23 +
core count2 +
core family6 +
core model42 +
core nameSandy Bridge M +
core steppingJ1 +
core voltage (max)1.52 V (15.2 dV, 152 cV, 1,520 mV) +
core voltage (min)0.3 V (3 dV, 30 cV, 300 mV) +
cpuid0x206A7 +
designerIntel +
device id0x116 +
die area149 mm² (0.231 in², 1.49 cm², 149,000,000 µm²) +
familyCore i3 +
first announcedOctober 2011 +
first launchedOctober 2011 +
full page nameintel/core i3/i3-2350m +
has 4g supporttrue +
has advanced vector extensionstrue +
has ecc memory supportfalse +
has extended page tables supporttrue +
has featureAdvanced Vector Extensions +, Hyper-Threading Technology +, Enhanced SpeedStep Technology +, Intel VT-x +, Extended Page Tables +, Flex Memory Access +, My WiFi Technology + and Identity Protection Technology +
has intel enhanced speedstep technologytrue +
has intel flex memory access supporttrue +
has intel identity protection technology supporttrue +
has intel my wifi technology supporttrue +
has intel vt-x technologytrue +
has locked clock multipliertrue +
has second level address translation supporttrue +
has simultaneous multithreadingtrue +
has wimax supporttrue +
instance ofmicroprocessor +
integrated gpuHD Graphics 3000 +
integrated gpu base frequency650 MHz (0.65 GHz, 650,000 KHz) +
integrated gpu designerIntel +
integrated gpu execution units12 +
integrated gpu max frequency1,150 MHz (1.15 GHz, 1,150,000 KHz) +
isax86-64 +
isa familyx86 +
l1$ size128 KiB (131,072 B, 0.125 MiB) +
l1d$ description8-way set associative +
l1d$ size64 KiB (65,536 B, 0.0625 MiB) +
l1i$ description8-way set associative +
l1i$ size64 KiB (65,536 B, 0.0625 MiB) +
l2$ description8-way set associative +
l2$ size0.5 MiB (512 KiB, 524,288 B, 4.882812e-4 GiB) +
l3$ description12-way set associative +
l3$ size3 MiB (3,072 KiB, 3,145,728 B, 0.00293 GiB) +
ldateOctober 2011 +
manufacturerIntel +
market segmentMobile +
max cpu count1 +
max junction temperature373.15 K (100 °C, 212 °F, 671.67 °R) +
max memory16,384 MiB (16,777,216 KiB, 17,179,869,184 B, 16 GiB, 0.0156 TiB) +
max memory bandwidth19.87 GiB/s (20,346.88 MiB/s, 21.335 GB/s, 21,335.25 MB/s, 0.0194 TiB/s, 0.0213 TB/s) +
max memory channels2 +
max storage temperature398.15 K (125 °C, 257 °F, 716.67 °R) +
microarchitectureSandy Bridge +
min junction temperature273.15 K (0 °C, 32 °F, 491.67 °R) +
min storage temperature248.15 K (-25 °C, -13 °F, 446.67 °R) +
model numberi3-2350M +
nameCore i3-2350M +
packageFCBGA-1023 + and rPGA988B +
part numberFF8062700995906 + and AV8062700996106 +
platformSandy Bridge M +
power dissipation (idle)3.1 W (3,100 mW, 0.00416 hp, 0.0031 kW) +
process32 nm (0.032 μm, 3.2e-5 mm) +
release price$ 225.00 (€ 202.50, £ 182.25, ¥ 23,249.25) +
s-specSR0DN + and SR0DQ +
seriesi3-2000 +
smp max ways1 +
socketSocket G2 +
supported memory typeDDR3-1333 + and DDR3-1066 +
tdp35 W (35,000 mW, 0.0469 hp, 0.035 kW) +
technologyCMOS +
thread count4 +
transistor count624,000,000 +
word size64 bit (8 octets, 16 nibbles) +