Edit Values | |
Pixel Visual Core | |
General Info | |
Designer | |
Manufacturer | TSMC |
Part Number | X726C502 |
S-Spec | SR3HX |
Market | Mobile, Embedded |
Introduction | October 17, 2017 (announced) October 17, 2017 (launched) |
Microarchitecture | |
ISA | vISA, pISA |
Process | 28 nm |
Technology | CMOS |
Electrical | |
TDP | 8 W |
Pixel Visual Core (PVC) is an advanced image processing unit custom designed by Google introduced in late 2017 for their Pixel 2 smartphone and future IoT applications. Designed by Google and fabricated by TSMC on their 28HPM process, the IPU is a fully-programmable domain-specific processor designed from the ground-up in order to deliver the highest performance at low power.
Contents
Overview
The pixel visual core is designed as a co-processor for various consumer products. Although it's currently only used in the Pixel 2 smartphone, Google have plans to use it in other IoT products in the future. The chip itself incorporates a dedicate ARM Cortex-A53 core which handles the application-level resource requests and configures the core to handle the specific workload. For example, if the application sends a request to capture an image using HDR+, the management core will reconfigure the processing units such that an image captured by the camera will get processed and transformed into HDR+ format. The PVC is optimized for high performance by racing to sleep with a power budget of 6-8 W for very short bursts for around 10-20 seconds an dropping back down to milliwatt when idle. The chip relies equally on both hardware and software in order to achieve the high performance and efficiency by using TensorFlow for machine learning and Halide for image processing.
Die
Floorplan
Die
- TSMC 28nm 28HPM process
designer | Google + |
first announced | October 17, 2017 + |
first launched | October 17, 2017 + |
full page name | google/pixel visual core + |
isa | vISA + and pISA + |
ldate | October 17, 2017 + |
manufacturer | TSMC + |
market segment | Mobile + and Embedded + |
name | Pixel Visual Core + |
part number | X726C502 + |
process | 28 nm (0.028 μm, 2.8e-5 mm) + |
s-spec | SR3HX + |
tdp | 8 W (8,000 mW, 0.0107 hp, 0.008 kW) + |
technology | CMOS + |