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Core M3-7Y30 - Intel
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Revision as of 00:58, 7 January 2017 by David (talk | contribs) (updated memory controller)

Template:mpu Core M3-7Y30 is a 64-bit dual-core low-end performance x86 mobile microprocessor introduced by Intel in mid-2016. This chip, which is based on the Kaby Lake microarchitecture, is fabricated on Intel's 14nm+ process. The M3-7Y30 operates at 1 GHz with a TDP of 4.5 W supporting a Turbo Boost frequency of 2.6 GHz. The processor supports up to 16 GiB of dual-channel non-ECC LPDDR3-1866 memory and incorporates Intel's HD Graphics 615 IGP operating at 300 MHz with a burst frequency of 900 MHz.

Cache

Main article: Kaby Lake § Cache

[Edit/Modify Cache Info]

hierarchy icon.svg
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.
L1$128 KiB
131,072 B
0.125 MiB
L1I$64 KiB
65,536 B
0.0625 MiB
2x32 KiB8-way set associativewrite-back
L1D$64 KiB
65,536 B
0.0625 MiB
2x32 KiB8-way set associativewrite-back
L2$512 KiB
0.5 MiB
524,288 B
4.882812e-4 GiB
  2x256 KiB4-way set associativewrite-back
L3$4 MiB
4,096 KiB
4,194,304 B
0.00391 GiB
  2x2 MiB12-way set associativewrite-back

Memory controller

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeDDR3L-1600, LPDDR3-1866
Supports ECCNo
Max Mem16 GiB
Controllers1
Channels2
Max Bandwidth27.81 GiB/s
28,477.44 MiB/s
29.861 GB/s
29,860.76 MB/s
0.0272 TiB/s
0.0299 TB/s
Bandwidth
Single 13.9 GiB/s
Double 27.81 GiB/s

Graphics

Integrated Graphic Information
GPU Intel HD Graphics 615
Device ID 0x591E
Execution Units 24
Displays 3
Frequency 300 MHz
0.3 GHz
300,000 KHz
Max frequency 900 MHz
0.9 GHz
900,000 KHz
Max memory 16 GB
"GB" is not declared as a valid unit of measurement for this property.
Output DisplayPort, Embedded DisplayPort, HDMI, DVI
DirectX 12
OpenGL 4.4
OpenCL 2.0
HDMI 1.4a
DP 1.2
eDP 1.3
Max HDMI Res 4096x2304 @24 Hz
Max DP Res 3840x2160 @60 Hz, 2880x1800 @60 Hz
Max eDP Res 3840x2160 @60 Hz, 3840x2160 @60 Hz
Intel Quick Sync Video
Intel InTru 3D
Intel Insider
Intel WiDi (Wireless Display)
Intel Clear Video

Expansions

Template:mpu expansions

Features

Template:mpu features

Retrieved from "https://en.wikichip.org/w/index.php?title=intel/core_m/m3-7y30&oldid=33339"
Facts about "Core M3-7Y30 - Intel"
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Core M3-7Y30 - Intel#io +
base frequency1,000 MHz (1 GHz, 1,000,000 kHz) +
bus rate4,000 MT/s (4 GT/s, 4,000,000 kT/s) +
bus typeOPI +
clock multiplier10 +
core count2 +
core family6 +
core model142 +
core nameKaby Lake Y +
core steppingH0 +
core voltage (max)1.52 V (15.2 dV, 152 cV, 1,520 mV) +
core voltage (min)0.55 V (5.5 dV, 55 cV, 550 mV) +
designerIntel +
device id0x591E +
familyCore M3 +
first announcedAugust 30, 2016 +
first launchedAugust 30, 2016 +
full page nameintel/core m/m3-7y30 +
has advanced vector extensionstrue +
has advanced vector extensions 2true +
has ecc memory supportfalse +
has extended page tables supporttrue +
has featureAdvanced Vector Extensions +, Advanced Vector Extensions 2 +, Advanced Encryption Standard Instruction Set Extension +, Hyper-Threading Technology +, Turbo Boost Technology 2.0 +, Enhanced SpeedStep Technology +, Speed Shift Technology +, Intel VT-x +, Intel VT-d +, Extended Page Tables +, Memory Protection Extensions +, Software Guard Extensions +, Secure Key Technology +, OS Guard +, Flex Memory Access +, Smart Response Technology + and My WiFi Technology +
has intel enhanced speedstep technologytrue +
has intel flex memory access supporttrue +
has intel my wifi technology supporttrue +
has intel secure key technologytrue +
has intel smart response technology supporttrue +
has intel speed shift technologytrue +
has intel supervisor mode execution protectiontrue +
has intel turbo boost technology 2 0true +
has intel vt-d technologytrue +
has intel vt-x technologytrue +
has locked clock multipliertrue +
has second level address translation supporttrue +
has simultaneous multithreadingtrue +
has x86 advanced encryption standard instruction set extensiontrue +
instance ofmicroprocessor +
integrated gpuHD Graphics 615 +
integrated gpu base frequency300 MHz (0.3 GHz, 300,000 KHz) +
integrated gpu designerIntel +
integrated gpu execution units24 +
integrated gpu max frequency900 MHz (0.9 GHz, 900,000 KHz) +
integrated gpu max memory16,384 MiB (16,777,216 KiB, 17,179,869,184 B, 16 GiB) +
isax86-64 +
isa familyx86 +
l1$ size128 KiB (131,072 B, 0.125 MiB) +
l1d$ description8-way set associative +
l1d$ size64 KiB (65,536 B, 0.0625 MiB) +
l1i$ description8-way set associative +
l1i$ size64 KiB (65,536 B, 0.0625 MiB) +
l2$ description4-way set associative +
l2$ size0.5 MiB (512 KiB, 524,288 B, 4.882812e-4 GiB) +
l3$ description12-way set associative +
l3$ size4 MiB (4,096 KiB, 4,194,304 B, 0.00391 GiB) +
ldateAugust 30, 2016 +
main imageFile:kaby lake y (front).png +
manufacturerIntel +
market segmentMobile +
max cpu count1 +
max junction temperature373.15 K (100 °C, 212 °F, 671.67 °R) +
max memory16,384 MiB (16,777,216 KiB, 17,179,869,184 B, 16 GiB, 0.0156 TiB) +
max memory bandwidth27.81 GiB/s (28,477.44 MiB/s, 29.861 GB/s, 29,860.76 MB/s, 0.0272 TiB/s, 0.0299 TB/s) +
max memory channels2 +
max pcie lanes10 +
max storage temperature398.15 K (125 °C, 257 °F, 716.67 °R) +
microarchitectureKaby Lake +
min junction temperature273.15 K (0 °C, 32 °F, 491.67 °R) +
min storage temperature248.15 K (-25 °C, -13 °F, 446.67 °R) +
model numberM3-7Y30 +
nameCore M3-7Y30 +
packageFCBGA-1515 +
part numberHE8067702739824 +
platformKaby Lake +
process14 nm (0.014 μm, 1.4e-5 mm) +
release price$ 281.00 (€ 252.90, £ 227.61, ¥ 29,035.73) +
s-specSR2ZY + and SR347 +
seriesm3-7Y +
smp max ways1 +
supported memory typeDDR3L-1600 + and LPDDR3-1866 +
tdp4.5 W (4,500 mW, 0.00603 hp, 0.0045 kW) +
tdp down3.75 W (3,750 mW, 0.00503 hp, 0.00375 kW) +
tdp down frequency600 MHz (0.6 GHz, 600,000 kHz) +
tdp up7 W (7,000 mW, 0.00939 hp, 0.007 kW) +
tdp up frequency1,600 MHz (1.6 GHz, 1,600,000 kHz) +
technologyCMOS +
thread count4 +
turbo frequency (1 core)2,600 MHz (2.6 GHz, 2,600,000 kHz) +
word size64 bit (8 octets, 16 nibbles) +
x86/has memory protection extensionstrue +
x86/has software guard extensionstrue +