Template:mpu
Helio X10 (MT6795M) is a 64-bit octa-core ARM LTE system on a chip designed by MediaTek and introduced in early-2014. This SoC, which incorporates eight Cortex-A53 cores and is manufactured on TSMC's 28 nm process, operates at up to 2 GHz and supports dual-channel LPDDR3-933. This chip incorporates the PowerVR G6200 IGP operating at 550 MHz. This SoC has a modem supporting LTE User Equipment (UE) category 4.
This SoC is made of 2 clusters of 4-core each (Cortex-A53) linked together via a CCI-400, a NEON engine, and Cortex-R4 core for the second MCU subsystem.
Cache
- Main article: Cortex-A53 § Cache
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Cache Organization Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory. The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC. Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies. Note: All units are in kibibytes and mebibytes.
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L1$ | 512 KiB 524,288 B 0.5 MiB
| L1I$ | 256 KiB 262,144 B 0.25 MiB
| 8x32 KiB | 2-way set associative | |
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L1D$ | 256 KiB 262,144 B 0.25 MiB
| 8x32 KiB | 4-way set associative | |
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| L2$ | 2 MiB 2,048 KiB 2,097,152 B 0.00195 GiB
| | | 2x1 MiB | 16-way set associative | |
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Memory controller
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Integrated Memory Controller
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Max Type | DDR3-933 |
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Supports ECC | No |
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Max Mem | 4 GiB |
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Controllers | 1 |
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Channels | 2 |
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Max Bandwidth | 13.9 GiB/s 14,233.6 MiB/s 14.925 GB/s 14,925.011 MB/s 0.0136 TiB/s 0.0149 TB/s
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Bandwidth |
Single 6.95 GiB/s Double 13.9 GiB/s
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Expansions
Graphics
[Edit/Modify IGP Info]
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Integrated Graphics Information
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GPU | PowerVR G6200 |
Designer | Imagination Technologies |
Max Displays | 2 |
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Frequency | 550 MHz 0.55 GHz 550,000 KHz
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Output | DSI |
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| Max Resolution | |
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| Standards | Direct3D | 10.0 |
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OpenGL | 3.2 | OpenCL | 1.2 | Vulkan | 1.0 |
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- OpenGL ES 3.0 3D graphic accelerator capable of processing 175M tri/sec and 2,800M pixel/sec @ 700 MHz
- OpenVG 1.1 vector graphics accelerator
Wireless
Wireless Communications |
Cellular |
2G | CSD | | Yes | GPRS | | Yes | EDGE | | Yes |
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3G | UMTS | TD-SCDMA | Yes | DC-HSDPA | Yes | HSUPA | Yes | |
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4G | |
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Image
- Integrated image signal processor supports 20 MP
- Supports image stabilization
- Supports video stabilization
- Supports noise reduction
- Supports lens shading correction
- Supports AE/AWB/AF
- Supports edge enhancement
- Supports face detection and visual tracking
- Hardware JPEG encoder
Video
- HEVC decoder 4k2k @ 30fps
- H.264 decoder (30fps/40Mbps)
- Sorenson H.263/H.263 decoder (1080p @ 60fps/40Mbps)
- MPEG-4 SP/ASP decoder (1080p @ 60fps/40Mbps)
- DIVX4/DIVX5/DIVX6/DIVX HD/XVID decoder (1080p @ 60fps/40Mbps)
- VP8 / VC-1 decoders
- MPEG-4 / H.263 / H.264 / HEVC encoders
Audio
- Audio content sampling rates 8kHz to 192kHz
- Audio content sampling format 8-bit/16-bit/24-bit Mono/Stereo
- I2S, PCM
- Encode: AMR-NB, AMR-WB, AAC, OGG, ADPCM
- Decode: WAV, MP3, MP2, AAC, AMR-NB, AMR-WB, MIDI, Vorbis, APE, AAC-plus v1, AAC-plus v2, FLAC, WMA, ADPCM
- 7.1 channel MHL output