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Helio X10 (MT6795) - MediaTek
Template:mpu Helio X10 (MT6795) is a 64-bit octa-core ARM LTE system on a chip designed by MediaTek and introduced in late-2014. This SoC, which incorporates eight Cortex-A53 cores and is manufactured on TSMC's 28 nm process, operates at up to 2 GHz and supports dual-channel LPDDR3-933. This chip incorporates the PowerVR G6200 IGP operating at 700 MHz. This SoC has a modem supporting LTE User Equipment (UE) category 4.
Facts about "Helio X10 (MT6795) - MediaTek"
base frequency | 2,000 MHz (2 GHz, 2,000,000 kHz) + |
bus type | AMBA 4 AXI + |
core count | 8 + |
core name | Cortex-A53 + |
core voltage | 1 V (10 dV, 100 cV, 1,000 mV) + |
designer | MediaTek + and ARM Holdings + |
family | Helio + |
first announced | July 15, 2014 + |
first launched | March 27, 2015 + |
full page name | mediatek/helio/mt6795 + |
has 2g support | true + |
has 3g support | true + |
has 4g support | true + |
has csd support | true + |
has dc-hsdpa support | true + |
has e-utran support | true + |
has ecc memory support | false + |
has edge support | true + |
has gprs support | true + |
has gsm support | true + |
has hsupa support | true + |
has lte advanced support | true + |
has td-scdma support | true + |
has umts support | true + |
instance of | microprocessor + |
integrated gpu | PowerVR G6200 + |
integrated gpu base frequency | 700 MHz (0.7 GHz, 700,000 KHz) + |
integrated gpu designer | Imagination Technologies + |
io voltage | 1.8 V (18 dV, 180 cV, 1,800 mV) +, 2.8 V (28 dV, 280 cV, 2,800 mV) + and 3.3 V (33 dV, 330 cV, 3,300 mV) + |
isa | ARMv8 + |
isa family | ARM + |
l1$ size | 512 KiB (524,288 B, 0.5 MiB) + |
l1d$ description | 4-way set associative + |
l1d$ size | 256 KiB (262,144 B, 0.25 MiB) + |
l1i$ description | 2-way set associative + |
l1i$ size | 256 KiB (262,144 B, 0.25 MiB) + |
l2$ description | 16-way set associative + |
l2$ size | 2 MiB (2,048 KiB, 2,097,152 B, 0.00195 GiB) + |
ldate | March 27, 2015 + |
manufacturer | TSMC + |
market segment | Mobile + and Embedded + |
max cpu count | 1 + |
max junction temperature | 398.15 K (125 °C, 257 °F, 716.67 °R) + |
max memory | 4,096 MiB (4,194,304 KiB, 4,294,967,296 B, 4 GiB, 0.00391 TiB) + |
max memory bandwidth | 13.91 GiB/s (14,243.84 MiB/s, 14.936 GB/s, 14,935.749 MB/s, 0.0136 TiB/s, 0.0149 TB/s) + |
max memory channels | 2 + |
max operating temperature | 80 °C + |
max storage temperature | 398.15 K (125 °C, 257 °F, 716.67 °R) + |
microarchitecture | Cortex-A53 + |
min operating temperature | -20 °C + |
min storage temperature | 273.15 K (0 °C, 32 °F, 491.67 °R) + |
model number | Helio X10 + |
name | MediaTek Helio X10 + |
part number | MT6795 + and MTK6795 + |
process | 28 nm (0.028 μm, 2.8e-5 mm) + |
series | Helio X + |
smp max ways | 1 + |
supported memory type | LPDDR3-1866 + |
technology | CMOS + |
thread count | 8 + |
used by | Meizu Blue Charm Metal +, Meizu MX5E +, HTC Desire 830 +, HTC One S9 +, HTC One ME +, Sony Xperia M5 +, Gionee Elife E8 +, Allview X2 Xtreme +, BLU Pure XL +, Elephone Vowney +, LeEco Le1 X600 +, LeEco Le 1s +, PPTV King 7 +, Xiaomi Redmi Note 2 +, LG G3 +, Xiaomi Redmi Note 3 +, Canvas 6 pro +, Meitu V4 +, Meitu V4S +, Lumigon T3 +, Infinix 552 +, Creo Mark 1 + and AMOI L861 + |
user equipment category | 4 + |
word size | 64 bit (8 octets, 16 nibbles) + |