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Core M3-7Y30 - Intel
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Core M3-7Y30
kaby lake y (front).png
General Info
DesignerIntel
ManufacturerIntel
Model NumberM3-7Y30
Part NumberHE8067702739824
S-SpecSR2ZY, SR347
MarketMobile
IntroductionAugust 30, 2016 (announced)
August 30, 2016 (launched)
Release Price$281.00
ShopAmazon
General Specs
FamilyCore M3
Seriesm3-7Y
LockedYes
Frequency1,000 MHz
Turbo FrequencyYes
Turbo Frequency2,600 MHz (1 core)
Bus typeOPI
Bus rate4 GT/s
Clock multiplier10
Microarchitecture
ISAx86-64 (x86)
MicroarchitectureKaby Lake
PlatformKaby Lake
Core NameKaby Lake Y
Core Family6
Core Model142
Core SteppingH0
Process14 nm
TechnologyCMOS
Word Size64 bit
Cores2
Threads4
Max Memory16 GiB
Multiprocessing
Max SMP1-Way (Uniprocessor)
Electrical
Vcore0.55 V-1.52 V
TDP4.5 W
cTDP down3.75 W
cTDP down frequency600 MHz
cTDP up7 W
cTDP up frequency1,600 MHz
Tjunction0 °C – 100 °C
Tstorage-25 °C – 125 °C
Packaging
PackageFCBGA-1515 (BGA)
Dimension20 mm × 16.5 mm × 0.5 mm
Pitch0.4 mm
Contacts1515

Core M3-7Y30 is a 64-bit dual-core low-end performance ultra-low power x86 mobile microprocessor introduced by Intel in mid-2016. This chip, which is based on the Kaby Lake microarchitecture, is fabricated on Intel's 14nm+ process. The M3-7Y30 operates at 1 GHz with a TDP of 4.5 W supporting a Turbo Boost frequency of 2.6 GHz. The processor supports up to 16 GiB of dual-channel non-ECC LPDDR3-1866 memory and incorporates Intel's HD Graphics 615 IGP operating at 300 MHz with a burst frequency of 900 MHz.

This specific model has a configurable TDP-down of 3.75 W with a frequency of 600 MHz and a configurable TDP-up of 7 W with a frequency of 1.6 GHz.

Cache

Main article: Kaby Lake § Cache

[Edit/Modify Cache Info]

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Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.
L1$128 KiB
131,072 B
0.125 MiB
L1I$64 KiB
65,536 B
0.0625 MiB
2x32 KiB8-way set associative 
L1D$64 KiB
65,536 B
0.0625 MiB
2x32 KiB8-way set associativewrite-back
L2$512 KiB
0.5 MiB
524,288 B
4.882812e-4 GiB
  2x256 KiB4-way set associativewrite-back
L3$4 MiB
4,096 KiB
4,194,304 B
0.00391 GiB
  2x2 MiB12-way set associativewrite-back

Memory controller

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeDDR3L-1600, LPDDR3-1866
Supports ECCNo
Max Mem16 GiB
Controllers1
Channels2
Max Bandwidth27.81 GiB/s
28,477.44 MiB/s
29.861 GB/s
29,860.76 MB/s
0.0272 TiB/s
0.0299 TB/s
Bandwidth
Single 13.9 GiB/s
Double 27.81 GiB/s

Expansions

[Edit/Modify Expansions Info]

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Expansion Options
PCIe
Revision3.0
Max Lanes10
Configs1x4, 2x2, 1x2+2x1, 4x1


Graphics

[Edit/Modify IGP Info]

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Integrated Graphics Information
GPUHD Graphics 615
DesignerIntelDevice ID0x591E
Execution Units24Max Displays3
Max Memory16 GiB
16,384 MiB
16,777,216 KiB
17,179,869,184 B
Frequency300 MHz
0.3 GHz
300,000 KHz
Burst Frequency900 MHz
0.9 GHz
900,000 KHz
OutputDP, eDP, HDMI, DVI
Max Resolution
HDMI4096x2304 @24 Hz
DP4096x2304 @60 Hz
eDP4096x2304 @60 Hz
Standards
DirectX12
OpenGL4.4
OpenCL2.0
DP1.2
eDP1.4
HDMI1.4a
Additional Features
Intel Quick Sync Video
Intel InTru 3D
Intel Clear Video
Intel Clear Video HD

Features

[Edit/Modify Supported Features]

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Supported x86 Extensions & Processor Features
MMXMMX Extension
EMMXExtended MMX Extension
SSEStreaming SIMD Extensions
SSE2Streaming SIMD Extensions 2
SSE3Streaming SIMD Extensions 3
SSSE3Supplemental SSE3
SSE4.1Streaming SIMD Extensions 4.1
SSE4.2Streaming SIMD Extensions 4.2
SSE4aStreaming SIMD Extensions 4a
AVXAdvanced Vector Extensions
AVX2Advanced Vector Extensions 2
ABMAdvanced Bit Manipulation
BMI1Bit Manipulation Instruction Set 1
BMI2Bit Manipulation Instruction Set 2
FMA33-Operand Fused-Multiply-Add
AESAES Encryption Instructions
RdRandHardware RNG
ADXMulti-Precision Add-Carry
CLMULCarry-less Multiplication Extension
F16C16-bit Floating Point Conversion
x86-1616-bit x86
x86-3232-bit x86
x86-6464-bit x86
RealReal Mode
ProtectedProtected Mode
SMMSystem Management Mode
FPUIntegrated x87 FPU
NXNo-eXecute
HTHyper-Threading
TBT 2.0Turbo Boost Technology 2.0
EISTEnhanced SpeedStep Technology
SSTSpeed Shift Technology
VT-xVT-x (Virtualization)
VT-dVT-d (I/O MMU virtualization)
EPTExtended Page Tables (SLAT)
MPXMemory Protection Extensions
SGXSoftware Guard Extensions
Secure KeySecure Key Technology
SMEPOS Guard Technology
Flex MemoryFlex Memory Access
ISRTSmart Response Technology
MWTMy WiFi Technology
Retrieved from "https://en.wikichip.org/w/index.php?title=intel/core_m/m3-7y30&oldid=81876"
Facts about "Core M3-7Y30 - Intel"
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Has subobject
"Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki.
Core M3-7Y30 - Intel#io +
base frequency1,000 MHz (1 GHz, 1,000,000 kHz) +
bus rate4,000 MT/s (4 GT/s, 4,000,000 kT/s) +
bus typeOPI +
clock multiplier10 +
core count2 +
core family6 +
core model142 +
core nameKaby Lake Y +
core steppingH0 +
core voltage (max)1.52 V (15.2 dV, 152 cV, 1,520 mV) +
core voltage (min)0.55 V (5.5 dV, 55 cV, 550 mV) +
designerIntel +
device id0x591E +
familyCore M3 +
first announcedAugust 30, 2016 +
first launchedAugust 30, 2016 +
full page nameintel/core m/m3-7y30 +
has advanced vector extensionstrue +
has advanced vector extensions 2true +
has ecc memory supportfalse +
has extended page tables supporttrue +
has featureAdvanced Vector Extensions +, Advanced Vector Extensions 2 +, Advanced Encryption Standard Instruction Set Extension +, Hyper-Threading Technology +, Turbo Boost Technology 2.0 +, Enhanced SpeedStep Technology +, Speed Shift Technology +, Intel VT-x +, Intel VT-d +, Extended Page Tables +, Memory Protection Extensions +, Software Guard Extensions +, Secure Key Technology +, OS Guard +, Flex Memory Access +, Smart Response Technology + and My WiFi Technology +
has intel enhanced speedstep technologytrue +
has intel flex memory access supporttrue +
has intel my wifi technology supporttrue +
has intel secure key technologytrue +
has intel smart response technology supporttrue +
has intel speed shift technologytrue +
has intel supervisor mode execution protectiontrue +
has intel turbo boost technology 2 0true +
has intel vt-d technologytrue +
has intel vt-x technologytrue +
has locked clock multipliertrue +
has second level address translation supporttrue +
has simultaneous multithreadingtrue +
has x86 advanced encryption standard instruction set extensiontrue +
instance ofmicroprocessor +
integrated gpuHD Graphics 615 +
integrated gpu base frequency300 MHz (0.3 GHz, 300,000 KHz) +
integrated gpu designerIntel +
integrated gpu execution units24 +
integrated gpu max frequency900 MHz (0.9 GHz, 900,000 KHz) +
integrated gpu max memory16,384 MiB (16,777,216 KiB, 17,179,869,184 B, 16 GiB) +
isax86-64 +
isa familyx86 +
l1$ size128 KiB (131,072 B, 0.125 MiB) +
l1d$ description8-way set associative +
l1d$ size64 KiB (65,536 B, 0.0625 MiB) +
l1i$ description8-way set associative +
l1i$ size64 KiB (65,536 B, 0.0625 MiB) +
l2$ description4-way set associative +
l2$ size0.5 MiB (512 KiB, 524,288 B, 4.882812e-4 GiB) +
l3$ description12-way set associative +
l3$ size4 MiB (4,096 KiB, 4,194,304 B, 0.00391 GiB) +
ldateAugust 30, 2016 +
main imageFile:kaby lake y (front).png +
manufacturerIntel +
market segmentMobile +
max cpu count1 +
max junction temperature373.15 K (100 °C, 212 °F, 671.67 °R) +
max memory16,384 MiB (16,777,216 KiB, 17,179,869,184 B, 16 GiB, 0.0156 TiB) +
max memory bandwidth27.81 GiB/s (28,477.44 MiB/s, 29.861 GB/s, 29,860.76 MB/s, 0.0272 TiB/s, 0.0299 TB/s) +
max memory channels2 +
max pcie lanes10 +
max storage temperature398.15 K (125 °C, 257 °F, 716.67 °R) +
microarchitectureKaby Lake +
min junction temperature273.15 K (0 °C, 32 °F, 491.67 °R) +
min storage temperature248.15 K (-25 °C, -13 °F, 446.67 °R) +
model numberM3-7Y30 +
nameCore M3-7Y30 +
packageFCBGA-1515 +
part numberHE8067702739824 +
platformKaby Lake +
process14 nm (0.014 μm, 1.4e-5 mm) +
release price$ 281.00 (€ 252.90, £ 227.61, ¥ 29,035.73) +
s-specSR2ZY + and SR347 +
seriesm3-7Y +
smp max ways1 +
supported memory typeDDR3L-1600 + and LPDDR3-1866 +
tdp4.5 W (4,500 mW, 0.00603 hp, 0.0045 kW) +
tdp down3.75 W (3,750 mW, 0.00503 hp, 0.00375 kW) +
tdp down frequency600 MHz (0.6 GHz, 600,000 kHz) +
tdp up7 W (7,000 mW, 0.00939 hp, 0.007 kW) +
tdp up frequency1,600 MHz (1.6 GHz, 1,600,000 kHz) +
technologyCMOS +
thread count4 +
turbo frequency (1 core)2,600 MHz (2.6 GHz, 2,600,000 kHz) +
word size64 bit (8 octets, 16 nibbles) +
x86/has memory protection extensionstrue +
x86/has software guard extensionstrue +