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Package SP1
General Info
Designer	AMD
Introduction	January 2014 (announced) January 2016 (launched)
Market	Server, Embedded
Microarchitecture	Cortex-A57
TDP	32 W 32,000 mW 0.0429 hp 0.032 kW
Package
Name	BGA-1021
Type	Organic Micro Ball Grid Array
Contacts	1021
Dimension	27 mm 2.7 cm 1.063 in × 27 mm 2.7 cm 1.063 in
Pitch	0.65 mm 0.0256 in

Package SP1 was a BGA-1021 package for AMD server microprocessors codenamed Seattle

with 8x ARM Cortex-A57 CPU cores.

• List of AMD CPU sockets

Features

• 1021-pin lidless micro ball grid array package, 0.65 mm pitch minimum, 27 × 27 mm, organic substrate
• 2× 64/72 bit DDR3 SDRAM interface up to 800 MHz, PC3-12800 (DDR3-1600), 25.6 GB/s or
• 2× 64/72 bit DDR4 SDRAM interface up to 933 MHz, PC4-14900 (DDR4-1866), 29.9 GB/s
  • Up to 4 UDIMMs, RDIMMs, or SODIMMs (2 per channel), ECC supported
  • Up to 128 GB total with RDIMMs

• PCIe Gen 1.0, 2.0, 3.0 (8 GT/s)
  • 8 lanes configurable 1x8, 2x4, 1x4 + 2x2

• Integrated Controller Hub
  • 14× SATA 1.0, 2.0, 3.0 (6 Gb/s)
  • 2× 10 Gigabit Ethernet
  • 1 GbE system management port
  • SPI, UART, I2C, GPIO

Processors using SP1

• AMD Opteron A1100 Series

	List of all SP1-based Processors
Model	Price	Process	Launched	µarch	Family	Core	C	T	Freq	Turbo	TDP
Count: 0

Package Diagram

Approximate dimensions of the Seattle package, Part No. 31667. All dimensions in millimeters.

Pin Map

No data available.

References

• "Product Brief: AMD Opteron™ A1100 SOC Series", PID 158465-B, 2016
• "Hot Chips 26: The AMD Opteron™ A1100 Processor Codenamed "Seattle"", August 11, 2014
• "Introducing the AMD Opteron™ A1100 for the Datacenter", January 2016