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TSARLET - Microarchitectures - CEA Leti
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Revision as of 02:13, 29 February 2020 by David (talk | contribs)

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TSARLET µarch
General Info
Arch TypeCPU
DesignerCEA-Leti
ManufacturerSTMicroelectronics
Process28 nm, 65 nm
Core Configs96
Pipeline
TypeScalar, Single-issue
OoOENo
SpeculativeNo
Reg RenamingNo
Stages5
Decode1-way
Instructions
ISAMIPS32v1
Cache
L1I Cache16 KiB/core
L1D Cache16 KiB/core
L2 Cache256 KiB/core
L3 Cache1 MiB/core

TSARLET is a large-scale high-performance 3D stacked chiplets-based SoC technology demonstration by CEA-Leti. The project comprised 96 MIPS cores built using 6 chiplets 3D stack on an active interposer in order to demonstarte in-package silicon scale-out capabilities with superior inter-chip capabilities while reducing the overall power and production cost.

codenameTSARLET +
core count96 +
designerCEA-Leti +
full page namecea-leti/microarchitectures/tsarlet +
instance ofmicroarchitecture +
instruction set architectureMIPS32v1 +
manufacturerSTMicroelectronics +
microarchitecture typeCPU +
nameTSARLET +
pipeline stages5 +
process28 nm (0.028 μm, 2.8e-5 mm) + and 65 nm (0.065 μm, 6.5e-5 mm) +