Template:mpu Helio X10 (MT6795T t for turbo) is a 64-bit octa-core ARM LTE system on a chip designed by MediaTek and introduced in early-2014. This SoC, which incorporates eight Cortex-A53 cores and is manufactured on TSMC's 28 nm process, operates at up to 2.2 GHz and supports dual-channel LPDDR3-933. This chip incorporates the PowerVR G6200 IGP operating at 700 MHz. This SoC has a modem supporting LTE User Equipment (UE) category 4. This "turbo" variant of the X10 operates at 10% higher frequency.

This SoC is made of 2 clusters of 4-core each (Cortex-A53) linked together via a CCI-400, a NEON engine, and Cortex-R4 core for the second MCU subsystem.

Cache

Main article: Cortex-A53 § Cache

[Edit/Modify Cache Info]

Cache Organization Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory. The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC. Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies. Note: All units are in kibibytes and mebibytes.

L1$ 512 KiB 524,288 B 0.5 MiB L1I$ 256 KiB 262,144 B 0.25 MiB 8x32 KiB 2-way set associative   L1D$ 256 KiB 262,144 B 0.25 MiB 8x32 KiB 4-way set associative   L2$ 2 MiB 2,048 KiB 2,097,152 B 0.00195 GiB     2x1 MiB 16-way set associative

Memory controller

[Edit/Modify Memory Info]

	Integrated Memory Controller
	Max Type DDR3-933 Supports ECC No Max Mem 4 GiB Controllers 1 Channels 2 Max Bandwidth 13.9 GiB/s 14,233.6 MiB/s 14.925 GB/s 14,925.011 MB/s 0.0136 TiB/s 0.0149 TB/s Bandwidth Single 6.95 GiB/s Double 13.9 GiB/s

Expansions

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	Expansion Options
	USB Revision 2.0, 3.0 Ports 8 UART GP I/O Yes

Graphics

[Edit/Modify IGP Info]

	Integrated Graphics Information
	GPU PowerVR G6200 Designer Imagination Technologies Max Displays 2 Frequency 700 MHz 0.7 GHz 700,000 KHz Output DSI Max Resolution DSI 2560x1600 Standards Direct3D 10.0 OpenGL 3.2 OpenCL 1.2 Vulkan 1.0

• OpenGL ES 3.0 3D graphic accelerator capable of processing 175M tri/sec and 2,800M pixel/sec @ 700 MHz
• OpenVG 1.1 vector graphics accelerator

Wireless

Wireless Communications
Cellular
2G	CSD   Yes GSM   Yes GPRS   Yes EDGE   Yes
3G	UMTS TD-SCDMA Yes DC-HSDPA Yes HSUPA Yes
4G	LTE Advanced E-UTRAN Yes UE Cat 4

Image

• Integrated image signal processor supports 20 MP
• Supports image stabilization
• Supports video stabilization
• Supports noise reduction
• Supports lens shading correction
• Supports AE/AWB/AF
• Supports edge enhancement
• Supports face detection and visual tracking
• Hardware JPEG encoder

Video

• HEVC decoder 4k2k @ 30fps
• H.264 decoder (30fps/40Mbps)
• Sorenson H.263/H.263 decoder (1080p @ 60fps/40Mbps)
• MPEG-4 SP/ASP decoder (1080p @ 60fps/40Mbps)
• DIVX4/DIVX5/DIVX6/DIVX HD/XVID decoder (1080p @ 60fps/40Mbps)
• VP8 / VC-1 decoders
• MPEG-4 / H.263 / H.264 / HEVC encoders

Audio

• Audio content sampling rates 8kHz to 192kHz
• Audio content sampling format 8-bit/16-bit/24-bit Mono/Stereo
• I2S, PCM
• Encode: AMR-NB, AMR-WB, AAC, OGG, ADPCM
• Decode: WAV, MP3, MP2, AAC, AMR-NB, AMR-WB, MIDI, Vorbis, APE, AAC-plus v1, AAC-plus v2, FLAC, WMA, ADPCM
• 7.1 channel MHL output

Utilizing devices

• Meizu MX5
• LeEco Le 1s
• Xiaomi Redmi Note 2
• HTC One X9
• HTC One M9+

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